JP2012089818A - Laminate type ceramic electronic component manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for a laminate type ceramic electronic component in which the conductive paste used to form side electrodes is not easily peeled off during a fabrication process.SOLUTION: Regarding an unsintered ceramic layer composed of at least one layer, (i) in a portion constituting an individual substrate, there are formed a plurality of first through holes 22 in rows spaced to and from a border line 29 in a portion constituting an individual substrate, (ii) the first through holes 22 are filled with conductive paste 24, (iii) a second through hole 28 partly overlapping the first through holes 22 and also reaching the border line 29 is formed, and (iv) the second through hole 28 is filled with a burning-out material 27. A via hole conductor which has had the conductive paste 24 sintered after unsintered ceramic layers were laminated and then calcined is exposed to a space formed as a result of the burning-out material 27 being destroyed by burning. The exposed via hole conductor is plated to form a side electrode.

Description

  The present invention relates to a method for manufacturing a multilayer ceramic electronic component, and more particularly to a method for manufacturing a multilayer ceramic electronic component having a side electrode.

  Conventionally, side electrodes 110 and 112 are provided on side surfaces 105 to 108 extending between main surfaces 103 and 104 of a main body 102 on which ceramic layers are laminated, such as a ceramic electronic component 101 shown in a perspective view of FIG. A configuration is proposed. The electronic component having such a structure includes a ceramic green sheet including a plurality of individual portions as shown in the cross-sectional view of FIG. 14A and the plan views of FIGS. 14B and 15C. After stacking and firing 122, it is manufactured by dividing into pieces.

  Specifically, first, rectangular electrode through holes 127 and 128 having a relatively large width so as to overlap the dividing lines 123 and 124 for dividing the ceramic green sheet 122 supported by the carrier film 121. The electrode through holes 127 and 128 are filled with a conductive paste. In this case, the electrode through holes 127 and 128 are not limited to a rectangular shape, but more preferably a rhombus, a hexagon, or the like. Next, the conductive lines 125 and 126 filled in the electrode through holes 127 and 128 are left on both sides of the split through holes 134 and 135 so as to overlap the dividing lines 123 and 124 and the electrode through holes 127 and 128. In addition, the dividing through holes 134 and 135 having a relatively small width are formed. Next, the dividing through holes 134 and 135 are filled with a burned-out material 137 that is burned down when the ceramic green sheet is fired. Next, a laminate in which the ceramic green sheets 122 are laminated is formed, and the laminate is fired. By burning, the burnt material 137 filled in the dividing through holes 134 and 135 is burned out to form cavities, and the conductive pastes 125 and 126 filled in the electrode through holes 127 and 128 are burned in this space. The side electrode thus formed is exposed. At this time, cracks may occur due to the difference in shrinkage rate during sintering between the conductive pastes 125 and 126 and the ceramic green sheet 122. Therefore, as shown in FIG. It is preferable that the shapes of 127 and 128 are formed in a diamond shape, a hexagon shape, or the like in advance so that the boundary between the side electrode after sintering and the ceramic does not become an acute angle. Next, the fired laminated body is divided into individual pieces along the dividing lines 123 and 124 (see, for example, Patent Document 1).

JP 2005-44886 A

  However, the conductive paste filled in the electrode through holes of the ceramic green sheet is easily peeled off during processing. For example, when mechanical punching using a mold is performed to form a through hole for division, the conductive paste filled in the electrode through hole is pulled by the mold and peeled off from the electrode through hole. Cheap. Also, if the burnout material is placed on the ceramic green sheet to fill the through-holes for splitting and scraped with a squeegee, if the scraping is too strong, the conductivity filled in the electrode through-holes The paste is pushed out from the electrode through-holes by the pressure applied from the burned material and easily peels off.

  In view of such circumstances, the present invention intends to provide a method for manufacturing a multilayer ceramic electronic component in which a conductive paste for forming a side electrode is difficult to peel off during processing.

  In order to solve the above problems, the present invention provides a method for manufacturing a multilayer ceramic electronic component configured as follows.

