JP5278782B2 - Manufacturing method of aggregate substrate - Google Patents

Description

  The present invention relates to a method for manufacturing an aggregate substrate, and more particularly to a method for manufacturing an aggregate substrate including a multilayer ceramic substrate.

  2. Description of the Related Art Conventionally, as a method for manufacturing a module component or the like in which components are mounted on a multilayer ceramic substrate, a method of dividing a collective substrate into individual substrates after mounting the components on the collective substrate including a portion that becomes a single substrate is known. The aggregate substrate is produced by firing a laminate in which ceramic green sheets are laminated.

  For example, FIG. 7 is a plan view showing a stacked body 111 for producing an aggregate substrate. In the laminated body 111, ceramic green sheets 112 are laminated. In the ceramic green sheet 112, a conductive paste film 113 is formed in the central portion 116, and a shrinkage suppression layer 115 made of a conductive paste is formed in the peripheral portion 114. Since the shrinkage rates of the conductive paste and the ceramic green sheet 112 are different, by providing the shrinkage suppression layer 115 in the peripheral part, the difference in shrinkage between the central part 116 and the peripheral part 114 can be reduced, and the aggregate substrate is distorted. (For example, refer to Patent Document 1).

JP 2001-308526 A

  However, in FIG. 7, a gap G is provided between the outer peripheral edge of the ceramic green sheet and the shrinkage suppression layer. The laminate in which the gap G is provided between the outer peripheral edge of the ceramic green sheet and the shrinkage suppression layer 115 is distorted due to the difference in shrinkage rate between the shrinkage suppression layer 115 and the ceramic green sheet 112. Therefore, cracks are generated on the end face of the laminate after firing, or the break grooves formed on the surface of the laminate before firing are locally deformed after firing, and the substrate is cracked or cracked starting from the break grooves. May occur. If cracks occur in the fired laminate, that is, the collective substrate, the strength decreases, and the collective substrate easily breaks due to a component mounting process after firing, an impact during conveyance between processes, or the like.

  In view of such a situation, the present invention is intended to provide a method for manufacturing an aggregate substrate that can prevent the aggregate substrate from cracking or the aggregate substrate from being cracked.

  In order to solve the above problems, the present invention provides a method for manufacturing an aggregate substrate configured as follows.

  The method for manufacturing an aggregate substrate includes (i) a first step of preparing an unsintered laminate, and (ii) firing the unsintered laminate, and forming the aggregate substrate by the laminate after firing is completed. A second step. The unsintered laminate includes (a) an individual substrate region including a portion to be an individual substrate and a peripheral region surrounding the periphery of the individual substrate region. A ceramic layer; and (b) a shrinkage suppression layer that is disposed between the ceramic layers adjacent to each other and is formed in the peripheral region of the ceramic layer so as to be in contact with the outer peripheral edge of the ceramic layer. The unsintered laminate is divided into individual substrates along a boundary line of a portion to be an individual substrate and an extension line thereof on at least one of main surfaces exposed to the outside on both sides in the lamination direction of the ceramic layers. Break grooves are formed.

  In the aggregate substrate manufactured by the above method, the shrinkage suppression layer is exposed at the end surfaces that are exposed to the outside and exposed to the outside on both sides of the ceramic layer in the stacking direction.

  When a shrinkage suppression layer is formed with a gap between the outer peripheral edge of the unsintered ceramic layer, the shrinkage during firing is suppressed in the part where the gap is provided, that is, the part where the shrinkage suppression layer is not formed. Not suppressed by the layer. Therefore, the laminated body deforms unevenly near the end face of the laminated body at the time of firing, cracks are generated in the end face of the laminated body, and break grooves are locally deformed near the end face of the laminated body.

  On the other hand, according to the above method, since the shrinkage suppression layer is formed so as to be in contact with the outer peripheral edge of the unsintered ceramic layer, the portion of the gap G in the ceramic green sheet 112 does not exist. As a result, during firing, uneven deformation near the end face of the laminated body is alleviated or eliminated, and the end face of the laminated body after firing is cracked, or the break groove is locally deformed. Can be prevented.

The ceramic layer adjacent the leading SL shrinkage suppression layer comprises a magnetic ceramic material. The method further includes a third step of performing plating on the laminated body that has been sintered and forming a plating layer on the end face of the aggregate substrate.

  The plating adheres to the shrinkage suppression layer exposed at the end face. Moreover, it is easy to adhere to the ceramic layer containing a magnetic ceramic material. Therefore, a plating layer that adheres firmly to the end face of the aggregate substrate can be easily formed.

