JP2016021476A - Electronic component storage package, package assembly, and manufacturing method of electronic component storage package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component storage package or the like capable of easily suppressing short-circuiting or the like of a side face conductor provided in a groove on an inner side face of a recess of an insulation substrate.SOLUTION: The electronic component storage package or the like includes the insulation substrate and a side face conductor 109. The insulation substrate includes: a lower insulation layer 103 including a top face including a packaging part 105 for packaging an electronic component; and a frame-shaped upper insulation layer 104 laminated on the lower insulation layer 103 while surrounding the packaging part 105. On the inner side face of the upper insulation layer 104, a groove 108 is formed from a lower end to an upper end of the inner side face. The side face conductor 109 is provided in the groove 108. In a cross-sectional view of the groove 108 and the side face conductor 109 provided within the groove 108 in a longitudinal direction, an angle θ1 formed from the top face of the lower insulation layer 103 and the inner side face of the groove 108 is smaller than an angle θ2 formed from the top face and an exposed surface of the side face conductor 109 provided within the groove 108.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component housing package for hermetically housing electronic components such as piezoelectric vibrators and semiconductor elements, a package assembly, and an electronic component housing package manufacturing method.

  Conventionally, as an electronic component storage package for mounting an electronic component such as a piezoelectric vibrator or a semiconductor element, generally, an electronic component storage portion provided on an insulating substrate made of a ceramic sintered body or the like is closed with a lid. The one that is hermetically sealed is used. Such an electronic component storage package includes a flat lower insulating layer having an electronic component mounting portion on the upper surface, and a frame-shaped upper insulating layer laminated around the mounting portion on the upper surface of the lower insulating layer. Basically, it has an insulating substrate, a frame-like metallized layer that is formed on the upper surface of the insulating substrate (upper insulating layer) and serves as a bonding surface of the lid, and a wiring conductor formed from the mounting portion to the lower surface of the lower insulating layer, etc. It is configured. An electronic component is mounted on the mounting portion, and after each electrode of the electronic component is electrically connected to the wiring conductor, a metal lid is joined to the upper surface of the frame-like metallized layer via a brazing material, An electronic device is manufactured by hermetically sealing an electronic component inside a container composed of an insulating substrate and a lid.

  A through conductor may be formed in the upper and lower directions inside the upper insulating layer of the insulating substrate. In this case, the frame-like metallized layer is electrically connected to the wiring conductor via this through conductor. Thereby, for example, the stability of the ground and the shielding property with respect to the electronic component are enhanced.

  The electronic component storage package tends to be reduced in size, and accordingly, the width of the frame-like upper insulating layer tends to be narrow. When the width of the frame-shaped upper insulating layer becomes narrower, when a through conductor is formed inside the upper insulating layer, the distance from the outer periphery of the through conductor to the inner or outer surface of the upper insulating layer becomes extremely small, and mechanical There is a high possibility that the upper insulating layer will crack due to a decrease in strength and the like and the airtight reliability will be reduced.

  For such problems, a groove is formed on the inner surface of the upper insulating layer from the upper end to the lower end, and a conductor for electrically connecting the frame-like metallized layer and the wiring conductor of the lower insulating layer is formed in the groove. A structure in which a side conductor is formed by filling is proposed.

The groove on the inner surface of the upper insulating layer and the conductor in the groove are provided with a through hole in a flat, non-sintered ceramic material (ceramic green sheet or the like) serving as an insulating substrate. It is formed by a manufacturing method including a step of filling a metal paste. If this ceramic green sheet is punched (processed into a frame shape) within a range in which the conductor filled in the through hole is divided into two in the vertical direction, a frame having a groove filled with a metal paste serving as a conductor Shaped ceramic green sheet can be produced. This frame-shaped ceramic green sheet is laminated on a flat ceramic green sheet serving as a lower insulating layer and then fired to manufacture an electronic component storage package.

JP 2000-312060

  However, in recent years, electronic component storage packages have been increasingly miniaturized. As a result, the following problems have arisen.

  That is, since the size of the groove formed on the inner surface of the frame-shaped upper insulating layer becomes very small, the punching process is performed to divide the through hole and the metal paste into the ceramic green sheet to be the upper insulating layer. At the time of application, there is a possibility that the metal paste filled in the groove portion becomes too thin (tapered) on the lower end side of the inner side surface of the upper insulating layer due to the positional deviation of the punching range. The above-mentioned taper is likely to occur on the lower end side that becomes the punching end surface in the punching process. In this case, there is a possibility that the conductivity of the side conductor is lowered or the wire is broken.

