CN208848897U - 电子部件封装 - Google Patents
电子部件封装 Download PDFInfo
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- CN208848897U CN208848897U CN201821321451.5U CN201821321451U CN208848897U CN 208848897 U CN208848897 U CN 208848897U CN 201821321451 U CN201821321451 U CN 201821321451U CN 208848897 U CN208848897 U CN 208848897U
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Abstract
本公开涉及电子部件封装。本实用新型的一个目的是提供电子部件封装。本实用新型要解决的技术问题之一是提供具有经由连接杆电镀的端子的电子部件封装。至少一些实施方案涉及电子部件封装,所述电子部件封装包括第一切割引线;与所述第一切割引线电隔离的第二切割引线;电耦接到所述第一切割引线并且适于电镀所述第一切割引线的第一连接杆;以及电耦接到所述第二切割引线并且适于电镀所述第二切割引线的第二连接杆。本实用新型的有益效果之一是提供具有经由连接杆电镀的端子的电子部件封装。
Description
本申请是申请日为2017年9月22日、申请号为201721222094.2、实用新型名称为“电子部件封装”的实用新型专利申请的分案申请。
技术领域
本实用新型涉及电子部件封装。
背景技术
半导体封装包含电子部件,例如集成电路或分立设备,其执行各种功能中的任一种。封装通常包封在非导电材料中,以保护电子部件免受外部机械或电子损坏。封装还包括电端子,该电端子在容纳在封装内的电子部件和封装外部的电子设备(例如,印刷电路板)之间提供电路径。通过将电端子耦接到此类外部电子设备,封装内的电子部件可与封装外部的电子设备通信。
封装端子和外部电子设备之间的电连接通常用焊料或类似的导电物质进行。用焊料润湿封装端子可能有时是困难的,特别是当端子被腐蚀时。出于此类原因,通常由铜制成的封装端子被镀覆有更耐腐蚀的物质,诸如锡。
普通镀覆技术诸如浸没是次优的,因为所实现的镀层厚度不足。在大多数情况下,镀层太薄,使得镀覆物质(例如,锡)迁移到端子本身中并且降低在将封装耦接到外部电子设备时成功润湿的可能性。当封装长时间储存时,这个问题特别严重,因为储存时间的长度直接与迁移程度有关。
实用新型内容
本实用新型的一个目的是提供电子部件封装。
本实用新型要解决的技术问题之一是提供具有经由连接杆电镀的端子的电子部件封装。
至少一些实施方案涉及电子部件封装,该电子部件封装包括第一切割引线;与第一切割引线电隔离的第二切割引线;电耦接到第一切割引线并且适于电镀第一切割引线的第一连接杆;以及电耦接到第二切割引线并且适于电镀第二切割引线的第二连接杆,其中所述第一切割引线适于通过仅经由所述第一连接杆使电流从引线框架传送到所述第一切割引线而被电镀,其中所述第二切割引线适于通过仅经由所述第二连接杆使电流从引线框架传送到所述第二切割引线而被电镀。
在一个实施方案中,电子部件封装还包括设置在第一切割引线、第二切割引线或两者上的电镀。
在一个实施方案中,第一连接杆和第二连接杆被切割。
在一个实施方案中,所述电镀包括锡。
在一个实施方案中,所述电镀为至少7微米厚。
在一个实施方案中,电子部件封装还包括电耦接到第一切割引线并且与第二切割引线电隔离的第三切割引线,所述第一连接杆适于电镀第三切割引线。
本实用新型的有益效果之一是提供具有经由连接杆电镀的端子的电子部件封装。
附图说明
在附图中:
图1是具有引线框架的封装的示意图。
图2是具有引线框架、管芯、引线接合和夹具接合的封装的示意图。
图3是具有带有切割电端子的引线框架的封装的示意图。
图4是具有带有电镀电端子的引线框架的封装的示意图。
图5是具有带有切割连接杆的引线框架的封装的示意图。