  A method for manufacturing a multilayer ceramic electronic component includes: laminating an unsintered ceramic layer including portions to be a plurality of individual substrates to form a laminate, firing the laminate, and then dividing the laminate into the individual substrates. Manufactures multilayer ceramic electronic components. In the method for manufacturing a multilayer ceramic electronic component, among the unsintered ceramic layers for forming the multilayer body, at least one of the first ceramic layers is (i) the portion that becomes the individual substrate, A first step of forming a plurality of first through holes arranged at intervals between the boundary lines of the portions to be the individual substrates; and (ii) a first step of filling the first through holes with a conductive paste. And (iii) the unsintered first ceramic layer filled with the conductive paste in the first through-hole, partially overlapping the first through-hole, and the boundary A third step of forming a second through hole reaching the line; and (iv) a fourth step of filling the second through hole with a burned-out material that is burned down when the laminate is fired. . After firing the laminated body, the conductive paste filled in the first through-hole of the first ceramic layer is sintered to form a via-hole conductor, and the via-hole conductor is formed from the first ceramic. The burnout material filled in the second through-hole of the layer is exposed in the space formed by burnout. The method for manufacturing a multilayer ceramic electronic component further includes a step of plating the via hole conductor exposed in the space to form a side electrode.

  According to the above configuration, by filling the plurality of first through holes with the conductive paste, the contact area where the conductive paste filled in the first through holes contacts the first ceramic layer increases, The contact area per volume of the conductive paste increases. As a result, when the second through hole is formed, peeling of the conductive paste filled in the first through hole can be suppressed.

  Preferably, among the unfired ceramic layers for forming the laminate, at least one second ceramic layer laminated on the first ceramic layer is: (a) the first ceramic layer; The second of the first ceramic layer when laminated to the first ceramic layer, leaving at least a portion of a region overlapping the first through hole of the first ceramic layer when laminated. Forming a third through hole in a region overlapping with the through hole, and (b) filling the third through hole with the burned material. A space formed by burning out the burned material filled in the third through hole of the second ceramic layer after firing the laminate is the second penetration of the first ceramic layer. The burned material filled in the holes communicates with the space formed by burning.

  In this case, since the first through hole is not formed in the second ceramic layer, the via hole conductor and the via hole conductor are adjacent to each other after firing as compared with the case where the first through hole is also formed in the second ceramic layer. The difference in thickness with the ceramic layer to be made can be reduced. Thereby, the waviness | corrugation and unevenness | corrugation of the main surface of the laminated body after baking can be suppressed, and the flatness of the main surface of a multilayer ceramic electronic component can be improved.

  Preferably, at least one of the first ceramic layers is filled in the first through hole on the main surface of the ceramic layer after the second step and before the third step. And a step of forming a conductive connection conductor so as to overlap the conductive paste.

  In this case, when the second through hole is formed in the third step, since the conductive paste filled in the first through hole of the first ceramic layer also contacts the connection conductor, the first through hole The peeling of the conductive paste filled in can be further suppressed.

  Preferably, the first ceramic layer includes a magnetic ferrite material.

  In this case, the first ceramic layer containing the magnetic ferrite material is likely to adhere to the plating. Therefore, it is easy to connect the spaces between the exposed via-hole conductors by plating and form the side electrodes integrally. It is.

  Preferably, a land electrode for mounting an electronic component is formed on the main surface of the laminate, and the side electrode is electrically connected to the land electrode.

  In this case, electromagnetic induction noise can be reduced. That is, when the wiring connected to the land electrode is formed inside the first ceramic layer containing the magnetic ferrite material, electromagnetic induction noise is generated, but the side electrode electrically connected to the land electrode is Since it is formed outside the first ceramic layer containing the magnetic ferrite material, electromagnetic induction noise can be reduced.

  In a preferred embodiment, the first ceramic layer includes a nonmagnetic ferrite material, and a wiring connecting the side electrode and the land electrode is in contact with the first ceramic layer made of the nonmagnetic ferrite material. .

