JP5290358B2 - Film removal device - Google Patents

Description

  The present invention relates to a film removing apparatus, and more particularly, to a film removing apparatus that removes a mylar film remaining on a substrate by a heating unit including a heating block and a heating blade.

  Mylar film (Mylar Film) used to improve exposure and prevent contamination of foreign matters in the production process of PCB (Print Curtain Board) must be removed after the exposure is completed. The applied automation equipment has low productivity and a low peeling success rate, and its utilization is low. Therefore, an operator mainly peels the film manually and supplies it to the development process.

Problems such as manual labor waste, increased worker fatigue, and musculoskeletal disorders are problems.
Peeling equipment of the current method is a structure that applies primary external force to the Mylar Film and the photoresist (Photo Resist) layer before peeling, which acts as a cause of foreign matter generation and affects product quality. For this reason, a peeling technique that can overcome this problem is necessary.

  As one of conventional film removal methods, the one disclosed in Patent Document 1 is known. In the present invention, a peeling part is formed by hooking a film edge part by a knurling roller having irregularities on the surface, and peeling is performed by an adhesive roller while the substrate is transported by the transportation roller. It is. However, recently, the thickness of the printed wiring board has been decreasing, and the adhesive force of the adhesive roller is uneven, which causes warping at the edge of the board while peeling the film. Or there is a problem that an accident that is caught in the device occurs.

Japanese Patent Application Publication No. 2002-211836 Korean Patent Application Publication No. 10-2007-0050756

  Accordingly, the present invention has been derived in order to solve the above-mentioned various drawbacks and problems pointed out with respect to a conventional film removing apparatus, and uses a heating blade to form a substrate. It is an object of the present invention to provide a film removing apparatus capable of easily removing the film remaining on the film.

  The object of the present invention is to provide a substrate support portion for supporting a substrate, a fixed shaft disposed above the substrate support portion, a moving shaft that can be moved up and down within the fixed shaft, and a heat coupled to the moving shaft. A heating block coupled to a lower portion of the moving shaft, and a stack of the substrates supported by the substrate support unit using heat generated from the heating block. This is accomplished by providing a film removal apparatus that includes a heating blade that pressurizes the member.

  Further, a pressure adjusting device is provided on one side of the moving shaft, and the moving shaft can move up and down inside the fixed shaft.

  In addition, the pressure adjusting device can move the moving shaft using air pressure.

  In addition, an elastic member formed of a coil spring can be further included outside the moving shaft.

  The heating block may include a heat controller that can control a constant temperature.

  The heating blade that pressurizes the laminated member on the substrate using heat generated from the heating block may be formed in an inverted triangular cross-sectional shape.

  Further, the heating blade that pressurizes the laminated member on the substrate can melt only the mylar film among the laminated members on the substrate.

  The heating blade that pressurizes the laminated member on the substrate can cut the laminated member on the substrate.

  In addition, the heating blade can horizontally press the laminated member of the substrate while being horizontally moved by the guide portion of the transfer guide portion.

  In addition, the heating blade can press the dry film and mylar film in a portion where no circuit is formed on the substrate.

  The mylar film of the laminated member can be removed using an adhesive tape after being pressed by a heating blade.

  In the laminated member, a dry film and a mylar film may be sequentially laminated on the substrate.

  In addition, a substrate support unit facing the heating blade may be positioned on a lower side of the substrate, and a roller may be provided on the substrate support unit.

  The present invention provides a film removing apparatus including a heating unit composed of a heating block and a heating blade, and can prevent a foreign matter generation phenomenon that occurs during a peeling process by an existing knurling operation. By applying the pressure adjusting device, it is possible to prevent damage to the substrate.

It is sectional drawing of the film removal apparatus by embodiment of this invention. It is sectional drawing of the film removal apparatus by embodiment of this invention. 1 is a view for explaining a film removal method according to an embodiment of the present invention. 1 is a view for explaining a film removal method according to an embodiment of the present invention. 1 is a view for explaining a film removal method according to an embodiment of the present invention. 1 is a view for explaining a film removal method according to an embodiment of the present invention.