图6是具有多个电镀电端子的封装的底视图。
图7是具有多个电镀电端子和多个切割连接杆的透视图。
图8示出了用于形成具有在长时间段内抗迁移的电端子电镀的封装的方法。
然而,应当理解,附图中给定的具体实施方案以及对它们的详细描述并不限制本公开。相反,这些实施方案和详细描述为普通技术人员提供了分辨替代形式、等价形式和修改形式的基础,这些替代形式、等价形式和修改形式与给定实施方案中的一个或多个实施方案一起被包含在所附权利要求书的范围内。
具体实施方式
相关申请的交叉引用
本申请要求2016年9月28日由Nam Khong Then等人提交的名称为“Long-LastingWettable Flanks”的美国专利申请15/278,203的优先权,该申请以引用方式并入本文,就如同将其全部内容复制在此一样。
本文公开的是用于改善镀覆的、可润湿封装侧面的寿命的各种技术。在至少一些实施方案中,封装引线框架具有多个电端子(例如,引线),并且每个端子直接或间接地电耦接到引线框架连接杆。端子根据需要被切割,使得封装侧面暴露;将电流施加至连接杆以将电端子电镀到期望的厚度;并且在电镀工艺完成而且在端子上已经实现了期望的镀层厚度之后,连接杆被切割。最终结果是具有带有相对较厚镀层(例如,7微米或更厚)的端子的封装。此类厚镀层减轻了电镀材料(例如,锡)到端子中的长期迁移,并且因此有益于封装的长期润湿性和相对较长的保存期。
图1是具有引线框架100的封装的示意图。引线框架100可以是较大引线框架条(未明确示出)的一部分。引线框架100具有挡隔杆103,该挡隔杆通常包括引线框架100的矩形周边。挡隔杆103耦接到电端子(例如,引线)102、104、106、108、118和120。电端子102、104和106彼此电耦接,如数字110所指示。电端子108与其余端子电隔离。电端子118和120经由安装在管芯标记116上的管芯(管芯在图2中明确示出)电耦接到电端子102、104和106。挡隔杆103经由连接杆112电耦接到电端子108;经由连接杆114电耦接到电端子102、104和106;并且经由连接杆122和124以及电端子118和120电耦接到管芯标记116。引线框架100的各种部件(即,挡隔杆103,连接杆112、114、122、124,电端子102、104、106、108、118和120,以及管芯标记116)全部优选地由相同或类似的导电材料(诸如铜或铜合金)构成。数字101参考包含引线框架100的多个部分的封装的轮廓。
示于附图中的引线框架100的设计仅仅是示例性的。本文所述的技术不限于在具有与图中所示的设计类似或相同的设计的引线框架中的应用。相反,所公开的技术可应用于任何和所有合适的封装引线框架,其可受益于对迁移有抵抗性的侧面镀层。例如但不限于,在一些实施方案中,引线框架100的电端子可全部彼此电耦接。在一些实施方案中,一些电端子可彼此电耦接,而其他电端子被隔离。在一些实施方案中,可形成多组相互连接的电端子,但是这些组可彼此电隔离。任何和所有此类变型形式以及组合都包括在本公开的范围中。然而,在优选的实施方案中,待镀覆的每个电端子直接或间接地耦接到至少一个连接杆。例如,如示例性图2所示,虽然电端子108与所有其他电端子隔离,但它电耦接到连接杆112。类似地,电端子102、104和106电耦接到连接杆114。同样,电端子118和120经由管芯206、夹具200和电端子114电耦接到连接杆114。如下所解释,确保待镀覆的每个电端子电耦接到连接杆,以进行适当的镀覆。
图2是具有引线框架100的封装的示意图,如参考图1所述;管芯206安装在管芯标记116上;引线接合204将电端子108经由接合焊盘202电耦接到管芯206;并且夹具接合200将电端子102、104和106电耦接到管芯206。电端子108电耦接到管芯206,但是与其余电端子102、104、106、118和120电隔离。用于将各种电端子电耦接到管芯206的其他技术被设想到并包括在本公开的范围内。图3-图5示出用于处理图2的封装使得封装的电端子抵抗迁移并促进长期润湿性的步骤序列。图6和图7示出由图3-图5所示的步骤产生的最终产品。
