JP5323054B2 - 電磁干渉シールド特性を有する熱可塑性樹脂組成物 - Google Patents

電磁干渉シールド特性を有する熱可塑性樹脂組成物 Download PDF

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Publication number
JP5323054B2
JP5323054B2 JP2010506286A JP2010506286A JP5323054B2 JP 5323054 B2 JP5323054 B2 JP 5323054B2 JP 2010506286 A JP2010506286 A JP 2010506286A JP 2010506286 A JP2010506286 A JP 2010506286A JP 5323054 B2 JP5323054 B2 JP 5323054B2
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Prior art keywords
polyamide
composition
poly
acid
aromatic
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Expired - Fee Related
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JP2010506286A
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Japanese (ja)
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JP2010526888A5 (https=
JP2010526888A (ja
Inventor
裕司 佐賀
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
JP2010506286A 2007-04-24 2008-04-24 電磁干渉シールド特性を有する熱可塑性樹脂組成物 Expired - Fee Related JP5323054B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US92594507P 2007-04-24 2007-04-24
US60/925,945 2007-04-24
PCT/US2008/005417 WO2008134030A1 (en) 2007-04-24 2008-04-24 Thermoplastic resin composition having electromagnetic interference shielding properties

Publications (3)

Publication Number Publication Date
JP2010526888A JP2010526888A (ja) 2010-08-05
JP2010526888A5 JP2010526888A5 (https=) 2011-05-12
JP5323054B2 true JP5323054B2 (ja) 2013-10-23

Family

ID=39562006

Family Applications (1)

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JP2010506286A Expired - Fee Related JP5323054B2 (ja) 2007-04-24 2008-04-24 電磁干渉シールド特性を有する熱可塑性樹脂組成物

Country Status (3)

Country Link
US (1) US7999018B2 (https=)
JP (1) JP5323054B2 (https=)
WO (1) WO2008134030A1 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100032629A1 (en) * 2008-08-07 2010-02-11 Benoit Brule Adhesive composition containing carbon nanotubes and a copolyamide
KR101267272B1 (ko) * 2008-12-30 2013-05-23 제일모직주식회사 수지 조성물
JP5220696B2 (ja) * 2009-06-30 2013-06-26 パナソニック株式会社 電磁シールド性成形材料、電子部品用電磁シールド性成形品、建材用電磁シールド性成形品、及び電磁シールド性成形材料の製造方法
KR20120034538A (ko) * 2010-08-26 2012-04-12 제일모직주식회사 고강성 전자파 차폐 조성물 및 그 성형품
WO2012026652A1 (ko) * 2010-08-26 2012-03-01 제일모직 주식회사 고강성 전자파 차폐 조성물 및 그 성형품
CN102189268A (zh) * 2011-04-27 2011-09-21 黑龙江大学 核-壳型纳米铜/聚丙烯腈复合材料及其制备方法
CN110079078A (zh) 2011-06-09 2019-08-02 索尔维特殊聚合物美国有限责任公司 以改善的热稳定性为特征的聚酰胺组合物
CN103975023A (zh) * 2011-12-09 2014-08-06 第一毛织株式会社 复合物及其模制品
CN103351612B (zh) * 2013-07-08 2015-10-28 宁波伊德尔新材料有限公司 一种可屏蔽电磁波的尼龙的制备方法
CN105705565B (zh) * 2013-11-14 2018-06-01 Ems 专利股份公司 用于大型模制件的聚酰胺模塑料
CN104212164B (zh) * 2014-09-04 2016-10-12 昆山高联机器人有限公司 一种高速并联机器人用新型自润滑材料
CN105778482A (zh) * 2016-05-16 2016-07-20 苏州新区华士达工程塑胶有限公司 一种改性聚酰胺合金型塑料
CN113248883B (zh) * 2021-06-04 2022-03-25 山东大学 一种医用柔性电磁屏蔽薄膜及其制备方法与应用
WO2023032574A1 (ja) 2021-08-31 2023-03-09 ポリプラスチックス株式会社 電磁波シールド部材
US12225637B1 (en) * 2024-03-20 2025-02-11 Opas Technology Co., Ltd. Curved surface heating device and method for forming three-dimensional patterns

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PH15509A (en) 1974-05-10 1983-02-03 Du Pont Improvements in an relating to synthetic polyesters
JPH06196884A (ja) 1992-12-25 1994-07-15 Toshiba Corp 高熱伝導性複合体
JPH06240049A (ja) 1993-02-22 1994-08-30 Mitsubishi Gas Chem Co Inc 炭素繊維強化熱可塑性樹脂組成物
JPH0987417A (ja) 1995-09-22 1997-03-31 Kobe Steel Ltd 導電性薄肉樹脂成形品
TW550155B (en) * 2000-10-07 2003-09-01 Wen-Shiang Jou A conductive polymer composites process to shield EMI
DE10297231T5 (de) * 2001-09-27 2004-10-28 Nippon Kagaku Yakin Co. Ltd., Neyagawa Harzzusammensetzung mit hoher thermischen Leitfähigkeit und Verfahren zu ihrer Herstellung
CA2470623C (en) 2001-12-19 2009-09-15 E. I. Du Pont De Nemours And Company Polyamide resin compositions with electromagnetic interference shielding properties and articles formed therefrom
JP2006022130A (ja) * 2004-07-06 2006-01-26 Idemitsu Kosan Co Ltd 熱伝導性樹脂組成物及びその製造方法
US20060247352A1 (en) 2005-04-29 2006-11-02 Ariel - University Research And Development Ltd. EMI shielding material
JP4747731B2 (ja) * 2005-08-12 2011-08-17 東ソー株式会社 ポリアリーレンスルフィド組成物
JP4810963B2 (ja) * 2005-10-17 2011-11-09 東ソー株式会社 ポリアリーレンスルフィド組成物

Also Published As

Publication number Publication date
WO2008134030A1 (en) 2008-11-06
US20080269378A1 (en) 2008-10-30
JP2010526888A (ja) 2010-08-05
US7999018B2 (en) 2011-08-16

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