  An electronic component storage package according to one aspect of the present invention includes a lower insulating layer having an upper surface including a mounting portion for mounting an electronic component, and a frame shape laminated on the lower insulating layer so as to surround the mounting portion. An upper insulating layer, and an insulating substrate in which a groove portion is formed on the inner side surface of the upper insulating layer from the lower end to the upper end of the inner side surface, and a side conductor provided in the groove portion. The angle θ1 formed by the upper surface of the lower insulating layer and the inner surface of the groove portion is provided in the upper surface and the groove portion in a longitudinal sectional view of the groove portion and the side conductor provided in the groove portion. It is smaller than an angle θ2 formed with the exposed surface of the side conductor.

  A package assembly according to an aspect of the present invention is characterized in that a plurality of electronic component storage packages having the above-described configuration are formed and arranged.

  According to one aspect of the present invention, there is provided a method for manufacturing an electronic component storage package, comprising: a flat plate-like first ceramic green sheet; and a frame having an inner surface, and a groove portion extending from the lower end to the upper end of the inner surface. (2) a step of preparing a ceramic green sheet; a step of applying a metallized paste on the inner surface of the groove; and a layer of the second ceramic green sheet coated with the metallized paste on the upper surface of the first ceramic green sheet. A step of preparing the second ceramic green sheet, and in the step of preparing the second ceramic green sheet, the upper surface of the first ceramic green sheet and the groove portion of the second ceramic green sheet in the laminate The angle θ1 formed with the side surface is a dew of the metallized paste applied to the upper surface and the groove. Characterized by preparing to be smaller than the angle θ2 of the surface.

  According to the electronic component housing package of one aspect of the present invention, the angle θ1 formed between the upper surface of the lower insulating layer and the inner surface of the groove portion in the longitudinal sectional view of the groove portion and the side conductor provided in the groove portion is The angle θ2 formed by the upper surface and the exposed surface of the side conductor provided in the groove is smaller. Therefore, on the lower end side of the side conductor, the thickness of the side conductor (the distance between the exposed surface of the side conductor and the surface opposite to this surface) can be made relatively large. That is, the possibility of the side conductor tapering is reduced. Accordingly, the decrease in the conductivity of the side conductor and the occurrence of disconnection are suppressed.

  In addition, according to the package assembly of the present invention, since a plurality of electronic component storage packages having the above-described configuration are formed to be arranged, an electronic component in which a decrease in electrical conductivity of the side conductor and occurrence of disconnection are suppressed. The storage package can be produced efficiently.

  According to the method for manufacturing an electronic component storage package of the present invention, since the above-described steps are included, it is possible to suppress a decrease in electrical conductivity and disconnection of the side conductor, and to improve the stability and shielding performance of the ground. A package for storing electronic components can be manufactured.

(A) is a top view which shows the electronic component storage package and package assembly of embodiment of this invention, (b) is sectional drawing in the X-X 'line | wire of (a). (A) is an enlarged top view which shows the principal part of Fig.1 (a), (b) is sectional drawing in the X-X 'line | wire of (a). (A)-(c) is the principal part enlarged top view which shows the package for electronic components accommodation and package assembly of other embodiment of this invention, respectively. (A)-(e) is sectional drawing which shows the manufacturing method of the electronic component storage package of embodiment of this invention in order of a process. (A) It is a top view which shows an example of the jig | tool used with the manufacturing method of the electronic component storage package of embodiment of this invention, (b) is a side view of the A direction of (a), (c ) Is a side view in the B direction of (a). (A)-(d) is a schematic diagram for demonstrating the process of drilling a ceramic green sheet using the jig | tool shown in FIG.

An electronic component storage package and the like of the present invention will be described with reference to the accompanying drawings. FIG. 1A is a top view illustrating an example of an embodiment of an electronic component storage package and an assembly thereof according to the present invention, and FIG. 1B is a cross-sectional view taken along line XX ′ in FIG. FIG. A package assembly is formed by arranging wiring board regions 102 each serving as an individual electronic component storage package on the mother board 101. The mother substrate 101 has a lower insulating layer 103 and an upper insulating layer 104 including a frame-like portion stacked on each other. The upper insulating layer 104 has a mounting portion 105 on the upper surface.
A recess 106 is provided in the mother substrate 101 by the lower insulating layer 103 and the frame-shaped portion of the upper insulating layer 104. The upper insulating layer 104 has a frame-like metallized layer 107 on its upper surface and a groove 108 on its inner surface. A side conductor 109 is disposed in the groove 108. The mother board 101 is provided with a dividing groove 111 for dividing the wiring board region 102 into pieces. In addition, in the wiring board region 102,
A wiring conductor 112 and an external connection conductor 113 are provided as a conductive path between an electronic component (not shown) mounted on the mounting portion 105 and an external electric circuit (not shown). In this example, a castellation 114 is provided at a corner portion of the wiring board region 102, and an auxiliary conductor 115 is formed on the upper surface of the mounting portion 105.