图3是具有切割电端子的封装的示意图。具体地讲,电端子102、104、106、108、118和120全部已被切割(如分别由数字306、304、302、300、308、和310所指示),使得对应的侧面暴露在封装101的侧表面上(即,电端子的端部与封装101的侧表面齐平,其中“齐平”意指电端子延伸超过封装表面不大于2mm,或者电端子凹陷在封装表面内不大于2mm)。可采用任何合适的技术来实现此类电端子切割,包括冲压和锯切技术。不管使用的精确技术如何,切割应实现电端子和挡隔杆103之间的完全电子和物理分离。一旦已经执行了电端子的这种切割,电端子就仅经由连接杆112、114、122和124耦接到挡隔杆103。
图4是具有电镀电端子的封装的示意图。具体地讲,如数字400、402、404、406、408和410以及对应的粗线所指示,电端子108、106、104、102、118和120中的每个电端子电镀有任何合适的材料,诸如锡。电端子通过使电流通过端子,同时使用适当的电镀溶液来电镀;然而,如本领域技术人员将认识到的那样,电流不直接施加至待镀覆的端子。因此,电端子102、104、106、108、118和120可通过将电流施加至连接杆112和114而被电镀。具体地讲,连接杆112电耦接到电端子108,因此将合适的电流施加至连接杆112(结合与电流可通过的适当电镀溶液)导致侧面(即,电端子108的暴露在封装101外部的部分)被电镀,如数字400所指示。电镀技术可用于实现任何期望的镀层厚度。在至少一些实施方案中,镀层厚度为至少7微米。类似地,连接杆114电耦接到电端子102、104、106、118和120,因此将合适的电流施加至连接杆114(结合与电流可通过的适当电镀溶液)导致侧面(即,电端子102、104、106、118和120的暴露在封装101外部的部分)被电镀,如数字406、404、402、408和410所指示。电镀技术可用于实现任何期望的镀层厚度。在至少一些实施方案中,镀层厚度为至少7微米。
在至少一些实施方案中,连接杆112、114保持物理和/或电耦接到电端子,直到电镀工艺完成。在一些实施方案中,连接杆112、114被同时移除,即,在连接杆所耦接的所有电端子都已被电镀之后。在其他实施方案中,只要对应的电端子已被镀覆,连接杆112、114中的每个连接杆便被移除,这意味着在不同时间移除连接杆。连接杆112、114的移除(即,切割)可通过任何合适的技术来实现,诸如通过锯切或冲压。
图5示出具有连接杆的引线框架100的示意图,该连接杆在电端子侧面的电镀之后已被切割。如数字500所指示,例如,连接杆112被切割,使得电端子108不再耦接到挡隔杆103。在电端子108被电镀到期望的厚度之后,连接杆112被切割。类似地,数字502指示连接杆114被切割,使得电端子102、104和106不再耦接到挡隔杆103。在电端子102、104和106被电镀到期望的厚度之后,连接杆114被切割。如数字504所指示,连接杆122被切割,并且如数字506所指示,连接杆124也被切割。在该特定示例中,连接杆122和124不用于电镀电端子;它们用于机械支撑管芯标记116。因此,当此类物理支撑不再必要时,连接杆122、124可被切割。
图6是具有多个电镀电端子的封装101的底视图。具体地讲,封装101的下侧示出经电镀且经暴露的电端子102、104、106、108、118和120。这些电端子用锡或一些其他合适的材料电镀到期望的厚度(例如,至少7微米)。在一些实施方案中,在电镀之前,这些电端子的外表面与封装101的表面齐平(即,在±2mm内)。在一些实施方案中,在电镀之后,这些电端子的外表面与封装101的表面齐平。在一些实施方案中,这些电端子的外表面从不与封装101的表面齐平。任何和所有此类变型形式都可被设想到。图7是封装101的透视图。该视图示出在切割之后连接杆112和122的位置。在至少一些实施方案中,连接杆112和122的暴露表面与封装101的表面齐平。
