JP5298422B2 - 発光装置用の支持体及びそれを用いた発光装置 - Google Patents

発光装置用の支持体及びそれを用いた発光装置 Download PDF

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Publication number
JP5298422B2
JP5298422B2 JP2006321074A JP2006321074A JP5298422B2 JP 5298422 B2 JP5298422 B2 JP 5298422B2 JP 2006321074 A JP2006321074 A JP 2006321074A JP 2006321074 A JP2006321074 A JP 2006321074A JP 5298422 B2 JP5298422 B2 JP 5298422B2
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Japan
Prior art keywords
layer
light emitting
emitting device
electrode
light
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Application number
JP2006321074A
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English (en)
Japanese (ja)
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JP2008135588A5 (https=
JP2008135588A (ja
Inventor
寛人 玉置
星太郎 赤川
昌治 細川
昇 田中
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Nichia Corp
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Nichia Corp
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Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2006321074A priority Critical patent/JP5298422B2/ja
Publication of JP2008135588A publication Critical patent/JP2008135588A/ja
Publication of JP2008135588A5 publication Critical patent/JP2008135588A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2006321074A 2006-11-29 2006-11-29 発光装置用の支持体及びそれを用いた発光装置 Active JP5298422B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006321074A JP5298422B2 (ja) 2006-11-29 2006-11-29 発光装置用の支持体及びそれを用いた発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006321074A JP5298422B2 (ja) 2006-11-29 2006-11-29 発光装置用の支持体及びそれを用いた発光装置

Publications (3)

Publication Number Publication Date
JP2008135588A JP2008135588A (ja) 2008-06-12
JP2008135588A5 JP2008135588A5 (https=) 2009-12-17
JP5298422B2 true JP5298422B2 (ja) 2013-09-25

Family

ID=39560228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006321074A Active JP5298422B2 (ja) 2006-11-29 2006-11-29 発光装置用の支持体及びそれを用いた発光装置

Country Status (1)

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JP (1) JP5298422B2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5322801B2 (ja) 2009-06-19 2013-10-23 スタンレー電気株式会社 半導体発光装置及びその製造方法
EP3547380B1 (en) * 2010-02-09 2023-12-20 Nichia Corporation Light emitting device
JP2012142410A (ja) * 2010-12-28 2012-07-26 Rohm Co Ltd 発光素子ユニットおよびその製造方法、発光素子パッケージならびに照明装置
JP5747527B2 (ja) * 2011-01-28 2015-07-15 日亜化学工業株式会社 発光装置の製造方法
KR101892917B1 (ko) * 2011-06-27 2018-08-29 엘지이노텍 주식회사 발광소자 패키지
JP6025026B2 (ja) * 2012-07-31 2016-11-16 大日本印刷株式会社 Ｌｅｄ用リードフレームまたは基板およびその製造方法、ならびに半導体装置およびその製造方法
JP6102116B2 (ja) * 2012-08-07 2017-03-29 日亜化学工業株式会社 発光装置の製造方法
KR101890875B1 (ko) * 2012-10-11 2018-09-28 엘지이노텍 주식회사 기판 및 발광소자 패키지
JP2015159311A (ja) * 2015-04-08 2015-09-03 ローム株式会社 半導体装置
US10622531B2 (en) * 2017-09-28 2020-04-14 Nichia Corporation Light-emitting device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7213945B2 (en) * 2002-05-17 2007-05-08 Ccs, Inc. Light emitting diode and method for fabricating the same
JP2004319939A (ja) * 2003-02-25 2004-11-11 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2005072158A (ja) * 2003-08-22 2005-03-17 Hitachi Aic Inc 発光素子用基板
WO2006100917A1 (ja) * 2005-03-22 2006-09-28 Tanaka Kikinzoku Kogyo K.K. 発光素子用のリフレクター及びその製造方法、並びに該リフレクターを備える発光デバイス
JP4639103B2 (ja) * 2005-03-24 2011-02-23 日本特殊陶業株式会社 発光素子用セラミックパッケージ及びその製造方法
JP2006303069A (ja) * 2005-04-19 2006-11-02 Sumitomo Metal Electronics Devices Inc 発光素子搭載用パッケージ

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JP2008135588A (ja) 2008-06-12

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