JP5302139B2 - 置換めっき層の剥離方法 - Google Patents

置換めっき層の剥離方法 Download PDF

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Publication number
JP5302139B2
JP5302139B2 JP2009201261A JP2009201261A JP5302139B2 JP 5302139 B2 JP5302139 B2 JP 5302139B2 JP 2009201261 A JP2009201261 A JP 2009201261A JP 2009201261 A JP2009201261 A JP 2009201261A JP 5302139 B2 JP5302139 B2 JP 5302139B2
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Prior art keywords
plating layer
electrode
electrolytic
jig
gold plating
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Japanese (ja)
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JP2011052258A5 (https=
JP2011052258A (ja
Inventor
泉 神通川
利幸 青木
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2009201261A priority Critical patent/JP5302139B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F5/00—Electrolytic stripping of metallic layers or coatings

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  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2009201261A 2009-09-01 2009-09-01 置換めっき層の剥離方法 Active JP5302139B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009201261A JP5302139B2 (ja) 2009-09-01 2009-09-01 置換めっき層の剥離方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009201261A JP5302139B2 (ja) 2009-09-01 2009-09-01 置換めっき層の剥離方法

Publications (3)

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JP2011052258A JP2011052258A (ja) 2011-03-17
JP2011052258A5 JP2011052258A5 (https=) 2012-07-19
JP5302139B2 true JP5302139B2 (ja) 2013-10-02

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ID=43941557

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JP2009201261A Active JP5302139B2 (ja) 2009-09-01 2009-09-01 置換めっき層の剥離方法

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JP (1) JP5302139B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5302140B2 (ja) * 2009-09-01 2013-10-02 新光電気工業株式会社 置換めっき層の剥離方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4956837A (https=) * 1972-10-04 1974-06-03
JPS5278633A (en) * 1975-12-12 1977-07-02 Tokyo Shibaura Electric Co Method of treating unplated portion of partially silver plated product
JPS5760093A (en) * 1980-09-27 1982-04-10 Electroplating Eng Of Japan Co Stripping device for unnecessary plated part of ceramic package
JPH08988B2 (ja) * 1987-04-18 1996-01-10 新光電気工業株式会社 金めつき剥離液
JP3124735B2 (ja) * 1997-03-25 2001-01-15 メルテックス株式会社 金めっき剥離液
JP4378220B2 (ja) * 2004-05-27 2009-12-02 新光電気工業株式会社 めっき用ラックおよびガラス端子のめっき方法
JP4949994B2 (ja) * 2007-10-24 2012-06-13 田中貴金属工業株式会社 複数の金属層を有する金属板から該金属層を剥離する方法
JP5302140B2 (ja) * 2009-09-01 2013-10-02 新光電気工業株式会社 置換めっき層の剥離方法

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