  According to the present invention, the conductive paste for forming the side electrode is difficult to peel off during processing.

It is (a) principal part top view of a ceramic green sheet, (b) principal part sectional drawing. Example 1 It is (a) principal part top view of a ceramic green sheet, (b) principal part sectional drawing. Example 1 It is (a) principal part top view of a ceramic green sheet, (b) principal part sectional drawing. Example 1 It is (a) principal part top view of a ceramic green sheet, (b) principal part sectional drawing. Example 1 It is (a) principal part top view of a ceramic green sheet, (b) principal part sectional drawing. Example 1 It is sectional drawing of a multilayer ceramic electronic component. Example 1 It is sectional drawing of a multilayer ceramic electronic component. Example 1 It is (a) principal part top view of a ceramic green sheet, (b) principal part sectional drawing. (Modification 1) It is (a) principal part top view of a ceramic green sheet, (b) principal part sectional drawing. (Modification 1) It is (a) principal part top view of a ceramic green sheet, (b) principal part sectional drawing. (Modification 1) It is sectional drawing of a multilayer ceramic electronic component. (Another example 1 of Example 1) It is a principal part top view of a ceramic green sheet. (Another example 2 of Example 1) It is a perspective view of a multilayer ceramic electronic component. (Conventional example 1) It is (a) sectional drawing and (b) top view of a ceramic green sheet. (Conventional example 1) It is a top view of a ceramic green sheet. (Conventional example 2)

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  Example 1 A multilayer ceramic electronic component 10 of Example 1 will be described with reference to FIGS. 1 to 7, 11, and 12.

  FIG. 6 is a cross-sectional view of the multilayer ceramic electronic component 10. As shown in FIG. 6, in the multilayer ceramic electronic component 10, a land electrode 38 for mounting the component is formed on one main surface 12 a of the substrate body 12. The land electrode 38 is connected to a surface mount component 4 such as a semiconductor element 2 or a chip capacitor. When no component is mounted, the land electrode 38 can be eliminated.

  Side electrodes 40 and 42 are formed on the side surface 12 s of the substrate body 12. The side electrodes 40 and 42 may be used as external terminals for mounting the multilayer ceramic electronic component 10 on another circuit board or the like.

  In the substrate body 12, a first nonmagnetic ferrite layer 14a, a first magnetic ferrite layer 16a, an intermediate nonmagnetic ferrite layer 14b, a second magnetic ferrite layer 16b, and a second nonmagnetic ferrite layer 14c are laminated in order. ing. Each layer 14a, 14b, 14c, 16a, 16b is made of one or more ceramic layers.

  The first and second magnetic ferrite layers 16a and 16b include, for example, magnetic ferrite mainly composed of iron oxide, zinc oxide, nickel oxide, and copper oxide, and a ceramic material. That is, the first and second magnetic ferrite layers 16a and 16b include a magnetic ceramic material. The first and second nonmagnetic ferrite layers 14a and 14c and the intermediate nonmagnetic ferrite layer 14b include, for example, nonmagnetic ferrite mainly composed of iron oxide, zinc oxide, and copper oxide, and a ceramic material. The first and second magnetic ferrite layers 16a and 16b, which are brittle and easily chipped, are covered with the first and second nonmagnetic ferrite layers 14a and 14c so as not to be exposed on the main surfaces 12a and 12b of the substrate body 12, and are protected. Has been.

  The side electrodes 40, 42 extend in the stacking direction (vertical direction in the figure) in which the layers 14a, 14b, 14c, 16a, 16b of the substrate body 12 are stacked, and at least the first and second magnetic ferrite layers 16a, 16b and the intermediate nonmagnetic ferrite layer 14b. The end portions of the side electrodes 40 and 42 may be formed along the first and / or second nonmagnetic ferrite layers 14a and 14c.