A substrate obtained by dividing the mother board 101 into individual pieces is an insulating board of each electronic component storage package. For the lower insulating layer and the upper insulating layer included in the insulating substrate (without reference numerals), the same reference numerals as those of the lower insulating layer 103 and the upper insulating layer 104 of the mother substrate 101 are used.

An electronic component storage package in which a plurality of wiring board regions 102 are divided into individual pieces has a frame shape on a flat lower insulating layer 103 having a mounting portion 105 for mounting electronic components at the center of the upper surface. The upper insulating layer 104 includes an insulating substrate laminated so as to surround the mounting portion 105. A recess 106 for hermetically sealing the electronic component is formed on the upper surface of the insulating substrate by the upper surface of the lower insulating layer 103 and the inner surface of the upper insulating layer 104.

The lower insulating layer 103 and the upper insulating layer 104 are made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic sintered body. For example, the lower insulating layer 103 and the upper insulating layer 104 made of the same ceramic material are simultaneously fired to produce the package assembly mother substrate 101 (insulating substrate of the electronic component storage package).

The insulating substrate has, for example, a rectangular shape with a side length of about 1.6 to 10 mm in a plan view and a thickness of about 0.3 to 2 mm, and has an above-described concave portion 106 on the upper surface. doing. Note that the lower insulating layer 103 and the upper insulating layer 104 constituting the insulating substrate may each be formed by stacking a plurality of insulating layers.

Here, when the electronic device is such that a plurality of electronic components (not shown) such as TCXO (Temperature Compensated Crystal Oscillator) are accommodated in the recess 106, the plurality of electronic components In order to form a stepped mounting portion (not shown) on which the upper insulating layer 104 is mounted, the upper insulating layer 104 may be composed of two or more insulating layers.

If the lower insulating layer 103 and the upper insulating layer 104 are both made of an aluminum oxide sintered body, the mother substrate 101 is manufactured, for example, as follows. First, a suitable organic binder, solvent, plasticizer, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide and calcium oxide to form a slurry, and this is, for example, a doctor blade method or a roll calender method. A plurality of ceramic green sheets are obtained by forming into a sheet by a sheet forming method. Next, some of the ceramic green sheets are appropriately punched into a frame shape, and the frame-shaped ceramic green sheet is positioned on a flat ceramic green sheet that is not formed into a frame shape. Laminate up and down. Thereafter, the mother board 101 is manufactured by firing the laminated body at a high temperature.

The mounting portion 105 has a quadrangular shape in accordance with, for example, a square plate-shaped electronic component. In the example of FIG.
A pair of wiring conductors 112 is formed at two adjacent corner portions. The wiring conductor 112 functions as a connection conductor for connecting an electrode (not shown) of an electronic component such as a crystal resonator element mounted on the mounting portion 105. An electronic component usually has a quadrangular outer shape, and a pair of electrodes (not shown) for connection are formed at corners of the main surface. The wiring conductor 112 is formed at the corner portion of the mounting portion 105 so that such electrodes can be connected easily and reliably.

Each electrode of the electronic component and the wiring conductor 112 are connected through a bonding material (not shown) such as a conductive adhesive. That is, the electronic component is positioned on the mounting portion 105 so that the electrode formed at the corner portion of the main surface of the electronic component faces the wiring conductor 112, and the bonding material previously attached to the wiring conductor 112 is heated. Once cured, the electrode of the electronic component and the wiring conductor 112 are connected.

The wiring conductor 112 is formed at the position as described above because an example in which a crystal resonator element is used as an electronic component is described in the example of this embodiment, but other electronic components (not shown) ) Or a plurality of other electronic components, the position and shape may be changed according to the arrangement of the electrodes of the electronic component. Examples of such electronic components include piezoelectric elements such as ceramic piezoelectric elements and surface acoustic wave elements, semiconductor elements, capacitive elements, resistors, and the like.

For example, the wiring conductor 112 is electrically derived from the mounting portion 105 or its periphery to the outer surface of the wiring board region 102. The wiring conductor 112 functions as a part of a conductive path for electrically connecting each electrode of the electronic component mounted on the mounting unit 105 to an external electric circuit (not shown). In the example shown in FIG. 1, the wiring conductor 112 is electrically connected to the lower surface of the wiring board region 102 (lower insulating layer 103) through a through conductor (not indicated) formed in the lower insulating layer 103 from the mounting portion 105. It is led out and electrically connected to the external connection conductor 113 formed on the lower surface. The electrical connection between the wiring conductor 112 and the external connection conductor 113 is, for example, other conductors (not shown) in addition to the through conductors.
It may be performed by a connection conductor including

A frame-like metallized layer 107 is deposited on the upper surface of the wiring board region 102 (upper insulating layer 104). The frame-shaped metallized layer 107 surrounds the mounting portion 105, and this frame-shaped metallized layer 10
A lid 110 and a metal frame (not shown) are joined to 7. Then, by mounting an electronic component on the mounting portion 105 and connecting the electrode of the electronic component to the wiring conductor 112 with a bonding material such as a conductive adhesive, the lid 110 is bonded to the upper surface of the frame-like metallized layer 107. An electronic component is hermetically sealed in a container composed of a lid 110 and an insulating substrate to form an electronic device (a crystal oscillator or the like). Alternatively, the lid 110 may be bonded onto the metal frame after the metal frame is brazed to the frame-like metallized layer 107 in advance.

