JP5293790B2 - 液処理装置、液処理方法及び記憶媒体 - Google Patents

液処理装置、液処理方法及び記憶媒体 Download PDF

Info

Publication number
JP5293790B2
JP5293790B2 JP2011207933A JP2011207933A JP5293790B2 JP 5293790 B2 JP5293790 B2 JP 5293790B2 JP 2011207933 A JP2011207933 A JP 2011207933A JP 2011207933 A JP2011207933 A JP 2011207933A JP 5293790 B2 JP5293790 B2 JP 5293790B2
Authority
JP
Japan
Prior art keywords
liquid
processing
nozzle
unit
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011207933A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012060137A (ja
JP2012060137A5 (enExample
Inventor
靖史 滝口
好貴 吉村
雄一郎 宮田
裕介 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2011207933A priority Critical patent/JP5293790B2/ja
Publication of JP2012060137A publication Critical patent/JP2012060137A/ja
Publication of JP2012060137A5 publication Critical patent/JP2012060137A5/ja
Application granted granted Critical
Publication of JP5293790B2 publication Critical patent/JP5293790B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2011207933A 2011-09-22 2011-09-22 液処理装置、液処理方法及び記憶媒体 Active JP5293790B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011207933A JP5293790B2 (ja) 2011-09-22 2011-09-22 液処理装置、液処理方法及び記憶媒体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011207933A JP5293790B2 (ja) 2011-09-22 2011-09-22 液処理装置、液処理方法及び記憶媒体

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2009031889A Division JP2010186974A (ja) 2009-02-13 2009-02-13 液処理装置、液処理方法及び記憶媒体

Publications (3)

Publication Number Publication Date
JP2012060137A JP2012060137A (ja) 2012-03-22
JP2012060137A5 JP2012060137A5 (enExample) 2012-09-27
JP5293790B2 true JP5293790B2 (ja) 2013-09-18

Family

ID=46056779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011207933A Active JP5293790B2 (ja) 2011-09-22 2011-09-22 液処理装置、液処理方法及び記憶媒体

Country Status (1)

Country Link
JP (1) JP5293790B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12397323B2 (en) 2022-07-27 2025-08-26 SCREEN Holdings Co., Ltd. Substrate cleaning device and substrate cleaning method

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI544291B (zh) 2012-05-22 2016-08-01 斯克林半導體科技有限公司 顯像處理裝置
JP6236328B2 (ja) * 2014-02-06 2017-11-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6447354B2 (ja) * 2014-07-23 2019-01-09 東京エレクトロン株式会社 現像装置
CN113759675A (zh) * 2020-06-05 2021-12-07 长鑫存储技术有限公司 半导体设备及其操作方法
JP7738433B2 (ja) * 2020-10-09 2025-09-12 東京エレクトロン株式会社 基板処理装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0430521A (ja) * 1990-05-28 1992-02-03 Dainippon Screen Mfg Co Ltd 基板用回転式表面処理装置
JP2811247B2 (ja) * 1991-12-13 1998-10-15 東京エレクトロン株式会社 処理装置
JP4024351B2 (ja) * 1997-08-11 2007-12-19 大日本スクリーン製造株式会社 現像装置
JP3679904B2 (ja) * 1997-08-29 2005-08-03 大日本スクリーン製造株式会社 ノズル洗浄装置および該ノズル洗浄装置を備えた塗布装置
JP2004209313A (ja) * 2002-12-27 2004-07-29 Dainippon Screen Mfg Co Ltd 基板塗布装置および基板塗布方法
JP4901200B2 (ja) * 2005-11-30 2012-03-21 東京応化工業株式会社 溶剤回収システム
JP5045218B2 (ja) * 2006-10-25 2012-10-10 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP4900117B2 (ja) * 2007-07-30 2012-03-21 東京エレクトロン株式会社 現像装置、現像方法及び記憶媒体
JP2010186974A (ja) * 2009-02-13 2010-08-26 Tokyo Electron Ltd 液処理装置、液処理方法及び記憶媒体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12397323B2 (en) 2022-07-27 2025-08-26 SCREEN Holdings Co., Ltd. Substrate cleaning device and substrate cleaning method

Also Published As

Publication number Publication date
JP2012060137A (ja) 2012-03-22

Similar Documents

Publication Publication Date Title
JP2010186974A (ja) 液処理装置、液処理方法及び記憶媒体
JP5440441B2 (ja) 液処理装置
KR100897428B1 (ko) 기판세정장치 및 기판세정방법
KR102566736B1 (ko) 기판 처리 장치, 기판 처리 방법 및 기억 매체
JP3587723B2 (ja) 基板処理装置および基板処理方法
CN101620987B (zh) 基板清洗装置
JP4582654B2 (ja) ノズル洗浄装置、ノズル洗浄方法、ノズル洗浄プログラム、及びそのプログラムを記録したコンピュータ読み取り可能な記録媒体
KR101347017B1 (ko) 현상 장치, 현상 방법 및 기억 매체
KR101529741B1 (ko) 현상 장치, 현상 방법 및 기억 매체
KR102237507B1 (ko) 기판 처리 장치 및 노즐 세정 방법
JP5293790B2 (ja) 液処理装置、液処理方法及び記憶媒体
US20170084470A1 (en) Substrate processing apparatus and cleaning method of processing chamber
JP6887912B2 (ja) 基板処理装置、基板処理方法及び記憶媒体
JP6665042B2 (ja) 基板処理装置、基板処理装置の洗浄方法及び記憶媒体
CN106449470A (zh) 基板液处理装置和基板液处理方法
JP6728358B2 (ja) 基板処理装置、基板処理方法および記憶媒体
JP6301281B2 (ja) 基板液処理方法、基板液処理装置および記憶媒体
JP6961362B2 (ja) 基板処理装置
KR20230006393A (ko) 기판 처리 장치 및 미스트 가드의 세정 방법
JP2020205334A (ja) 基板処理方法および基板処理装置
JP3667164B2 (ja) 処理液吐出ノズル、液処理装置および液処理方法
JP2018129476A (ja) 基板処理装置
JP2001252604A (ja) 処理液吐出ノズルおよび液処理装置
JP2002166217A (ja) 基板処理装置
JP7756795B2 (ja) 基板処理装置、および基板処理方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120810

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130425

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130514

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130527

R150 Certificate of patent or registration of utility model

Ref document number: 5293790

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250