  Even if a crack occurs on the end surface of the collective substrate before the third step of forming the plating layer, the crack is repaired by the plating layer, so that the collective substrate is hardly cracked starting from the crack. . In addition, since the plating layer is difficult to peel off from the end face of the aggregate substrate, it is possible to prevent a short circuit or disconnection due to adhesion of a peeling piece of the plating layer.

  Preferably, the method further includes a fourth step of mounting a component on a portion of the collective substrate that becomes an individual substrate before dividing the collective substrate along the break groove.

  The individual substrates can be efficiently formed by dividing the components after mounting them on the collective substrate.

  In addition, the present invention provides a collective substrate configured as follows.

The aggregate substrate has (a) a single substrate region including a portion to be a single substrate and a peripheral region surrounding the periphery of the single substrate region, and a plurality of ceramic layers laminated and bonded together, and (b) each other. A shrinkage suppression layer disposed between the adjacent ceramic layers and formed in the peripheral region of the ceramic layer. The collective substrate is separated along at least one of the main surfaces exposed to the outside on both sides of the ceramic layer in the lamination direction of the laminated and pressure-bonded ceramic layers along a boundary line and an extension line of a portion to be a single substrate. Break grooves for dividing the substrate are formed. In the aggregate substrate, the shrinkage suppression layer is exposed at an end surface extending between the main surfaces of the laminated and pressure-bonded ceramic layers and exposed to the outside. Plating adheres to the shrinkage suppression layer exposed at the end face.

  The aggregate substrate having the above-described configuration can be manufactured by firing a laminate in which an unsintered ceramic layer is laminated. The laminated body after completion of the sintering, that is, the collective substrate can be divided into individual substrates by dividing along the breaking grooves.

  By firing the laminate in which the shrinkage suppression layer is in contact with the outer peripheral edge of the unsintered ceramic layer, the shrinkage suppression layer can be exposed at the end face of the aggregate substrate. In this case, it is possible to prevent the end face of the collective substrate from being cracked and the break groove from being locally deformed.

  That is, when the shrinkage suppression layer is formed with a gap between the outer peripheral edge of the unsintered ceramic layer, the portion where the gap is provided, that is, the portion where the shrinkage suppression layer is not formed, is shrunk during firing. It is not suppressed by the shrinkage suppression layer. Therefore, the laminated body deforms unevenly near the end face of the laminated body at the time of firing, cracks are generated in the end face of the laminated body, and break grooves are locally deformed near the end face of the laminated body. On the other hand, if the shrinkage suppression layer is formed so as to be in contact with the outer peripheral edge of the unsintered ceramic layer, it is possible to reduce or eliminate the occurrence of uneven deformation near the end face of the laminate during firing. It is possible to prevent the laminated body after firing, that is, the end face of the collective substrate from cracking and the break grooves from being locally deformed.

  ADVANTAGE OF THE INVENTION According to this invention, it can prevent that a crack generate | occur | produces in a collective board and a crack of a collective board generate | occur | produces.

It is a top view of an aggregate substrate. Example 1 It is sectional drawing cut | disconnected along line AA of FIG. Example 1 It is sectional drawing cut | disconnected along line BB of FIG. Example 1 It is a top view of a ceramic layer. Example 1 It is a top view of a ceramic layer. Example 1 It is a top view of an aggregate substrate. (Comparative Example 1) It is a top view of an aggregate substrate. (Conventional example)

  Embodiments of the present invention will be described below with reference to FIGS.

  <Example 1> A collective substrate 10 of Example 1 will be described with reference to FIGS.

  FIG. 1 is a plan view of an aggregate substrate 10 that has been sintered. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3 is a cross-sectional view taken along line BB in FIG.

  As shown in FIGS. 1 to 3, the collective substrate 10 includes an individual substrate region 11 s including a portion 11 to be an individual substrate, and a peripheral region 11 t surrounding the individual substrate region 11 s. FIG. 1 schematically shows a portion 11 that becomes 4 × 4 individual substrates.

  On one main surface 12a of the substrate body 12 of the collective substrate 10, break grooves 11x and 11y having a V-shaped cross section are formed along the boundary line of the portion 11 to be the individual substrate of the individual substrate region 11s and the extension line thereof. Has been. Break grooves 11p and 11q having a rectangular cross section are formed on the other main surface 12b of the substrate body 12 of the collective substrate 10 so as to face the break grooves 11x and 11y. By cutting the substrate body 12 of the collective substrate 10 along the break grooves 11p, 11q, 11x, and 11y between the opposing break grooves 11p and 11x and 11q and 11y, individual substrate regions of the collective substrate 10 Individual substrates can be divided from 11 s.