The frame-like metallized layer 107 functions as a metal member for joining the lid 110 to the insulating substrate by a method such as seam welding or electron beam welding. The lid 110 has, for example, a square plate shape, and is made of a metal material such as an iron-nickel alloy or an iron-nickel-cobalt alloy, or a ceramic material, and can be brazed or welded (for example, seam welding or electron beam welding). The outer peripheral portion of the lower surface is bonded to the frame-like metallized layer 107 by a bonding method. When the lid 110 is made of a ceramic material, a metallization method or a plating method is applied to a region to be a joint surface of the lid 110 so that the lid 110 can be joined to the frame-like metallization layer 107 by a brazing method or a welding method. A metal layer (not shown) for bonding is formed by such a method.

The frame-like metallized layer 107 may be electrically connected to a part of the wiring conductor 112 (for example, one to which a grounding electrode of an electronic component is connected) via a side conductor 109 described later. In this case, for example, the area of the grounding conductor can be widened to further stabilize the ground potential with the electronic component. The frame-like metallized layer 107 may be further electrically connected to the external connection conductor 113. The electrical connection between the frame-shaped metallized layer 107 and the external connection conductor 113 is, for example, a caster deposited in a through-hole formed in an auxiliary conductor 115 and a lower insulating layer 103 described later in addition to the side conductor 109 described above. This is done via a ration conductor (not shown).

In the plurality of wiring board regions 102 included in the package assembly, the wiring conductors 112 and the like are electrically connected to each other in the mother board 101. For example, when the external connection conductor 113 of the individual electronic component storage package on which the electronic component is mounted is connected to an external electric circuit via solder or the like, the electrode of the electronic component becomes the wiring conductor 112, the through conductor And, it is electrically connected to an external electric circuit through the external connection conductor 113.

Conductor portions such as the wiring conductor 112, the frame-like metallized layer 107, and the external connection conductor 113 are, for example,
It consists of a metallized layer of tungsten, molybdenum, manganese, copper, silver or the like. Such a metal material paste (metal paste) serving as a metallized layer is formed by printing in a predetermined pattern on a ceramic green sheet serving as a base substrate 101 and simultaneously firing with each ceramic green sheet.

The wiring conductor 112, the frame-like metallized layer 107, and the external connection conductor 113 prevent oxidative corrosion, and connect the wiring conductor 112 and the electrode of the electronic component, or connect the external connection conductor 113 and an external electric circuit. In order to make the film easier and stronger, a nickel plating layer having a thickness of about 1 to 20 μm and a gold plating layer having a thickness of about 0.1 to 3.0 μm are sequentially deposited on the exposed surfaces. Good.

A groove 108 is provided on the inner side surface of the upper insulating layer 104, and the side conductor 109 described above is provided in the groove 108. The side conductor 109 is made of, for example, the same metal material as the wiring conductor 112 and the like, and is formed by the same method. In addition, the groove portion 108 is provided with a through-hole so as to straddle the outer periphery of the portion to be punched before the ceramic green sheet to be the upper insulating layer 104 is punched and formed into a frame shape as described above, for example. Can be formed. When this ceramic green sheet is punched at the part to be punched, the through hole is divided in the vertical direction, and a groove 108 is formed on the inner surface of the frame-shaped ceramic green sheet. At the time of this punching, if the metallized paste that becomes the side conductor 109 is filled in the through hole in advance, a groove portion 108 that is filled with the metallized paste that becomes the side conductor 109 is provided.

The side conductor 109 has a side surface provided with an angle θ1 formed between the upper surface of the lower insulating layer 103 and the inner side surface of the groove 108 (hereinafter also referred to as a groove angle) θ1 in the upper surface and the groove 108 in a longitudinal sectional view. The angle formed with the exposed surface of the conductor 109 (hereinafter also referred to as a conductor angle) θ2 is smaller.

Since the side conductor 109 has an angle difference between the groove angle θ1 and the conductor angle θ2, the thickness (distance between the exposed surface of the side conductor 109 and the surface opposite to the surface) is increased toward the lower side. Is easy. That is, it is easy to reduce the possibility of the side conductor 109 being tapered. Therefore, the decrease in conductivity and disconnection of the side conductor 109 are suppressed.