  The side electrodes 40 and 42 are electrically connected to the land electrode 38 via the in-plane wiring conductors 32 and 34 and the interlayer connection conductor 36. As in the multilayer ceramic electronic component 10a shown in the sectional view of FIG. 7, in-plane wiring conductors 32a and 34a connected to the side electrodes 40 and 42 are formed between the magnetic ferrite layer 16a and the nonmagnetic ferrite layer 14a. May be. Further, as in the laminated ceramic electronic component 10b shown in the cross-sectional view of FIG. 11, in-plane wiring conductors 32b and 34b connected to the side electrodes 40 and 42 are formed on the outer surfaces of the nonmagnetic ferrite layers 14a and 14c. May be.

  Since the side electrodes 40 and 42 do not pass through the magnetic ferrite layers 16a and 16b, electromagnetic induction noise can be reduced. That is, if the wiring connected to the land electrode 38 is formed so as to penetrate through the inside of the magnetic ferrite layers 16a and 16b containing the magnetic ferrite material, the coupling between the wiring and the magnetic flux of the coil is increased, and electromagnetic induction is generated in the wiring. Noise is generated. Since the side electrodes 40 and 42 electrically connected to the land electrode 38 are formed outside the magnetic ferrite layers 16a and 16b, the coupling with the magnetic flux of the coil becomes weak, and electromagnetic induction noise can be reduced. In-plane wiring conductors 34, 34a, 34b are provided between the magnetic ferrite layer 16a and the nonmagnetic ferrite layer 14a, either on the inner layer of the nonmagnetic ferrite layer 14a or on the outer surface of the nonmagnetic ferrite layer 14a. In either case, a noise reduction effect can be obtained in the same manner.

When the wiring is connected to the chip capacitor in series, the inductance parasitic on the wiring affects the capacitance of the chip capacitor. The inductance of the wiring passing through the side electrodes 40 and 42 formed on the side surface 12s of the substrate body 12 is smaller than the inductance of the wiring penetrating through the magnetic ferrite layers 16a and 16b. When the side electrode is used, the influence on the capacitance of the chip capacitor can be reduced.

  When wiring is formed inside the substrate body, it is necessary to form an interlayer connection conductor with a space between the side surface of the substrate body, but when forming side electrodes, Since it is not necessary to provide a gap between the side surface and the side surface, the substrate body can be made smaller than when wiring is formed inside the substrate body.

  The multilayer ceramic electronic component 10 is manufactured by stacking unsintered ceramic layers including portions to be a plurality of individual substrates to form a laminate, firing the laminate, and then dividing the laminate into individual substrates. be able to. The thickness of the substrate body 12 after baking is, for example, 100 to 2000 μm.

  Next, the manufacturing process of the multilayer ceramic electronic component 10 will be described with reference to FIGS. 1-5, (a) is a principal part top view. (B) is principal part sectional drawing cut | disconnected along line XX of (a).

  (1) First, in order to form the ceramic layers of the respective layers 14a, 14b, 14c, 16a, and 16b of the substrate body 12, an unsintered ceramic green sheet containing ceramic material powder and formed into a sheet shape is prepared.

  For example, magnetic ferrite containing iron oxide, zinc oxide, nickel oxide and copper oxide as main components is added to the ceramic green sheets to be the first and second magnetic ferrite layers 16a and 16b. For example, nonmagnetic ferrite containing iron oxide, zinc oxide, and copper oxide as main components is added to the ceramic green sheets that become the first and second nonmagnetic ferrite layers 14a, 14c and the intermediate nonmagnetic ferrite layer 14b.

  As for the ceramic green sheet 20 on which the side electrodes 40 and 42 are formed, as shown in FIG. 1, a plurality of parts are arranged at intervals between a part to be separated and a boundary line 29 of the part to be separated. A first through hole 22 is formed. The boundary line 29 is included in a dividing line for dividing the boundary line 29 into pieces.

  For example, the first through hole 22 is laser processed from the lower surface 20b side of the ceramic green sheet 20 to which a carrier sheet (not shown) is attached. Alternatively, the first through hole 22 is formed by punching using a mold. The first through holes 22 may be separated from each other, may be in contact with each other at a single point, or may overlap and communicate with each other.

