JP5341875B2 - レシピおよび部品の制御モジュールならびにその方法 - Google Patents
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4183—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32097—Recipe programming for flexible batch
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/33—Director till display
- G05B2219/33063—Generic coordination, master agent to data manager agent to tasks to active agent
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/33—Director till display
- G05B2219/33068—CCP coordination cooperation protocol, make optimal decisions with other agents
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Manufacturing & Machinery (AREA)
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- Automation & Control Theory (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Plasma & Fusion (AREA)
- General Factory Administration (AREA)
- Testing And Monitoring For Control Systems (AREA)
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Description
異なる製造メーカーが、複数のセンサー104・106・108・110を製造する可能性がある。したがって、複数のセンサーは、大概、異なる時間領域でデータを収集し、互いに通信することができない可能性がある。
Claims (16)
- プラズマ処理システム中でのデータ管理を行うサーバーであって、前記プラズマ処理システムは、複数の部品と接続されまたは接続された状態にあり、前記サーバーは、
複数の知的エージェントであって、前記複数の知的エージェントの各知的エージェントは、前記複数の部品のうちの1つの部品と相互作用するように構成されており、
前記各知的エージェントは、各基準に基づいて、前記部品からデータを受領するように構成され、
前記複数の知的エージェントから処理されたデータを受領するように構成されている調整エージェントを備え、
さらに、臨時エージェントセットを有し、前記臨時エージェントセットは、レシピ管理を行うように構成され、前記レシピ管理は、レシピの少なくとも1部分を、前記複数の知的エージェントおよび前記調整エージェントのうちの少なくとも1つに分配することを特徴とするサーバー。 - 前記複数の知的エージェントの前記各知的エージェントは、前記複数の部品のうちの前記部品のために、構成要件を規定するための知能を有し、前記構成要件は、前記複数の知的エージェントの前記各知的エージェントに、データファイルを送るための基準を含み、前記基準は、前記複数の知的エージェントの前記各知的エージェントで局所的に保存された前記レシピの前記1部分に基づいている請求項1に記載のサーバー。
- 前記複数の知的エージェントに前記データファイルを送る前に、前記複数の部品は、前記データファイルに対して前処理を行うために前記構成要件を用いる請求項2に記載のサーバー。
- 前記複数の知的エージェントの前記各知的エージェントはキャッシュを有し、前記キャッシュが、データラッチを可能にするために少なくとも最新のデータファイルを保存するように構成されている請求項3に記載のサーバー。
- 前記複数の知的エージェントの前記各知的エージェントは、シグネチャデータを生成するために、前記データファイルのデータ分析を行い、前記シグネチャデータは、前記データファイル用の要約データである請求項4に記載のサーバー。
- 前記調整エージェントは、前記複数の知的エージェントの各知的エージェントから、前記シグネチャデータを受領するためのコードを有するように構成され、前記調整エージェントは、複合的なシグネチャを生成するためにデータ分析を行う請求項5に記載のサーバー。
- 前記調整エージェントは、前記複合的なシグネチャに基づいて、前記複数の部品に対して指示を提供するための知能を有する請求項6に記載のサーバー。
- 前記複数の部品は、プロセスモジュール、センサーおよび計測ツールのうちの少なくとも1つを含む請求項7に記載のサーバー。
- 前記サーバーは、前記プラズマ処理システムに対する変更を特定するために自己発見をする知能を有し、前記自己発見は、前記複数の部品の1つの部品が前記プラズマ処理システムに接続されたかを特定することを含む請求項1に記載のサーバー。
- コンピュータで読み取り可能なコードが中に埋め込まれたプログラム記憶媒体を有する製造品であって、
前記コンピュータで読み取り可能なコードは、プラズマ処理システム用のデータ管理を行うよう構成され、
サーバーに提供するコードを有し、
前記サーバーは、複数の知的エージェントであって、前記複数の知的エージェントの各知的エージェントは、前記複数の部品のうちの1つの部品と相互作用するように構成されており、