In this embodiment, for example, the groove 108 and the side conductor 109 are arranged at the corner of the upper surface of the upper insulating layer 104 having a rectangular frame shape. Further, the corner portion is formed in an arc shape in the plan view. In other words, the upper surface of the upper insulating layer 104 projects to the mounting portion 105 side at the corner portion. In this case, it is advantageous to effectively suppress the narrowing of the upper surface of the upper insulating layer 104 due to the presence of the groove 108.

Further, for example, as shown in FIGS. 2A and 2B, when the groove 108 is formed in a relatively wide portion of the upper insulating layer 104, the thickness of the lower side conductor 109 is reduced. It is easier to make it relatively large. That is, in this case, a relatively wide area excluding the mounting portion 105 side of the arc-shaped side conductor 109 in plan view (about 3/4 of the virtual circumference obtained by extending the outer periphery of the arc-shaped side conductor 109) In the region). 2A and 2B are schematic views for explaining the effect of the electronic component storage package of the present invention, and are enlarged views of the main part of FIGS. 1A and 1B. In FIG. 2, the same parts as those in FIG.

Further, as shown in FIG. 2A, the inner periphery of the corner portion of the upper insulating layer 104 has an arc shape in plan view, and this arc-shaped portion (that is, the inner side surface of the upper insulating layer 104 in plan view is the mounting portion). When the groove 108 is formed in a portion including the portion curved to the 105 side, the following may be performed. That is, at the upper end of the groove portion 108, both ends thereof are located in the arc-shaped portion, and at the lower end surface of the groove portion 108, both ends of the groove portion 108 are adjacent to the arc-shaped portion. You may make it contact | connect a side part.

In the case of such a structure, the side conductor 109 provided in the groove 108 has a metal paste that becomes the side conductor 109 on the upper side when a positional deviation or the like in the range in which the opening that becomes the recess 106 is punched occurs. Tapering at the lower end side of the inner side surface of the insulating layer 104 is further effectively suppressed.

That is, when the corner portion of the upper insulating layer 104 has an arc shape in plan view, the groove portion 108 is formed in this arc-shaped portion (that is, the portion in which the inner side surface of the upper insulating layer 104 is curved toward the mounting portion 105 side in plan view). Therefore, it is easy to increase the angle of contact between the inner surface of the groove 108 and the exposed surface of the side conductor 109, as compared with the case where the corner portion has a right angle.

Since the groove 108 is filled with the metallized paste, the angle between the inner surface of the groove 108 and the exposed surface of the side conductor 109 is relatively large in both ends of the groove 108 in a plan view. A structure in which the thickness at both ends is increased can be easily formed. In addition,
Since the lower end of the side conductor 109 is formed so as to expand as described above, the possibility that the side conductor 109 is tapered is further reduced.

Further, if the groove 108 and the side conductor 109 are formed in this way, the bonding area between the both becomes larger, so that the bonding strength between the side conductor 109 and the inner surface of the groove 108 (that is, the upper insulating layer 104) is increased. Further improve.

  Therefore, for example, when the lid 110 is joined to the frame-like metallized layer 107, or when the electronic device is soldered to an external electric circuit (circuit board or the like) (not shown), the thermal stress etc. It is possible to more effectively suppress the side conductor 109 from being peeled off from the inner side surface of the groove 108 due to stress.

In order to form the corner portion of the inner side surface of the upper insulating layer 104 in an arc shape, when punching the ceramic green sheet into a frame shape, the inner side surface of the punched portion becomes an arc shape, What is necessary is just to produce a metal mold | die.

  The groove 108 and the side conductor 109 can be formed by, for example, the method described above. At this time, when filling the through hole to be the groove 108 with the metallized paste to be the side conductor 109, a suction method or a press-fitting method is used. It is preferable to use and fill. This is because the inner side surface of the through hole of the ceramic green sheet formed by punching is unevenly formed by rolling. In this way, by using a suction method or a press-fitting method for filling, the metallized paste can be more easily filled even in uneven portions where filling of the metallized paste is likely to be hindered. Therefore, for example, the bonding strength of the side conductor 109 to the inner side surface of the groove 108 is more advantageous.

  The groove 108 is preferably in the shape of a circular arc in order to facilitate workability during formation by the punching process or the like and to facilitate filling of the side conductor 109 (metalized paste or the like). Similarly, the four corners of the recess 106 are preferably arcuate.