  As shown in FIG. 2, land electrode 26 a, 26 b (not shown in FIG. 1) for mounting components 2, 4 is provided on one main surface of substrate main body 12. A terminal electrode 28 is formed on the other main surface 12b of the substrate body 12 so as to be mounted on the other circuit board or the like. If no component is mounted on the individual substrate, the land electrodes 26a and 26b can be eliminated.

  As shown in FIGS. 2 and 3, the substrate body 12 of the collective substrate 10 includes, in order, a first nonmagnetic ferrite layer 16a, a first magnetic layer 14a, an intermediate nonmagnetic ferrite layer 16c, and a second magnetic layer 14b. The second nonmagnetic ferrite layer 16b is laminated. The first and second magnetic layers 14a and 14b include, for example, magnetic ferrite mainly composed of iron oxide, zinc oxide, nickel oxide, and copper oxide, and a ceramic material. That is, the first and second magnetic layers 14a and 14b include a magnetic ceramic material. The first and second nonmagnetic ferrite layers 16a and 16b and the intermediate nonmagnetic ferrite layer 16c include, for example, nonmagnetic ferrite mainly composed of iron oxide, zinc oxide and copper oxide, and a ceramic material. Each layer 14a, 14b, 16a, 16b, 16c consists of one layer or two or more laminated ceramic layers.

  As shown in FIG. 2, in the collective substrate 10, via-hole conductors 24 a and 24 b, a coil 20, and a wiring conductor 21 are formed in the individual substrate region 11 s of the substrate body 12. One end of the coil 20 is connected to the via-hole conductor 24a by a wiring conductor (not shown). Via-hole conductors 24 b and 24 a are connected by a wiring conductor 21.

  As shown in FIGS. 2 and 3, shrinkage suppression layers 30 and 32 are formed inside the peripheral region 11 t of the substrate body 12. The shrinkage suppression layers 30 and 32 are exposed on the end faces 12p and 12q of the substrate body 12 of the collective substrate 10. As will be described in detail later, the shrinkage suppression layer 30 separated from the break grooves 11p, 11q, 11x, and 11y is continuously formed so as to surround the periphery of the individual substrate region 11s. The shrinkage suppression layer 32 in the vicinity of the break grooves 11x and 11y is formed with slits 34 so that the shrinkage suppression layer 32 is not exposed to the break grooves 11x and 11y, and intermittently so as to surround the individual substrate region 11s. Is formed.

The via-hole conductors 24 a and 24 b are formed by interlayer connection conductors that penetrate the ceramic layer of the substrate body 12. The coil 20, the wiring conductor 21, and the shrinkage suppression layers 30 and 32 are formed by in-plane connection conductors that extend along the ceramic layer of the substrate body 12. Shrinkage control layers 30 and 32, but steps can be simplified by forming the same material as the coil 20 and the wiring conductor 21, it may be formed using a material different from that of the coil 20 and the wiring conductor 21.

  The coil 20 is formed inside the first and second magnetic layers 14a and 14b and the intermediate nonmagnetic ferrite layer 16c. Although the intermediate nonmagnetic ferrite layer 16c may be omitted, if the intermediate nonmagnetic ferrite layer 16c is formed between the first and second magnetic layers 14a and 14b, there is no intermediate nonmagnetic ferrite layer 16c and the magnetic layer It is preferable because the characteristics of the coil 20 can be improved (improvement of voltage conversion efficiency by suppressing iron loss, improvement of inductance value, etc.), compared with the case where the coil is formed only on the other side.

  The first and second magnetic layers 14a and 14b that are brittle and easily chipped are covered and protected by the first and second nonmagnetic ferrite layers 16a and 16b so as not to be exposed on the main surfaces 12a and 12b of the substrate body 12. ing.

  The collective substrate 10 can be manufactured by stacking and firing unsintered ceramic green sheets on which interlayer connection conductors and in-plane connection conductors are formed. The thickness of the substrate body 12 after baking is, for example, 100 to 2000 μm.

  Since the aggregate substrate 10 is formed such that the shrinkage suppression layers 30 and 32 extend to the end faces 12p and 12q of the substrate body 12 in the peripheral region 11t, the thickness of the peripheral region 11t of the substrate body 12 is substantially uniform. By increasing the thickness, the strength is improved.