  Even if the first through holes 22 are formed in one row on one side of the boundary line 29 as shown in FIG. 1A, for example, as shown in the cross-sectional view of the main part in FIG. Two or more rows may be formed on one side.

  Next, as shown in FIG. 2, the first through hole 22 is filled with a paste-like conductive paste 24 containing a conductive material. For example, the first through hole 22 is filled with the conductive paste 24 from the lower surface 20b side of the ceramic green sheet 20 to which a carrier sheet (not shown) is attached, by a method such as screen printing.

  Next, as shown in FIG. 3, the second through hole 28 is formed so as to overlap the boundary line 29. For example, the second through hole 28 is formed by punching using a mold.

  The second through holes 28 are formed so as to partially overlap the first through holes 22. As a result, an opening 25 is formed in which the first through hole 22 and the second through hole 28 communicate with each other, and a cut surface of the conductive paste 24 filled in the first through hole 22 is exposed in the opening 25. To do.

  By filling the plurality of first through holes 22 with the conductive paste 24, the contact area where the conductive paste 24 filled in the first through holes 22 comes into contact with the ceramic green sheet 20 increases, and the conductive paste 24. The contact area per volume increases. As a result, when the second through hole 28 is formed, peeling of the conductive paste 24 filled in the first through hole 22 can be suppressed.

  For example, the first through hole 22 having a conical shape or a cylindrical shape is formed, and the second through hole 28 is formed so as not to include the center line of the conical shape or the cylindrical shape of the first through hole 22. More than half of the circular cross section of the through hole 22 is left. In this case, the opening 25 formed by forming the second through hole 28 is smaller than the maximum cross section parallel to the opening 25 of the conductive paste 24 filled in the first through hole 22. The conductive paste 24 filled in one through hole 22 is unlikely to come out of the opening 25. That is, the conductive paste 24 filled in the first through hole 22 is unlikely to peel from the ceramic green sheet 20 when the second through hole 28 is formed.

  When the first through holes are formed so as to overlap each other, the conductive paste filled in each first through hole is connected and integrated. In this case, the first through holes are less likely to peel from the ceramic green sheet when the second through holes are formed as compared with the case where the first through holes are formed so as to be in contact with each other or separated from each other.

  Next, from the lower surface 20b side of the ceramic green sheet 20 to which a carrier sheet (not shown) is attached, the burnout material 27 that is burned down when the laminate is fired into the second through hole 28 by a method such as screen printing. Fill with carbon paste.

  For the ceramic green sheet 20x in which the side electrodes 40 and 42 are not formed, as shown in FIG. 5, only the third through hole 22x is processed by the same method without forming the first through hole, The through-holes 22x are filled with a burned-out material 27 such as carbon paste. The third through hole 22x is formed in a region overlapping the second through hole 22 when the ceramic green sheets 20 and 20x are stacked.

  Although not shown, conductive paste is printed on the upper surface 20a or the lower surface 20b of the ceramic green sheets 20 and 20a by a screen printing method, a gravure printing method, or a metal foil having a predetermined pattern shape is transferred. By the method, the in-plane connection conductors 32, 32a, 34, and 34a to be the coil 30 and the wiring conductor are formed. For the ceramic green sheets 20 and 20x forming the interlayer connection conductor 36, a through hole is formed by the same method as filling the first through hole 22 with the conductive paste 24, and the through hole is electrically conductive. Fill with paste. Moreover, the groove | channel for a break which overlaps the dividing line for dividing | segmenting into a piece is formed in the part used as the main surfaces 12a and 12b of the board | substrate body 12 among ceramic green sheets.

  (2) Next, the unsintered ceramic green sheets forming the layers of the substrate body 12 are laminated in a predetermined order to form a laminate. At this time, the position of the second through hole 28 of the ceramic green sheet 20 in which the first through hole 22 is formed, and the third through hole 28x of the ceramic green sheet 20x in which the first through hole 22 is not formed. Laminate so as to overlap with the position.