Further, the angle (groove angle) θ1 formed between the upper surface of the lower insulating layer 103 and the inner side surface of the groove 108 is from the central portion (hereinafter also simply referred to as the central portion) of the opening on the inner side surface of the upper insulating layer 104 in plan view. The larger the distance to the outer periphery of the upper insulating layer 104, the smaller the distance may be. An example of such a form is shown in FIG. FIGS. 3A to 3C are enlarged top views of main parts showing an electronic component storage package and a package assembly according to another embodiment of the present invention, respectively.

In the example of FIG. 3A, the distance from the upper end to the lower end of the groove 108 is substantially the same on the entire circumference of the inner surface of the groove 108. That is, the groove angle (not shown in FIG. 3) is substantially the same on the entire circumference of the inner surface of the groove 108. Also in this case, it is possible to ensure the conductivity of the side conductor 109 as in the above examples. However, in this case, the width of the upper insulating layer 104 tends to be narrower on the lower surface side, which may reduce the rigidity of the upper insulating layer 104.

In contrast, in the example of FIG. 3B, such a possibility is also reduced. In this example, the distance from the upper end to the lower end of the groove 108 is smaller as the distance from the center of the side conductor 109 to the outer periphery of the upper insulating layer 104 in plan view is smaller. That is, the groove angle (not shown in FIG. 3) is smaller as the distance from the central portion of the side conductor 109 to the upper insulating layer 104 is larger. In other words, the side conductor 109 has a thickness at both ends in the width direction that is larger than a thickness at the center. In addition, the tendency is larger toward the lower end side of the side conductor 109. In this case, when viewed as an individual electronic component storage package, it is considered that the above distance is increased in a portion where the distance from the inner surface of the groove 108 to the outer surface of the upper insulating layer 104 is easily increased. You can also That is, the width of the frame portion on the lower surface of the upper insulating layer 104 is not easily narrowed in the direction close to the outer surface of the upper insulating layer 104. In addition, the portion where the thickness of the metal paste that becomes the side conductor 109 can be made relatively large increases. Therefore, the possibility that the rigidity of the upper insulating layer 104 is reduced is reduced. Further, in this case, since the thickness of the side conductor 109 is relatively large, the possibility that the side conductor 109 is tapered on the lower end side thereof is further reduced.

In each example of FIG. 3, the auxiliary conductor 115 is formed in order to improve the connection between the side conductor 109 and the connection conductor formed in the lower insulating layer 103. Thereby, even if the upper insulating layer 104 and the lower insulating layer 103 are misaligned, the side conductor 109 and the connection conductor can be kept in good connection. The auxiliary conductor 115 may be semicircular or elliptical, but if it is formed as the minimum necessary area as a rectangular shape as in this embodiment, the frame-shaped metallized layer 107 is sealed with silver brazing or the like. When joining the lid 110 with a material, even if the sealing material flows out through the side conductor 109, the possibility of the sealing material spreading to the center side of the mounting portion 105 can be reduced.

The auxiliary conductor 115 may have a shape other than the shape shown in FIG. 3 (for example, a semicircle or an ellipse), but is curved as in the embodiment shown in FIG. 3C, for example. If it is linear (so-called crescent), it has the following effects. That is, in this case, since the area of the auxiliary conductor 115 is minimized, it is formed at the corner portion when the lid 110 is joined to the frame-like metallized layer 107 with a sealing material such as silver brazing. The possibility that the sealing material spreads to the center side of the mounting portion 105 via the side conductor 109 and the auxiliary conductor 115 is reduced. Thereby, for example, the possibility that the electrical insulation between the side conductor 109 and the wiring conductor 112 or between the wiring conductors 112 is reduced by the sealing material is reduced.

In other words, when the outer periphery on the mounting portion 105 side of the auxiliary conductor 115 has a shape along the exposed surface of the side conductor 109, the electrical reliability of the electronic component storage package and the package assembly is further increased. improves. In the case of such a structure, the exposed area to the mounting portion 105 is necessary for the auxiliary conductor 115 that makes the connection between the side conductor 109 and the other conductor formed in the lower insulating layer 103 good. Can be minimal. As a result, the possibility that the sealing material spreads to the center side of the mounting portion 105 as described above is reduced. Accordingly, the electrical reliability of the electronic component storage package and the package assembly is further improved.

For example, as in the examples of FIGS. 2 and 3, if the auxiliary conductor 115 is rectangular or crescent shaped, the sealing material remains in the center of the mounting portion 105 even if the sealing material flows out through the side conductor 109. The possibility of spreading to the side is reduced. The shape of the auxiliary conductor 115 is not limited to these shapes, and other shapes may be used as long as they mean the gist of the present invention. For example, the exposed surface of the corner portion may have an L shape instead of a crescent shape.

