JP5305220B2 - 基板張り合わせ装置 - Google Patents

基板張り合わせ装置 Download PDF

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Publication number
JP5305220B2
JP5305220B2 JP2007293120A JP2007293120A JP5305220B2 JP 5305220 B2 JP5305220 B2 JP 5305220B2 JP 2007293120 A JP2007293120 A JP 2007293120A JP 2007293120 A JP2007293120 A JP 2007293120A JP 5305220 B2 JP5305220 B2 JP 5305220B2
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JP
Japan
Prior art keywords
wafer holder
wafer
holder
substrate holder
terminal
Prior art date
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Expired - Fee Related
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JP2007293120A
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English (en)
Japanese (ja)
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JP2009123741A (ja
JP2009123741A5 (enExample
Inventor
康明 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
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Nikon Corp
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Priority to JP2007293120A priority Critical patent/JP5305220B2/ja
Publication of JP2009123741A publication Critical patent/JP2009123741A/ja
Publication of JP2009123741A5 publication Critical patent/JP2009123741A5/ja
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2007293120A 2007-11-12 2007-11-12 基板張り合わせ装置 Expired - Fee Related JP5305220B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007293120A JP5305220B2 (ja) 2007-11-12 2007-11-12 基板張り合わせ装置

Applications Claiming Priority (1)

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JP2007293120A JP5305220B2 (ja) 2007-11-12 2007-11-12 基板張り合わせ装置

Related Child Applications (1)

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JP2013129239A Division JP2013232663A (ja) 2013-06-20 2013-06-20 基板ホルダ装置及び基板張り合わせ装置

Publications (3)

Publication Number Publication Date
JP2009123741A JP2009123741A (ja) 2009-06-04
JP2009123741A5 JP2009123741A5 (enExample) 2011-01-06
JP5305220B2 true JP5305220B2 (ja) 2013-10-02

Family

ID=40815618

Family Applications (1)

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JP2007293120A Expired - Fee Related JP5305220B2 (ja) 2007-11-12 2007-11-12 基板張り合わせ装置

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JP (1) JP5305220B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011071331A (ja) * 2009-09-25 2011-04-07 Nikon Corp 基板剥離方法及び基板剥離装置
JP5493713B2 (ja) * 2009-10-30 2014-05-14 株式会社ニコン 基板ホルダ、基板貼り合わせ装置、基板ホルダ対および搬送装置
JP5671799B2 (ja) * 2010-01-05 2015-02-18 株式会社ニコン ホルダラック
JP5798721B2 (ja) * 2010-04-07 2015-10-21 株式会社ニコン 基板位置合せ装置、基板貼り合せ装置、基板位置合せ方法および積層半導体の製造方法
KR101164613B1 (ko) 2010-05-06 2012-07-11 (주)루멘시스 웨이퍼 레벨 본딩 장치
JP5397330B2 (ja) * 2010-06-30 2014-01-22 株式会社デンソー ウェハレベルパッケージ構造体の製造方法
JP2012253269A (ja) * 2011-06-06 2012-12-20 Nikon Corp 基板ホルダ及び基板貼り合わせ装置
SG2014013023A (en) 2013-03-27 2015-02-27 Ev Group E Thallner Gmbh Retaining system, device and method for handling substrate stacks
JP6516889B2 (ja) * 2018-01-29 2019-05-22 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板スタックを取り扱うための、収容システム及び装置及び方法
JP6703725B1 (ja) * 2020-01-09 2020-06-03 ハイソル株式会社 半導体チップと支持基板との貼合わせ方法、半導体チップ研磨方法、及びウェハと支持基板との貼合わせ方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3318776B2 (ja) * 1992-08-31 2002-08-26 ソニー株式会社 張り合わせ基板の製造方法と張り合わせ装置
JP2005527974A (ja) * 2002-05-24 2005-09-15 ワイ． チョウ，スティーヴン， 界誘導圧力インプリント・リソグラフィの方法および装置
JP2004103799A (ja) * 2002-09-09 2004-04-02 Canon Inc 基板保持装置、デバイス製造装置及びデバイス製造方法
JP4626160B2 (ja) * 2004-03-04 2011-02-02 株式会社ニコン ウェハ重ね合わせ方法及びウェハ重ね合わせ装置

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Publication number Publication date
JP2009123741A (ja) 2009-06-04

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