  (3) Next, the laminate is fired. By firing, the ceramic material powder and the conductive paste contained in the ceramic green sheet forming each layer of the substrate body 12 are sintered. The conductive paste 24 filled in the first through hole 22 is sintered to form a via-hole conductor. Since the burnt-out material 27 filled in the second through hole 28 and the third through hole 28x is burned off by firing, a space that penetrates in the stacking direction in which the layers of the stacked body are stacked is formed in the fired stacked body. The via hole conductor is exposed in this space.

  (4) Next, the land electrode of the fired laminated body and the via hole conductor exposed in the space are plated. At this time, since the plating easily adheres to the end surfaces of the magnetic ferrite layers 16a and 16b, even if the via-hole conductors are exposed with a gap, the end surfaces of the magnetic ferrite layers 16a and 16b are connected so as to connect them. The side electrodes 40 and 42 connected to the plurality of via-hole conductors are formed by plating.

  (6) Next, after mounting components such as the surface-mounted component 4 and the semiconductor element 2 on the land electrode, the multilayer ceramic electronic component 10 is obtained by cutting along the breaking groove and dividing into pieces. Can do.

  <Modification 1> As shown in FIGS. 8 to 10, a connection conductor 26 may be formed on the ceramic green sheet 20. 8-10, (a) is a principal part top view. (B) is principal part sectional drawing cut | disconnected along line XX of (a).

  As shown in FIG. 8, the first through hole 22 is formed in the ceramic green sheet 20, the conductive paste 24 is filled in the first through hole 22, and then the conductive material filled in the first through hole 22 is formed. A connection conductor 26 that overlaps the paste 24 is formed. The connection conductor 26 is formed by applying a conductive paste by screen printing or attaching a metal foil. The shape of the connection conductor 26 may be a rectangular shape, but may be a shape such as a hexagonal shape or a rhombus whose long side portion is located with respect to the boundary line 29.

  Next, as shown in FIG. 9, a second through hole 28 is formed. The ceramic green sheet 20, the conductive paste 24, and the connection conductor 26 are partially removed. Since the conductive paste 24 filled in the first through-hole 22 is also in contact with the connection conductor 26, the ceramic green sheet is formed when the second through-hole 28 is formed as compared with the case where the connection conductor 26 is not provided. From 20, it becomes more difficult to peel off.

  Next, as shown in FIG. 10, the burnout material 27 is filled in the second through hole 28.

  The connection conductor 26 may be formed not only to overlap the conductive paste 24 filled in the first through-hole 22 but also to extend along the ceramic green sheet 20 and also serve as an in-plane connection conductor.

  <Modification 2> The ceramic green sheet of the magnetic ferrite layers 16a and 16b on which the side electrodes 40 and 42 are formed is a ceramic green sheet 20x in which the third through hole 28x is filled with the burned-out material 27 as shown in FIG. May be included. In this case, the ceramic green sheet 20x in which the first through hole 22 is not formed is laminated between the ceramic green sheets 20 in which the first through hole 22 is filled with the conductive paste, whereby the via hole conductor is formed. Even if they are formed apart from each other in the stacking direction, the plating easily adheres to the end faces of the magnetic ferrite layers 16a and 16b, so that the side electrodes can be formed so as to connect the separated via-hole conductors.

  A ceramic green sheet 20x in which no first through hole is formed is interposed between the ceramic green sheets 20 in which the first through hole 22 is filled with the conductive paste, and the conductive paste is placed in the first through hole 22. If the number of ceramic green sheets 20 filled with 24 is reduced, the flatness of the main surfaces 12a and 12b of the substrate body 12 can be increased.

  That is, the conductive paste 24 filled in the first through-hole 22 has a dimension (thickness) in the stacking direction before firing by the thickness of the carrier film attached to the ceramic green sheet 20 rather than the ceramic green sheet 20. ) Is large, and the shrinkage ratio during firing is smaller than that of the ceramic green sheet 20. Therefore, the dimension in the stacking direction of the via-hole conductor in which the conductive paste 24 filled in the first through-hole 22 is sintered is larger than the thickness of the ceramic layer on which the via-hole conductor is formed. This causes the flatness of 12a and 12b to decrease.