The auxiliary conductor 115 is connected to another conductor as described above, but is connected to each other between the upper insulating layer 104 and the lower insulating layer 103 from the lower end (lower surface) of the side conductor 109 to the other conductor. With such a pattern, in the exposed mounting portion 105, the auxiliary conductor 115 and the other conductor are not directly connected. Therefore, the sealing material does not spread from the auxiliary conductor 115 to another conductor via the side conductor 109. Thereby, there is an effect that the possibility that the sealing material spreads to the center side of the mounting portion 105 is further reduced. Therefore, an electronic component storage package that can manufacture a highly reliable electronic device by suppressing the contact or short circuit to the mounted electronic component due to the expansion of the sealing material toward the mounting portion 105 side. And a package assembly can be realized.

As described above, a package assembly is obtained by arranging electronic component storage packages of a plurality of embodiments on a plane. That is, the package assembly of the embodiment is divided into pieces, and a plurality of electronic component storage packages are manufactured. According to such a package assembly, as in the case of the individual electronic component housing package, the metallized paste that becomes the side conductor 109 is less likely to taper on the lower end side of the inner side surface of the upper insulating layer 104. for that reason,
It is possible to manufacture a package assembly including the wiring board region 102 (electronic component storage package) in which the decrease in electrical conductivity and disconnection of the side conductor 109 are suppressed.

FIG. 1 shows an example in which the groove 108 is provided at one corner of the inner side surface of the upper insulating layer 104. For example, as shown in FIGS. 3A and 3B, the groove 108 is formed on the upper insulating layer 104. You may provide in the part of a side among inner surfaces. Also, a plurality of these groove portions 108 may be provided on one side, or a combination of these groove portions 108 may be provided on a corner portion or a side. As described above, when a plurality of groove portions 108 are provided and a plurality of side conductors 109 are provided in the groove portions 108, an electronic component storage package (and a package that can more effectively improve ground stability and shielding performance). Aggregate) can be provided.

A method for manufacturing the electronic component storage package of the embodiment will be described with reference to FIGS. This manufacturing method includes the following steps. That is, a flat first ceramic green sheet (which becomes the lower insulating layer 103) and a second ceramic green sheet (upper part) having a frame shape having an inner surface and extending from the lower end to the upper end of the inner surface. A step of preparing an insulating layer 104) and a step of applying a metallized paste on the inner surface of the groove 108. And it is the process of laminating | stacking the 2nd ceramic green sheet which apply | coated metallization paste on the upper surface of a 1st ceramic green sheet, and producing a laminated body. Further, in the step of preparing the second ceramic green sheet, an angle θ1 formed between the upper surface of the first ceramic green sheet and the inner surface of the groove portion 108 of the second ceramic green sheet in the laminated body is applied to the upper surface and the groove portion 108. The angle θ2 made with the exposed surface of the metallized paste is made smaller.

According to such a manufacturing method, since it has the above-described steps, it is possible to suppress a decrease in electrical conductivity or disconnection of the side conductor 109, and it is possible to contain electronic components that can improve ground stability and shielding performance. A package can be manufactured.

Such a process will be described in detail with reference to FIGS. First, as shown in FIG. 4A, a plate-like first ceramic green sheet and second ceramic green sheet (not shown in FIG. 4A) are prepared. Next, as shown in FIG. 4B, a through hole (not shown) that becomes the groove 108 is formed at a predetermined position of the first ceramic green sheet by punching (mechanical processing using a mold). The through hole is formed by punching so that the inner surface thereof is inclined at an angle θ1 (corresponding to the groove angle) with respect to the horizontal direction. A method for adjusting the angle θ1 will be described later.

  Next, as shown in FIG. 4C, the first ceramic green sheet is turned upside down, and an embedding jig is placed thereon. The embedding jig is made of a metal plate, for example, and has a plurality of holes for locally sucking the metallized paste. Thereafter, the metalized paste is filled into the through holes by, for example, screen printing. Here, the filling method is not limited to the screen printing method, and a suction method or a press-fitting method may be employed.

Next, as shown in FIG. 4 (d), an opening (not indicated) that becomes the recess 106 is formed in the first ceramic green sheet in which the metallized paste is filled in the through hole. The formation of the opening is the first
This is performed by punching and punching along the region of the ceramic green sheet that becomes the recess 106. At this time, the through hole portion of the first ceramic green sheet and the metallized paste filled in the through hole are simultaneously punched, and the metallized paste is filled in the through hole (groove 108), in a crescent shape in plan view Or a side conductor 109 such as a semicircle
(Unfired) is formed. At the time of punching, the angle with respect to the horizontal direction of the exposed surface of the metallized paste is set to be the conductor angle θ2.

