JP5292793B2 - 半導体用接着シート、それを用いた半導体装置および半導体装置の製造方法 - Google Patents

半導体用接着シート、それを用いた半導体装置および半導体装置の製造方法 Download PDF

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JP5292793B2
JP5292793B2 JP2007322993A JP2007322993A JP5292793B2 JP 5292793 B2 JP5292793 B2 JP 5292793B2 JP 2007322993 A JP2007322993 A JP 2007322993A JP 2007322993 A JP2007322993 A JP 2007322993A JP 5292793 B2 JP5292793 B2 JP 5292793B2
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semiconductor
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hydroxy
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carboxynaphthalene
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JP2009147116A5 (https=
JP2009147116A (ja
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浩一 藤丸
敏央 野中
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Toray Industries Inc
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Toray Industries Inc
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JP2007322993A 2007-12-14 2007-12-14 半導体用接着シート、それを用いた半導体装置および半導体装置の製造方法 Active JP5292793B2 (ja)

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JP2007322993A JP5292793B2 (ja) 2007-12-14 2007-12-14 半導体用接着シート、それを用いた半導体装置および半導体装置の製造方法

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JP2007322993A JP5292793B2 (ja) 2007-12-14 2007-12-14 半導体用接着シート、それを用いた半導体装置および半導体装置の製造方法

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JP2009147116A JP2009147116A (ja) 2009-07-02
JP2009147116A5 JP2009147116A5 (https=) 2011-01-20
JP5292793B2 true JP5292793B2 (ja) 2013-09-18

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11352563B2 (en) 2018-01-22 2022-06-07 Lg Chem, Ltd. Liquid crystal aligning agent composition, method for preparing liquid crystal alignment film using same, and liquid crystal alignment film using same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014192462A (ja) * 2013-03-28 2014-10-06 Lintec Corp 樹脂膜形成用シート
CN105102221B (zh) 2013-04-16 2017-06-06 东洋纺株式会社 金属箔层叠体
JP6476517B2 (ja) * 2015-02-02 2019-03-06 ナミックス株式会社 フィルム状接着剤、それを用いた半導体装置
JP7539769B2 (ja) * 2019-12-18 2024-08-26 日東電工株式会社 ダイボンドシート、及び、ダイシングダイボンドフィルム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237268A (ja) * 2000-02-22 2001-08-31 Nec Corp 半導体素子の実装方法及び製造装置
JP4211569B2 (ja) * 2002-12-16 2009-01-21 宇部興産株式会社 ポリイミドシロキサン絶縁膜用組成物、絶縁膜、および、絶縁膜の形成方法
US20040132888A1 (en) * 2002-12-16 2004-07-08 Ube Industries, Ltd. Electronic device packaging and curable resin composition
JP2004319823A (ja) * 2003-04-17 2004-11-11 Sumitomo Bakelite Co Ltd 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法。
JP4449325B2 (ja) * 2003-04-17 2010-04-14 住友ベークライト株式会社 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法。
US8653202B2 (en) * 2005-06-06 2014-02-18 Toray Industries, Inc. Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11352563B2 (en) 2018-01-22 2022-06-07 Lg Chem, Ltd. Liquid crystal aligning agent composition, method for preparing liquid crystal alignment film using same, and liquid crystal alignment film using same

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