JP5299837B2 - 支持装置、加熱加圧装置及び加熱加圧方法 - Google Patents

支持装置、加熱加圧装置及び加熱加圧方法 Download PDF

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JP5299837B2
JP5299837B2 JP2007314349A JP2007314349A JP5299837B2 JP 5299837 B2 JP5299837 B2 JP 5299837B2 JP 2007314349 A JP2007314349 A JP 2007314349A JP 2007314349 A JP2007314349 A JP 2007314349A JP 5299837 B2 JP5299837 B2 JP 5299837B2
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substrate
heating
holding surface
wafer
vacuum
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JP2009141043A (ja
JP2009141043A5 (https=
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重人 泉
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Nikon Corp
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Nikon Corp
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JP2007314349A 2007-12-05 2007-12-05 支持装置、加熱加圧装置及び加熱加圧方法 Active JP5299837B2 (ja)

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JP2007314349A JP5299837B2 (ja) 2007-12-05 2007-12-05 支持装置、加熱加圧装置及び加熱加圧方法

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JP2007314349A JP5299837B2 (ja) 2007-12-05 2007-12-05 支持装置、加熱加圧装置及び加熱加圧方法

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JP2013129238A Division JP2013232662A (ja) 2013-06-20 2013-06-20 支持装置、加熱加圧装置及び加熱加圧方法

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JP2009141043A JP2009141043A (ja) 2009-06-25
JP2009141043A5 JP2009141043A5 (https=) 2011-04-07
JP5299837B2 true JP5299837B2 (ja) 2013-09-25

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011142141A (ja) * 2010-01-05 2011-07-21 Nikon Corp ホルダメンテナンス装置
JP5323730B2 (ja) * 2010-01-20 2013-10-23 東京エレクトロン株式会社 接合装置、接合方法、プログラム及びコンピュータ記憶媒体
JP5314607B2 (ja) 2010-01-20 2013-10-16 東京エレクトロン株式会社 接合装置、接合方法、プログラム及びコンピュータ記憶媒体
JP2011181632A (ja) * 2010-02-26 2011-09-15 Tokyo Electron Ltd 接合方法、プログラム及びコンピュータ記憶媒体
CN105960703B (zh) * 2014-02-03 2019-12-03 Ev 集团 E·索尔纳有限责任公司 用于结合基体的方法及装置
JP6429187B2 (ja) * 2014-11-18 2018-11-28 ボンドテック株式会社 接合方法および接合装置
JP6692396B2 (ja) * 2018-08-28 2020-05-13 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板をボンディングする方法および装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237303A (ja) * 2000-02-22 2001-08-31 Sumitomo Metal Ind Ltd ウェハ用真空チャックおよびその製造方法
JP4821091B2 (ja) * 2004-04-08 2011-11-24 株式会社ニコン ウェハの接合装置

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