  When the number of ceramic green sheets 20 in which the first through holes 22 are filled with the conductive paste 24 is reduced, such a decrease in the flatness of the main surfaces 12a and 12b of the substrate body 12 is suppressed, and The flatness of the main surfaces 12a, 12a can be increased.

  <Summary> As described above, when the plurality of first through holes are formed and the conductive paste is filled in order to form the side electrode, the filled conductive paste is difficult to peel off during processing.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

  For example, the present invention can be widely applied to multilayer ceramic electronic components other than the multilayer ceramic electronic component in which a coil is formed.

10, 10a, 10b Multilayer ceramic electronic component 12 Substrate body 12a, 12b Main surface 12s Side surface 14a, 14b, 14c Nonmagnetic ferrite layer 16a, 16b Magnetic ferrite layer 20, 20x Ceramic green sheet 22, 22x First through hole 24 Conductive paste 25 Opening 26 Connection conductor 27 Burned material 28, 28x Second through hole 29 Boundary line 32, 32a, 32b In-plane wiring conductor 34, 34a, 34b In-cotton wiring conductor 36 Interlayer connection conductor 38 Land electrode 40, 42 Side surface electrode

Claims (6)

A method of manufacturing a multilayer ceramic electronic component by laminating an unsintered ceramic layer including portions to be a plurality of individual substrates to form a laminate, firing the laminate and then dividing the laminate into individual substrates In
Among the unsintered ceramic layers for forming the laminate, at least one first ceramic layer,
A first step of forming a plurality of first through holes arranged at intervals between the portion to be the individual substrate and a boundary line of the portion to be the individual substrate;
A second step of filling the first through hole with a conductive paste;
A second through hole that partially overlaps the first through hole and reaches the boundary line on the unfired first ceramic layer in which the first through hole is filled with the conductive paste. A third step of forming
A fourth step of filling the second through hole with a burnt-out material that burns down when the laminate is fired;
With
After firing the laminated body, the conductive paste filled in the first through-hole of the first ceramic layer is sintered to form a via-hole conductor, and the via-hole conductor is formed from the first ceramic. The burnout material filled in the second through holes of the layer is exposed in the space formed by burning,
A method for manufacturing a ceramic electronic component, further comprising a step of performing a plating process on the via-hole conductor exposed in the space to form a side electrode. Among the unfired ceramic layers for forming the laminated body, at least one second ceramic layer laminated on the first ceramic layer,
When laminated on the first ceramic layer, the first ceramic layer is laminated on the first ceramic layer, leaving at least a portion of the first ceramic layer overlapping with the first through hole. Forming a third through hole in a region of the ceramic layer overlapping the second through hole;
Filling the third through hole with the burned material;
With
A space formed by burning out the burned material filled in the third through hole of the second ceramic layer after firing the laminate is the second penetration of the first ceramic layer. 2. The method of manufacturing a ceramic electronic component according to claim 1, wherein the burned material filled in the holes communicates with the space formed by burning. For at least one of the first ceramic layers,
After the second step and before the third step, the connecting conductor having conductivity so as to overlap the conductive paste filled in the first through hole on the main surface of the ceramic layer. Forming the step,
The method for manufacturing a ceramic electronic component according to claim 1, further comprising:   4. The method of manufacturing a multilayer ceramic electronic component according to claim 1, wherein the first ceramic layer includes a magnetic ferrite material. 5.   5. The multilayer ceramic according to claim 4, wherein a land electrode for mounting an electronic component is formed on a main surface of the multilayer body, and the side electrode is electrically connected to the land electrode. Manufacturing method of electronic components.   The first ceramic layer includes a non-magnetic ferrite material, and a wiring connecting the side electrode and the land electrode is in contact with the first ceramic layer made of the non-magnetic ferrite material. The manufacturing method of the multilayer ceramic electronic component of Claim 5.

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