  When the shrinkage suppression layer is separated from the end surface of the substrate body, the width of the break groove is widened by non-uniform baking shrinkage near the end surface of the substrate body, and the substrate is likely to crack starting from the break groove. When the shrinkage suppression layers 30 and 32 are formed so as to extend to the end surfaces 12p and 12q of the substrate body 12, the shrinkage during firing becomes substantially uniform up to the end surfaces 12p and 12q of the substrate body 12. The width of the break groove is constant, and the substrate starting from the break groove does not crack.

  In the peripheral region 11t of the substrate body 12, no shrinkage suppression layer is disposed on the surfaces of the one main surface 12a and the other main surface 12b of the substrate body 12. Shrinkage suppression layers 30 and 32 are disposed inside the surface other than the surface. Since the linear expansion coefficient of the in-plane connection conductor is larger than the linear expansion coefficient of the ceramic layer, compressive stress remains in the fired substrate body 12 and the substrate strength is improved.

  Shrinkage suppression layers 30 and 32 protrude from the end face of the fired laminate. Therefore, plating can be easily formed on the end faces 12p and 12q of the substrate body 12 which is a laminated body after firing. Even if the substrate body 12 has some cracks on the end faces 12p and 12q due to impact during handling, the cracks are repaired by plating.

  Furthermore, even when the end faces 12p and 12q are not cracked, the substrate itself can be reinforced by plating, so that the substrate can be prevented from cracking during the subsequent component mounting process or transfer between processes.

  If a material having a relatively low resistance and a current easily flows is used as the ceramic material for forming each layer of the substrate body 12, a current easily flows through the end surfaces 12 p and 12 q of the substrate body 12 during plating. Plating can be formed sufficiently for 12q.

  In this case, even if the distance between the shrinkage suppression layers 30 and 32 adjacent to each other in the thickness direction of the substrate body 12 (the stacking direction of each layer) is large, the end surfaces 12p and 12q of the substrate body 12 are strongly plated. It is possible to further suppress the breakage of the collective substrate during the subsequent component mounting process or conveyance between processes. Further, if the plated portions formed on the end faces 12p and 12q of the substrate body 12 are peeled off, a defect such as a short circuit or a disconnection may occur due to the adhesion of the peeled piece, but such a trouble can be prevented.

  Next, the manufacturing process of the collective substrate 10 will be described.

  (1) First, in order to form each layer of the ceramic layers of the substrate body 12 of the collective substrate 10, an unsintered ceramic green sheet containing a ceramic material powder and formed into a sheet shape is prepared.

  For example, magnetic ferrite containing iron oxide, zinc oxide, nickel oxide and copper oxide as main components is added to the ceramic green sheets to be the first and second magnetic layers 14a and 14b. For example, nonmagnetic ferrite containing iron oxide, zinc oxide, and copper oxide as main components is added to the ceramic green sheets that become the first and second nonmagnetic ferrite layers 16a and 16b and the intermediate nonmagnetic ferrite layer 16c.

  In the ceramic green sheet, through holes are formed at appropriate positions by laser processing, punching processing, or the like, and a conductive paste is embedded in the through holes by printing or the like, thereby forming an interlayer connection conductor that becomes a via hole conductor after firing. Moreover, the coil 20, the wiring conductor 21, and the shrinkage suppression layer are formed by printing a conductive paste on one main surface of the ceramic green sheet by a screen printing method or a gravure printing method or by transferring a metal foil having a predetermined pattern shape. In-plane connection conductors 30 and 32 are formed.

  A ceramic green sheet larger than the aggregate substrate 10 is prepared, and is cut into a predetermined size all at once after lamination.

  FIG. 4 is a plan view of the ceramic green sheet 15 that is separated from the breaking grooves 11p, 11q, 11x, and 11y. As shown in FIG. 4, a shrinkage suppression layer 30 that is continuous in a frame shape is formed on one main surface 15 a of the ceramic green sheet 15 outside the individual substrate region 11 s. The shrinkage suppression layer 30 is formed so as to protrude from the ear portion 15z outside the peripheral region 11t.