图8示出用于形成具有抗迁移的端子电镀的封装的示例性方法800。方法800开始于提供具有耦接到连接杆的未修整电端子的封装(步骤802)。如上所述,该布置的各种排列是可能的。例如但不限于,一些电端子可与其他电端子隔离,并且一些电端子可电耦接到其他电端子。方法800通过切割电端子来继续以暴露侧面,即,使电端子的外表面与其中容纳电端子的封装的表面齐平(步骤804)。如所解释的,在一些实施方案中,暴露侧面可包括切割电端子,使得它们在电镀完成之后与封装表面齐平。方法800接下来包括将电流施加至连接杆以使用适当的电镀溶液来电镀耦接到连接杆的电端子(步骤806)。在电端子被电镀到期望的厚度之后,方法800包括切割连接杆,使得它们与封装的对应表面齐平(步骤808)。然后完成方法800。方法800可根据需要修改,包括通过添加、删除、修改或重排一个或多个步骤。
至少一些实施方案涉及用于镀覆封装引线的方法,包括:提供具有电耦接到连接杆的引线的封装;切割所述引线;使用连接杆电镀所述切割引线;以及切割所述连接杆。可以任何顺序并且以任何组合使用以下概念中的一个或多个概念来补充一个或多个此类实施方案:其中切割引线包括使引线的端部与封装的侧表面齐平;其中所述切割包括冲压;其中所述切割包括锯切;其中所述电镀包括用锡电镀引线;其中所述电镀导致所述引线具有至少7微米厚的镀层;其中所述电镀包括将电流施加至连接杆;其中将所述电流施加至连接杆导致另一个封装引线被电镀;所述引线和另一个引线彼此电耦接;其中提供封装包括将所述引线电耦接到所述连接杆;其中所述封装包括电耦接到所述引线的第二引线以及与引线和第二引线电隔离的第三引线;并且其中将电流施加至连接杆来电镀引线还导致电镀第二引线,但是不电镀第三引线;还包括将电流施加至耦接到第三引线的第二连接杆以电镀第三引线。
至少一些实施方案涉及一种方法,包括:提供具有第一电端子、第二电端子和第三电端子的封装,所述第一电端子和所述第二电端子彼此电耦接并且电耦接到第一连接杆,所述第三电端子与第一电端子和第二电端子电隔离并且电耦接到第二连接杆;切割第一电端子、第二电端子和第三电端子;在切割第一电端子和第二电端子之后将电流施加至第一连接杆以电镀第一电端子和第二电端子;在切割第三电端子之后将电流施加至第二连接杆以电镀第三电端子;在电镀第一电端子和第二电端子之后切割第一连接杆;以及在电镀第三电端子之后切割第二连接杆。可以任何顺序并且以任何组合使用以下概念中的一个或多个概念来补充一个或多个此类实施方案:其中施加所述电流以电镀第一电端子、第二电端子和第三电端子包括用锡电镀;其中施加所述电流以电镀第一电端子、第二电端子和第三电端子包括施加至少7微米的电镀层厚度;其中切割第一电端子、第二电端子和第三电端子包括暴露所述封装的侧面。
一旦完全理解了上述公开的内容,对于本领域技术人员来说许多其他修改形式、等价形式和替代形式就将变得显而易见。旨在使以下权利要求书被解释为在适用情况下包含所有此类修改形式、等价形式和替代形式。
Claims (6)
1.一种电子部件封装,包括:
第一切割引线;
第二切割引线,所述第二切割引线与所述第一切割引线电隔离;
第一连接杆,所述第一连接杆电耦接到所述第一切割引线并且适于电镀所述第一切割引线,其中所述第一切割引线适于通过仅经由所述第一连接杆使电流从引线框架传送到所述第一切割引线而被电镀;和
第二连接杆,所述第二连接杆电耦接到所述第二切割引线并且适于电镀所述第二切割引线,其中所述第二切割引线适于通过仅经由所述第二连接杆使电流从引线框架传送到所述第二切割引线而被电镀。
2.根据权利要求1所述的电子部件封装,还包括设置在所述第一切割引线、所述第二切割引线或两者上的电镀。
3.根据权利要求2所述的电子部件封装,其中所述第一连接杆和所述第二连接杆被切割。
4.根据权利要求2所述的电子部件封装,其中所述电镀包括锡。
5.根据权利要求4所述的电子部件封装,其中所述电镀为至少7微米厚。
6.根据权利要求1所述的电子部件封装,还包括第三切割引线,所述第三切割引线电耦接到所述第一切割引线并且与所述第二切割引线电隔离,所述第一连接杆适于电镀所述第三切割引线。
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