JP5286809B2 - 半導体集積回路 - Google Patents

半導体集積回路 Download PDF

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Publication number
JP5286809B2
JP5286809B2 JP2008025286A JP2008025286A JP5286809B2 JP 5286809 B2 JP5286809 B2 JP 5286809B2 JP 2008025286 A JP2008025286 A JP 2008025286A JP 2008025286 A JP2008025286 A JP 2008025286A JP 5286809 B2 JP5286809 B2 JP 5286809B2
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JP
Japan
Prior art keywords
terminal
resistor
circuit
integrated circuit
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008025286A
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English (en)
Japanese (ja)
Other versions
JP2009189127A (ja
Inventor
秀憲 田中
浩平 柴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsumi Electric Co Ltd
Original Assignee
Mitsumi Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsumi Electric Co Ltd filed Critical Mitsumi Electric Co Ltd
Priority to JP2008025286A priority Critical patent/JP5286809B2/ja
Priority to KR1020080106281A priority patent/KR101028784B1/ko
Priority to CN200910005434XA priority patent/CN101504943B/zh
Priority to TW098102880A priority patent/TW200943663A/zh
Publication of JP2009189127A publication Critical patent/JP2009189127A/ja
Application granted granted Critical
Publication of JP5286809B2 publication Critical patent/JP5286809B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/647—Resistive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/62—Protection against overvoltage, e.g. fuses, shunts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/46—Accumulators structurally combined with charging apparatus
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Secondary Cells (AREA)
  • Protection Of Static Devices (AREA)
JP2008025286A 2008-02-05 2008-02-05 半導体集積回路 Active JP5286809B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008025286A JP5286809B2 (ja) 2008-02-05 2008-02-05 半導体集積回路
KR1020080106281A KR101028784B1 (ko) 2008-02-05 2008-10-29 반도체 집적회로
CN200910005434XA CN101504943B (zh) 2008-02-05 2009-01-20 半导体集成电路
TW098102880A TW200943663A (en) 2008-02-05 2009-01-23 A semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008025286A JP5286809B2 (ja) 2008-02-05 2008-02-05 半導体集積回路

Publications (2)

Publication Number Publication Date
JP2009189127A JP2009189127A (ja) 2009-08-20
JP5286809B2 true JP5286809B2 (ja) 2013-09-11

Family

ID=40977116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008025286A Active JP5286809B2 (ja) 2008-02-05 2008-02-05 半導体集積回路

Country Status (4)

Country Link
JP (1) JP5286809B2 (zh)
KR (1) KR101028784B1 (zh)
CN (1) CN101504943B (zh)
TW (1) TW200943663A (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102397624A (zh) * 2010-09-17 2012-04-04 鼎迈医疗科技(苏州)有限公司 具有过流保护电路的植入式有源电子装置及电刺激系统
CN103378070B (zh) * 2012-04-16 2016-04-13 富士电机株式会社 半导体器件
CN103023005B (zh) * 2012-11-30 2015-02-04 无锡中星微电子有限公司 静电保护电路及其电池保护电路
US9940986B2 (en) 2015-12-16 2018-04-10 Globalfoundries Inc. Electrostatic discharge protection structures for eFuses

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2563783B2 (ja) * 1986-10-22 1996-12-18 セイコーエプソン株式会社 静電気保護回路
JPH09219521A (ja) * 1997-03-24 1997-08-19 Seiko Epson Corp 半導体装置
JP2001189428A (ja) * 1999-10-19 2001-07-10 Citizen Watch Co Ltd 半導体集積回路の保護回路
KR100450181B1 (ko) * 2002-04-15 2004-09-24 삼성에스디아이 주식회사 공간적으로 분리된 2차 보호회로를 갖는 배터리 팩
JP3958269B2 (ja) * 2003-09-09 2007-08-15 日本テキサス・インスツルメンツ株式会社 復調装置およびこれを有するデータ記録装置
JP4046106B2 (ja) * 2004-06-16 2008-02-13 株式会社村田製作所 電池パックの保護回路および電池パック
JP2006073553A (ja) * 2004-08-31 2006-03-16 Nec Electronics Corp ヒューズトリミング回路
JP2007088192A (ja) * 2005-09-22 2007-04-05 Sanyo Electric Co Ltd 半導体装置

Also Published As

Publication number Publication date
KR20090086019A (ko) 2009-08-10
JP2009189127A (ja) 2009-08-20
KR101028784B1 (ko) 2011-04-14
TW200943663A (en) 2009-10-16
CN101504943B (zh) 2012-07-04
CN101504943A (zh) 2009-08-12

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