  FIG. 5 is a plan view of the ceramic green sheet 13 on which the shrinkage suppression layer 32 in the vicinity of the breaking grooves 11x and 11y is formed. As shown in FIG. 5, a frame-like shrinkage suppression layer 32 is formed on one main surface 13a of the ceramic green sheet 13 outside the individual substrate region 11s so as to surround the individual substrate region 11s. A slit 34 is formed in the suppression layer 32. Break grooves 11x and 11y are formed near the center of the slit 34 as shown in FIG. That is, the slits 34 are formed in the vicinity of the break grooves 11x and 11y so that the shrinkage suppression layer 32 is not exposed to the break grooves 11x and 11y.

  Although not shown, the plan view of the ceramic green sheet 13 on which the shrinkage suppression layer 32 in the vicinity of the breaking grooves 11p and 11q is formed is the same as that in FIG. A different point is that a slit 35 is formed in a region near the breaking grooves 11p and 11q so that the shrinkage suppression layer 32 is not exposed to the breaking grooves 11p and 11q. The width of the slit 35 is made larger than the width of the break grooves 11p and 11q.

  (2) Next, after unsintered ceramic green sheets forming each layer of the substrate body 12 are laminated in a predetermined order, a relatively small pressure is applied in the laminating direction to form a temporary pressure bonded body.

  (3) Next, the periphery of the temporary press-bonded body is cut to remove the ear portion of the ceramic green sheet, and a laminated body including only the portions 11s and 11t to be the aggregate substrate 10 is formed. At this time, the shrinkage suppression layers 30 and 32 are exposed at the end face of the laminate.

  That is, the ceramic green sheet 15 shown in FIG. 4 is cut along the boundary lines 15x and 15y between the portions 11s and 11t that become the collective substrate 10 and the ear part 15z, and the shrinkage suppression layer 30 is cut along the boundary lines 15x and 15y. Cut along. Thereby, as shown in FIGS. 2 and 3, the outer peripheral edges 30 x and 30 y of the shrinkage suppression layer 30 are continuously exposed on the end faces 12 p and 12 q of the collective substrate 10. As described above, when the outer peripheral edges 30x and 30y of the shrinkage suppression layer 30 are continuously exposed on the end faces 12p and 12q of the collective substrate 10 over the entire circumference, distortion due to shrinkage during firing can be suppressed uniformly.

  The ceramic green sheet 13 shown in FIG. 5 is cut along the boundary lines 13x and 13y between the portions 11s and 11t to be the aggregate substrate 10 and the ears 13z, and the shrinkage suppression layer 32 is along the boundary lines 13x and 13y. Disconnected. Thereby, as shown in FIGS. 2 and 3, the outer peripheral edges 32 x and 32 y of the shrinkage suppression layer 32 are intermittently exposed to the end faces 12 p and 12 q of the collective substrate 10. The shrinkage suppression layer 32 can suppress distortion due to shrinkage during firing substantially uniformly.

  (4) Next, the laminate is fired. By firing, the ceramic material powder contained in the ceramic green sheet forming each layer of the substrate body 12 is sintered.

  (5) Next, the fired laminate, that is, the substrate body 12 is taken out, and if necessary, the land electrodes 26a and 26b and the terminal electrodes 28a and 28b formed on the main surfaces 12a and 12b of the substrate body 12 are plated. Do.

  At this time, plating may be formed on the end faces 12p and 12q of the substrate body 12 of the collective substrate 10. Since the magnetic layers 14a and 14b and the shrinkage suppression layers 30 and 32 are exposed on the end faces 12p and 12q of the substrate body 12 of the aggregate substrate 10, the plating adheres firmly.

  (6) The collective substrate 10 completed through the above steps is mounted on the land electrodes 26a and 26b by mounting components such as the surface mount component 4 and the IC chip 2 into a module. Then, by cutting along the break grooves 11p, 11q, 11x, and 11y and dividing into individual substrates, a module component can be manufactured from the collective substrate 10.

  Comparative Example 1 FIG. 6 is a plan view of the substrate body 12x of the collective substrate of Comparative Example 1. FIG. FIG. 6 illustrates only the break grooves 11x and 11y formed on the main surface of the substrate body 12x, and omits illustration of land electrodes and terminal electrodes.

  Unlike the first embodiment, in the aggregate substrate 12x of Comparative Example 1, the shrinkage suppression layer formed in the peripheral region of the substrate body 12x is not exposed on the end faces 12p and 12q of the substrate body 12x. That is, in the unfired laminated body that becomes the substrate body 12x, a gap is provided between the outer peripheral edge of the ceramic green sheet and the shrinkage suppression layer. Therefore, since shrinkage during firing is not suppressed by the shrinkage suppression layer in the vicinity of the end face of the laminate, as shown in FIG. 6, the width of the break grooves 11x and 11y is locally near the end faces 12p and 12q of the substrate body 12x. Spreads and causes cracking of the substrate.

