JP5304061B2 - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

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Publication number
JP5304061B2
JP5304061B2 JP2008178863A JP2008178863A JP5304061B2 JP 5304061 B2 JP5304061 B2 JP 5304061B2 JP 2008178863 A JP2008178863 A JP 2008178863A JP 2008178863 A JP2008178863 A JP 2008178863A JP 5304061 B2 JP5304061 B2 JP 5304061B2
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JP
Japan
Prior art keywords
dielectric plate
plasma processing
holding table
injector base
processing container
Prior art date
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Expired - Fee Related
Application number
JP2008178863A
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English (en)
Japanese (ja)
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JP2010021243A (ja
JP2010021243A5 (https=
Inventor
直樹 松本
和行 加藤
政史 四方
和人 高井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority to JP2008178863A priority Critical patent/JP5304061B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to US13/003,102 priority patent/US8800484B2/en
Priority to CN200980125715.7A priority patent/CN102084469B/zh
Priority to KR1020107028917A priority patent/KR101174277B1/ko
Priority to PCT/JP2009/060916 priority patent/WO2010004836A1/ja
Priority to TW098123004A priority patent/TWI425883B/zh
Publication of JP2010021243A publication Critical patent/JP2010021243A/ja
Publication of JP2010021243A5 publication Critical patent/JP2010021243A5/ja
Application granted granted Critical
Publication of JP5304061B2 publication Critical patent/JP5304061B2/ja
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  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
JP2008178863A 2008-07-09 2008-07-09 プラズマ処理装置 Expired - Fee Related JP5304061B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008178863A JP5304061B2 (ja) 2008-07-09 2008-07-09 プラズマ処理装置
CN200980125715.7A CN102084469B (zh) 2008-07-09 2009-06-16 等离子体处理装置
KR1020107028917A KR101174277B1 (ko) 2008-07-09 2009-06-16 플라즈마 처리 장치
PCT/JP2009/060916 WO2010004836A1 (ja) 2008-07-09 2009-06-16 プラズマ処理装置
US13/003,102 US8800484B2 (en) 2008-07-09 2009-06-16 Plasma processing apparatus
TW098123004A TWI425883B (zh) 2008-07-09 2009-07-08 Plasma processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008178863A JP5304061B2 (ja) 2008-07-09 2008-07-09 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2010021243A JP2010021243A (ja) 2010-01-28
JP2010021243A5 JP2010021243A5 (https=) 2012-02-23
JP5304061B2 true JP5304061B2 (ja) 2013-10-02

Family

ID=41705873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008178863A Expired - Fee Related JP5304061B2 (ja) 2008-07-09 2008-07-09 プラズマ処理装置

Country Status (1)

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JP (1) JP5304061B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5955062B2 (ja) * 2011-04-25 2016-07-20 東京エレクトロン株式会社 プラズマ処理装置
JP5525504B2 (ja) 2011-11-08 2014-06-18 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5082229B2 (ja) * 2005-11-29 2012-11-28 東京エレクトロン株式会社 プラズマ処理装置
JP4833778B2 (ja) * 2006-02-13 2011-12-07 東京エレクトロン株式会社 基板処理装置及び基板処理方法
CN101772833B (zh) * 2008-02-20 2012-04-18 东京毅力科创株式会社 气体供给装置

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JP2010021243A (ja) 2010-01-28

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