  The matters concerning the operation and effects including the technical configuration of the film removing apparatus according to the present invention will be clearly understood by the following detailed description with reference to the drawings in which the preferred embodiments of the present invention are illustrated.

  However, the present invention is not limited to the embodiments disclosed below, and can be embodied in various different forms. The embodiments can be provided to complete the disclosure of the present invention and to fully explain the scope of the invention to those skilled in the art to which the present invention belongs.

  With reference to FIGS. 1 and 2, a film removing apparatus according to an embodiment of the present invention will be described in detail.

  A film removing apparatus according to an embodiment of the present invention includes a fixed shaft 10 disposed on an upper portion of a substrate support, a moving shaft 20 provided to be movable up and down within the fixed shaft, and an elastic member 30 that prevents the substrate 100 from being damaged. A heating unit 40 including a heating block 42 having a controller capable of controlling the temperature, and a heating blade 44 that conducts a constant temperature from the heating block 42, heating of the heating unit 40 The substrate support unit 50 is configured to face the blade 44 and support the substrate 100.

  The fixed shaft 10 is connected to a fixed shaft support portion 15, and the fixed shaft support portion 15 is connected to a support body 60.

  The moving shaft 20 is formed on the lower end side of the fixed shaft 10, the moving shaft 20 is smaller than or equal to the inner diameter of the fixed shaft 10, and the upper end portion of the moving shaft 20 is inside the fixed shaft. Inserted and can move up and down. Further, the moving shaft 20 freely moves up and down inside the fixed shaft 10 according to the thickness of the substrate 100 by a pressure adjusting device (not shown) separately provided on one side of the moving shaft 20. Can be done.

  The pressure adjusting device is a device for adjusting the pressure of air, and is connected to the moving shaft 20. In the present invention, the moving shaft 20 is moved up and down inside the fixed shaft 10 using pneumatic pressure, but the moving method of moving up and down the moving shaft 20 is not limited to pneumatic pressure.

  An elastic member 30 is provided between the moving shaft 20 and the fixed shaft 10 so as not to damage the substrate 100. The elastic member 30 may exist in the form of a coil spring outside the moving shaft 20, but may not be located outside the moving shaft 20 as long as it can apply elasticity to the moving shaft 20. In addition, the elastic member 30 is configured to prevent the substrate 100 from being damaged by the heating blade 44 when a heating blade 44 described later is brought into contact with the substrate 100 by a pressure adjusting device connected to the moving shaft 20. Can be prevented.

  The heating unit 40 may include a heating block 42 and a heating blade.

  The heating block 42 is formed on one side of the lower end of the moving shaft 20, and has a separate heat controller (not shown) that can control a constant temperature, and can transfer heat to the heating block 42. . The temperature of the heat transmitted to the heating block 42 may be 200 ° C. to 400 ° C., which is a temperature at which the dry film 102 and the mylar film 103 existing on the substrate 100 can be melted.

  A heating blade 44 may be attached to the end of the heating block 42, and the heating blade 44 receives heat from the heating block 42. The heating blade 44 has an inverted triangular cross-sectional shape at the lower end of the heating block so that a predetermined section of the dry film 102 and the mylar film 103 sequentially stacked on the substrate 100 can be cut or cut. Can be formed. However, the shape of the heating blade 44 may be any shape as long as it can be in line contact with the dry film 102 and the mylar film 103 existing on the substrate 100, and is in contact with the dry film 102 and the mylar film 103. The number of heating blades 44 to be used is not limited.

  The substrate support 50 is located at the lower end of the substrate 100 and is fixed to the support 60 by the substrate support 50.

