JP5289968B2 - 半導体構造物の製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims description 119
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000758 substrate Substances 0.000 claims description 38
- 239000013078 crystal Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 11
- 125000006850 spacer group Chemical group 0.000 description 42
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- 239000012212 insulator Substances 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 238000005468 ion implantation Methods 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 229910052732 germanium Inorganic materials 0.000 description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- AXQKVSDUCKWEKE-UHFFFAOYSA-N [C].[Ge].[Si] Chemical compound [C].[Ge].[Si] AXQKVSDUCKWEKE-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910000449 hafnium oxide Inorganic materials 0.000 description 2
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 230000002040 relaxant effect Effects 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- 229910001339 C alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- UZQSJWBBQOJUOT-UHFFFAOYSA-N alumane;lanthanum Chemical compound [AlH3].[La] UZQSJWBBQOJUOT-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 150000002363 hafnium compounds Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
- H01L21/845—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body including field-effect transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
- H01L27/1211—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI combined with field-effect transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/938—Lattice strain control or utilization
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- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Description
Claims (4)
- 歪み半導体層を絶縁層の上に有する基板を設ける工程と、
第1導電型を有する第1の複数のデバイスを形成するための第1デバイス領域を設ける工程であって、前記第1導電型は、P型及びN型のうちの一方であり、前記第1の複数のデバイスは、平面型デバイスを含み、前記第1導電型に応じた歪み及び結晶方位が、移動度を向上させるように設定される、前記第1デバイス領域を設ける工程と、
第1導電型とは異なる第2導電型を有する第2の複数のデバイスを形成するための第2デバイス領域を設ける工程であって、前記第2導電型は、P型及びN型のうちの他方であり、第2の複数のデバイスは縦型デバイスを含み、前記第2導電型に応じた結晶方位が、移動度を向上させるように設定される、前記第2デバイス領域を設ける工程と、
第2デバイス領域の歪み半導体層に第1デバイス領域の歪み半導体層よりも小さい歪みを備えた、厚み増加済み歪み半導体層を形成するために、第2デバイス領域において歪み半導体層の膜厚を増加させる工程と、
前記第1デバイス領域の歪み半導体にソース/ドレイン領域を有した前記第1の複数のデバイスを、及び、前記第2デバイス領域の厚み増加済み歪み半導体層にソース/ドレイン領域を有した前記第2の複数のデバイスを形成する工程であって、
前記第2デバイス領域において歪み半導体層の厚みを増加させる工程の後で、前記厚み増加済み歪み半導体層の一部を削除することによって前記絶縁層を露出する工程と、
前記厚み増加済み歪み半導体の一部を削除する工程の後で、前記厚み増加済み歪み半導体層の側壁に隣接するようにゲート誘電体層を形成する工程とを備える、前記第1及び第2の複数のデバイスを形成する工程と
を備える、半導体構造物の製造方法。 - 前記歪み半導体層の膜厚を増加させる工程は、前記歪み半導体層と同一の材料を前記歪み半導体層上に直接にエピタキシャル成長させることによって厚み増加済み歪み半導体層を形成する工程からなる、請求項1記載の半導体構造物の製造方法。
- 歪み半導体層の膜厚を増加させる工程は、
マスク層を第1領域の上に形成する工程と、
第1領域を除外して第2領域のみにおいて歪み半導体層の膜厚を増加させるべく選択エピタキシャル成長を行う工程とからなる、請求項1記載の半導体構造物の製造方法。 - 歪み半導体層の内、エピタキシャル成長が行なわれる部分の膜厚はマスク層の膜厚よりも厚い、請求項3記載の半導体構造物の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/263,120 | 2005-10-31 | ||
US11/263,120 US7575975B2 (en) | 2005-10-31 | 2005-10-31 | Method for forming a planar and vertical semiconductor structure having a strained semiconductor layer |
PCT/US2006/041146 WO2007053339A2 (en) | 2005-10-31 | 2006-10-20 | Method for forming a semiconductor structure and structure thereof |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009514247A JP2009514247A (ja) | 2009-04-02 |
JP2009514247A5 JP2009514247A5 (ja) | 2009-12-03 |
JP5289968B2 true JP5289968B2 (ja) | 2013-09-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2008538913A Expired - Fee Related JP5289968B2 (ja) | 2005-10-31 | 2006-10-20 | 半導体構造物の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7575975B2 (ja) |
JP (1) | JP5289968B2 (ja) |
KR (1) | KR20080070642A (ja) |
CN (1) | CN101341597A (ja) |
TW (1) | TW200725756A (ja) |
WO (1) | WO2007053339A2 (ja) |
Cited By (1)
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US9543323B2 (en) | 2015-01-13 | 2017-01-10 | International Business Machines Corporation | Strain release in PFET regions |
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US7224033B2 (en) * | 2005-02-15 | 2007-05-29 | International Business Machines Corporation | Structure and method for manufacturing strained FINFET |
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US7737532B2 (en) * | 2005-09-06 | 2010-06-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Hybrid Schottky source-drain CMOS for high mobility and low barrier |
-
2005
- 2005-10-31 US US11/263,120 patent/US7575975B2/en active Active
-
2006
- 2006-10-20 CN CNA2006800407204A patent/CN101341597A/zh active Pending
- 2006-10-20 KR KR1020087010524A patent/KR20080070642A/ko not_active Application Discontinuation
- 2006-10-20 JP JP2008538913A patent/JP5289968B2/ja not_active Expired - Fee Related
- 2006-10-20 WO PCT/US2006/041146 patent/WO2007053339A2/en active Application Filing
- 2006-10-31 TW TW095140122A patent/TW200725756A/zh unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9543323B2 (en) | 2015-01-13 | 2017-01-10 | International Business Machines Corporation | Strain release in PFET regions |
US9761610B2 (en) | 2015-01-13 | 2017-09-12 | International Business Machines Corporation | Strain release in PFET regions |
US9966387B2 (en) | 2015-01-13 | 2018-05-08 | International Business Machines Corporation | Strain release in pFET regions |
Also Published As
Publication number | Publication date |
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US20070099353A1 (en) | 2007-05-03 |
WO2007053339A2 (en) | 2007-05-10 |
WO2007053339A3 (en) | 2007-11-29 |
US7575975B2 (en) | 2009-08-18 |
TW200725756A (en) | 2007-07-01 |
JP2009514247A (ja) | 2009-04-02 |
KR20080070642A (ko) | 2008-07-30 |
CN101341597A (zh) | 2009-01-07 |
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