  On the other hand, in Example 1, the shrinkage | contraction suppression layers 30 and 32 are formed so that it may be exposed to the end surfaces 12p and 12q of the board | substrate body 12, and the end surfaces 12p and 12q vicinity of the board | substrate body 12 is inner side than it. Similar to the portion, shrinkage during firing is suppressed by the shrinkage suppression layers 30 and 32. Therefore, as shown in FIG. 1, since the break grooves 11x and 11y are formed without locally spreading in the vicinity of the end faces 12p and 12q of the substrate body 12, no substrate cracking occurs.

  <Manufacturing Example> The aggregate substrate having the configuration of Example 1 in which the size after baking is about 112 × 112 mm, the thickness after baking is 450 to 500 μm, and the groove for break having a depth of 40 to 50% of the substrate thickness is formed. When the end face of the board body was reinforced by plating, no cracks or board cracks were caused due to the configuration of the peripheral area of the board body during the component mounting process after the firing / plating process or during the transfer between the processes. On the other hand, in the case of the aggregate substrate having the configuration of Comparative Example 1 in which the shrinkage suppression layer is separated from the end surface of the substrate body, there are substrate cracks starting from the break grooves during firing, and cracks that do not cause substrate cracks. About several to 10%.

  <Summary> As described above, the shrinkage suppression layers 30 and 32 are formed inside the peripheral region 11t of the substrate body 12 of the collective substrate 10, and the shrinkage suppression layers 30 and 32 are the end faces 12p of the substrate body 12 of the collective substrate 10. By being configured to be exposed to 12q, it is possible to prevent the aggregate substrate 10 from being cracked or the aggregate substrate 10 from being cracked.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

  For example, each layer of the substrate body may be a ceramic layer that does not include magnetic ferrite or nonmagnetic ferrite.

10 collective substrate 11 part to become 11 substrate 11s substrate region 11t peripheral region 11p, 11q, 11x, 11y break groove 12 substrate body 12a, 12b main surface 12p, 12q end surface 14a, 14b magnetic layer 16a, 16b, 16c non-magnetic Ferrite layer 20 Coil 21 Wiring conductor 24a, 24b Via hole conductor 26a, 26b Land electrode 28a, 28b Terminal electrode 30, 32 Shrinkage suppression layer 34, 35 Slit

Claims (3)

A plurality of unsintered ceramic layers having a single substrate region including a portion to be a single substrate and a peripheral region surrounding the periphery of the single substrate region, and being laminated and pressure-bonded to each other;
A shrinkage suppression layer disposed between the ceramic layers adjacent to each other and formed in the peripheral region of the ceramic layer so as to be in contact with an outer peripheral edge of the ceramic layer;
With
The ceramic layer adjacent to the shrinkage suppression layer includes a magnetic ceramic material,
Break grooves for dividing into individual substrates are formed along at least one of the main surfaces exposed to the outside on both sides in the stacking direction of the ceramic layers, along the boundary line of the portion to be the individual substrate and its extension line,
A first step of preparing an unfired laminate;
A second step of firing the unfired laminate and forming a collective substrate with the laminate after firing;
Perform plating the laminate sintering is completed, the third step you characterized in that example Bei a current focus substrate manufacturing method of forming a plated layer on the end surface of the collective substrate. 2. The method according to claim 1, further comprising a fourth step of mounting a component on a portion of the aggregate substrate that becomes an individual substrate before dividing the aggregate substrate along the break groove. A method for manufacturing an aggregate substrate. A plurality of ceramic layers having a single substrate region including a portion to be a single substrate and a peripheral region surrounding the periphery of the single substrate region, and laminated and pressure-bonded to each other;
A shrinkage suppression layer disposed between the ceramic layers adjacent to each other and formed in the peripheral region of the ceramic layer;
With
The laminated ceramic layers are divided into individual substrates along at least one of the main surfaces exposed to the outside on both sides in the lamination direction of the ceramic layers, along the boundary line of the portion to be an individual substrate and its extension line. Break groove for forming,
The shrinkage suppression layer is exposed at an end surface that extends between the main surfaces of the laminated and pressure-bonded ceramic layers and is exposed to the outside ,
The collective substrate , wherein the plating adheres to the shrinkage suppression layer exposed on the end face .

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