  The substrate support unit 50 is located on the lower surface of the substrate 100 and plays a role of supporting the substrate 100. By providing a roller on the upper surface of the substrate support unit 50, the substrate 100 can be easily moved. Like that.

  The support 60 can fix the fixed shaft support 15 that fixes the fixed shaft 10 and the substrate support 50.

  Further, since the support body 60 can be moved to the left and right by a guide part 75 formed on the transfer guide part 70, the fixed shaft support part 15 and the substrate support part 50 fixed to the support body 60 move to the left and right. be able to.

  The support 60 can be moved along the transfer guide portion 70 by air pressure, but is not limited thereto, and can be moved left and right using electricity or fluid pressure.

  The transfer guide part 70 is attached to the fixed part 80.

  The substrate 100 may be moved between the heating unit 40 and the substrate support unit 50 by a conveyor belt (not shown), and the dry film 102 of the substrate 100 is heated by a heating blade 44 of the heating unit 40. The mylar film 103 is cut or scratched.

  With reference to FIGS. 3 to 6, the film removal method and the fixing order of the film removal apparatus according to the embodiment of the present invention will be described in detail.

  As shown in FIG. 3, the film removal method and the fixing order according to the embodiment of the present invention include the heating of the heating unit 40 in which the substrate 100 is attached to one side of the lower end of the moving shaft 20 by a conveyor belt (not shown). It is moved between the ting blade 44 and the substrate support 50. The substrate 100 moved between the heating blade 44 and the substrate support part 50 may be an end portion of the substrate 100 where no circuit is formed. However, even if it is not the edge part of the board | substrate 100, it can be a part in which the circuit is not formed, It is not limited to this.

  At this time, the heating unit 40 and the substrate support unit 50 may be opened wider than the thickness of the substrate 100 so that the substrate 100 is carried in. At this time, the substrate support portion 50 is fixed, and the moving shaft 20 is moved into the fixed shaft 10.

  In addition, the substrate 100 may be inserted between the heating unit 40 and the substrate support unit 50 by the conveyor belt (not shown), but the present invention is not limited thereto, and the support is performed according to the convenience of the user. It is also possible for the body 60 to move in the direction of entry of the substrate 100 or in the opposite direction to enter the substrate 100 where the circuit is not formed. The support 60 can move along a guide part 75 formed in the transfer guide part 70.

  As shown in FIG. 4, the heating blade 44 can come into contact with the substrate 100 by the moving shaft 20. At this time, the moving shaft 20 can move to the substrate 100 until the heating blade 44 is in line contact with the dry film 102 and the mylar film 103, and the heating blade 44 approaches the upper surface of the substrate 100 depending on the situation. May be. A circuit may not be formed on the upper surface of the substrate 100 to which the heating blade 44 approaches.

  At this time, the heating blade 44 can receive heat from the heating block 42.

  As shown in FIG. 5, the dry film 102 and the mylar film 103 that are sequentially laminated on the substrate 100 can be cut using the heating blade 44.

  In another embodiment, the heating blade 44 is supplied with heat of 210 ° C. to 250 ° C. from a heating block, and includes a dry film 102 and a mylar film 103 that are sequentially laminated on the substrate 100. Pressurize. At this time, since the melting point of the dry film 102 is about 200 ° C. and the melting point of the mylar film 103 is 260 ° C. or more, the dry film 102 and the mylar film 103 pressed by the heating blade 44 are dry. Only the film 102 is melted by the heating blade 44.

  At this time, the support 60 is moved to the left and right along the guide part 75 of the transfer guide part 70, whereby the heating blade 44 is moved to the left and right, and the dry film 102 and the mylar film formed on the substrate 100 are moved. 103 can be cut or only the mylar film 103 can be melted.

  In another embodiment, the substrate 100 is moved left and right by the conveyor belt, and the dry film 102 and the mylar film 103 can be cut by the heating blade 44 or only the mylar film 103 can be melted.