前記各知的エージェントは、各基準に基づいて、前記部品からデータを受領するように構成され、
前記複数の知的エージェントから処理されたデータを受領するように構成されている調整エージェントを有し、
前記サーバーは臨時エージェントセットを有し、前記臨時エージェントセットは、レシピ管理を行うためのコードを有するように構成され、前記レシピ管理は、レシピの少なくとも1部分を、前記複数の知的エージェントおよび前記調整エージェントのうちの少なくとも1つに分配するためのコードを有することを含むことを特徴とする
製造品。 - 前記複数の知的エージェントの前記各知的エージェントは、前記複数の部品のうちの前記各部品のために、構成要件を規定するためのコードを有するための知能を有し、前記構成要件は、前記複数の知的エージェントの前記各知的エージェントに、データファイルを送るための基準を含み、前記基準は、前記複数の知的エージェントの前記各知的エージェントで局所的に保存された前記レシピの前記1部分に基づいている請求項10に記載の製造品。
- 前記複数の知的エージェントの前記各知的エージェントはキャッシュを有し、前記キャッシュが、データラッチを可能にするために少なくとも最新のデータファイルを保存するためのコードを有するように構成されている請求項11に記載の製造品。
- 前記複数の知的エージェントの前記各知的エージェントは、シグネチャデータを生成するために、前記データファイルのデータ分析を行うためのコードを有し、前記シグネチャデータは、前記データファイル用の要約データである請求項12に記載の製造品。
- 前記調整エージェントは、前記複数の知的エージェントの各知的エージェントから、シグネチャデータを受領するためのコードを有するように構成され、前記シグネチャデータは、前記データファイルの要約データである請求項13に記載の製造品。
- 前記調整エージェントは、複合的なシグネチャを生成するためにデータ分析を行う知能を有し、前記調整エージェントは、前記シグネチャデータを用いて、前記複数の部品に指示をするためのコードを有する請求項14に記載の製造品。
- 前記サーバーは、前記プラズマ処理システムに対する変更を特定するために自己発見を行う知能を有し、前記自己発見は、前記複数の部品の1つの部品が前記プラズマ処理システムに接続されたかを特定するためのコードを有する請求項10に記載の製造品。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/693,664 | 2007-03-29 | ||
US11/693,664 US7672747B2 (en) | 2000-03-30 | 2007-03-29 | Recipe-and-component control module and methods thereof |
PCT/US2008/058320 WO2008121657A1 (en) | 2007-03-29 | 2008-03-26 | A recipe-and-component control module and methods thereof |
Publications (2)
Publication Number | Publication Date |
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JP2010523003A JP2010523003A (ja) | 2010-07-08 |
JP5341875B2 true JP5341875B2 (ja) | 2013-11-13 |
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JP2010501200A Active JP5341875B2 (ja) | 2007-03-29 | 2008-03-26 | レシピおよび部品の制御モジュールならびにその方法 |
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US (2) | US7672747B2 (ja) |
JP (1) | JP5341875B2 (ja) |
KR (1) | KR101388802B1 (ja) |
CN (1) | CN101652838B (ja) |
TW (1) | TWI517202B (ja) |
WO (1) | WO2008121657A1 (ja) |
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WO2008121657B1 (en) | 2008-11-27 |
KR101388802B1 (ko) | 2014-04-23 |
CN101652838A (zh) | 2010-02-17 |
US20100125360A1 (en) | 2010-05-20 |
TW200908072A (en) | 2009-02-16 |
KR20100014649A (ko) | 2010-02-10 |
US20080243988A1 (en) | 2008-10-02 |
WO2008121657A1 (en) | 2008-10-09 |
CN101652838B (zh) | 2015-04-08 |
JP2010523003A (ja) | 2010-07-08 |
US8295963B2 (en) | 2012-10-23 |
TWI517202B (zh) | 2016-01-11 |
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