  In some cases, the heating blade 44 may approach the substrate 100 to cover the substrate 100, but it is not relevant because it is a dummy portion in which no circuit is formed.

  As shown in FIG. 6, the lower surface of the mylar film 103 and the substrate 100 are separated by the dry film 102 and the mylar film 103 that have been cut and separated to the left and right, and air flows in between them.

  An adhesive tape (not shown) is attached to the upper surface of the mylar film 103 into which air has been introduced, and the mylar film 103 can be easily peeled at a constant angle and speed.

  In another embodiment, the heating blade 44 melts only the dry film 102 among the laminated members existing on the substrate 100, so that a space is easily separated between the mylar film 103 and the base material 101. The mylar film 103 can be peeled off.

  At this time, as a method of peeling the mylar film 103, an adhesive roller or the like can be used, and the method is not limited to this.

  The above detailed description illustrates the invention. Also, the foregoing is merely illustrative of a preferred embodiment of the present invention and the present invention can be used in a variety of other combinations, modifications and environments. That is, changes or modifications can be made within the scope of the inventive concept disclosed in the present specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge of the industry. The embodiments described above are for explaining the best state in carrying out the present invention, in other states known in the art in using other inventions such as the present invention, and for the invention. Various modifications required in specific application fields and applications are possible. Accordingly, the above detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other implementations.

DESCRIPTION OF SYMBOLS 10 Fixed shaft 20 Moving shaft 30 Elastic member 40 Heating part 42 Heating block 44 Heating blade 50 Substrate support part 60 Support body 70 Transfer guide part 75 Guide part 80 Fixed part 100 Substrate 101 Base material 102 Dry film 103 Mylar film

Claims (12)

A substrate support for supporting the substrate;
A fixed shaft disposed on top of the substrate support;
A moving shaft provided to be movable up and down within the fixed shaft;
A heating unit coupled to the moving axis;
The heating unit is
Wherein is coupled to a lower portion of the moving shaft the heating block; and utilizing the heat generated from the heating block, saw including a heating blade for pressurizing the laminated member of the substrate supported on the substrate support,
The laminated member has a first laminated member and a second laminated member laminated on the first laminated member, the first laminated member has a first melting point, The second laminated member has a second melting point higher than the first melting point;
In order to remove the laminated member from the substrate by dissolving only the first laminated member, the heating unit is configured to remove the laminated member at a temperature between the first melting point and the second melting point. Pressurize,
Film removal device.   The film removing apparatus according to claim 1, further comprising a pressure adjusting device on one side of the moving shaft, wherein the moving shaft moves up and down inside the fixed shaft.   The film removing apparatus according to claim 2, wherein the pressure adjusting device moves the moving shaft using air pressure.   The film removing apparatus according to claim 1, further comprising an elastic member formed of a coil spring outside the moving shaft.   The film removal apparatus according to claim 1, wherein the heating block includes a heat controller capable of controlling a constant temperature.   The film removing apparatus according to claim 1, wherein the heating blade that pressurizes the laminated member on the substrate using heat generated from the heating block is formed in a cross-sectional shape of an inverted triangle.   The film removing apparatus according to claim 1, wherein the heating blade that pressurizes the laminated member on the substrate can cut the laminated member on the substrate.   The film removing apparatus according to claim 1, wherein the heating blade horizontally pressurizes the laminated member of the substrate while being horizontally moved by the guide portion of the transfer guide portion. The film removing apparatus according to claim 8 , wherein the heating blade pressurizes the laminated member in a portion where a circuit is not formed on the substrate. The film removing apparatus according to claim 9 , wherein the second laminated member is removed by using an adhesive tape after being pressed by a heating blade. It said first laminated member is a dry film, the second lamination members are Mylar film, the film removing apparatus according to claim 1.   The film removing apparatus according to claim 1, wherein a substrate support portion facing the heating blade is positioned on a lower side of the substrate, and a roller is provided on the substrate support portion.

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