Then, as shown in FIG. 4E, the first ceramic green sheet that is perforated and provided with the side conductor 109 in the groove 108 is laminated on the flat second ceramic green sheet, and a laminated body (reference numeral None). When the through hole is formed in the previous step and when the opening is formed, the groove angle θ1 is set to be smaller than the conductor angle θ2 in this laminate. The groove angle θ1 and the conductor angle θ2 are, for example, an upper punch (actual punching start portion of the mold) (not shown) for forming an opening to be the recess 106 and a through hole to be the groove 108; It can be adjusted by the size of the clearance with the hole into which the upper punch enters (one provided on the die placed below the upper punch and on which the ceramic green sheet is placed). The larger the clearance, the smaller the groove angle θ1 and the conductor angle θ2. Details are as follows. On the upper surface of the first ceramic green sheet, punching of the ceramic sheet is started with the area of the upper punch in contact with the upper surface of the first ceramic green sheet, and the punching area becomes larger than the area of the upper punch on the lower surface of the first ceramic green sheet. That is, by placing the first ceramic sheet on a mold (not shown) having a hole and applying pressure so that the upper punch enters the hole of the mold, the peripheral edge of the upper punch and the mold A shear force is generated between the holes. With this shearing force, the through hole drilled in the first ceramic green sheet and the inner surface of the opening can be adjusted to a desired inclination angle. That is, the clearance may be set smaller when the opening is formed than when the through hole is formed.

For example, a through hole (groove portion 108) is formed on a flat plate-like second ceramic green sheet on which no through hole or opening has yet been formed, and the groove portion angle θ1 extends outward at an angle of about 70 to 80 degrees. Furthermore, an opening may be formed in the second ceramic green sheet so that the concave portion 106 that extends outward at an angle of the conductor angle θ2 of about 75 to 85 degrees is formed. In this case, the conductor angle θ2 is set to be larger than the groove portion angle θ1. By such a manufacturing method, it is possible to manufacture an electronic component storage package in which a decrease in electrical conductivity or disconnection of the side conductor 109 is suppressed.

  In order to make the metal paste that becomes the side conductor 109 less likely to taper on the lower end side of the inner side surface of the upper insulating layer 104, the difference between the groove angle θ1 and the conductor angle θ2 should be 5 degrees or more. Good.

Furthermore, since the inclination angle on the inner surface of the groove 108 and the side conductor 109 tends to become smaller due to the thickness of the first ceramic green sheet, the inclination angle becomes smaller as the first ceramic green sheet is thinner. Therefore, when the thickness of the first ceramic green sheet is as thin as about 100 μm or less, for example, it is better to set the angle difference between θ1 and θ2 to 10 degrees or more. Thereby, even if the thickness of the first ceramic green sheet (upper insulating layer 104) is thin, the thickness of the side conductor 109 is formed relatively large on the lower end side of the groove 108. Therefore, even in a small and thin package for storing electronic components, the decrease in conductivity and disconnection of the side conductor 109 are more effectively suppressed.

In order to form the side conductor 109 as shown in FIGS. 3B and 3C, for example,
An upper punch 201 as shown in FIGS. 5A to 5C may be used. Fig.5 (a) is the top view which looked at an example of the upper punch used with the manufacturing method of embodiment from the upper side (opposite side of the blade edge), and FIG.5 (b) is the A direction of Fig.5 (a). FIG. 5C is a side view of FIG. 5A viewed from the B direction. The upper punch 201 has a circular shape in a top view, and the tip end portion 204 is divided into two. Further, curved blades 202 are respectively provided at end portions of the tip end portion 204 located on the opposite sides. A recess 203 is formed between the curved blades 202.
The curved blade 202 is narrower toward the tip and wider as it approaches the recess 203.

Next, a method for punching the second ceramic green sheet using the upper punch 201 will be described in detail with reference to FIGS. FIG. 6A is a side perspective view showing a state in which an opening or a through hole is formed in the second ceramic green sheet with the upper punch 201 as viewed from the A direction, and FIG. 6B is an upper surface of the step. FIG. Moreover, FIG.6 (c) is the side perspective view which looked at the said process from the B direction, and FIG.6 (d) is the top view of the process. A through hole that becomes the groove 108 is formed in a predetermined position of the second ceramic green sheet (upper insulating layer 104) by punching (punching using the upper punch 201). When punching, a ceramic green sheet is placed on a mold (not shown) having a hole. At this time, the hole portion of the mold and the upper punch are aligned so as to face each other across a predetermined punched portion of the ceramic green sheet.

In the actual punching process, the tip portions 204 of the curved blades 202 are sharp, and first, the tip portions 204 of the two curved blades 202 come into contact with two places on the punching start surface 205 of the second ceramic green sheet. The tip of the curved blade 202 in contact with the second ceramic green sheet enters the second ceramic green sheet while tearing the second ceramic green sheet. Further, the upper punch 201 enters the inside of the second ceramic green sheet while tearing the second ceramic green sheet from the tip portion 204 to the recessed portion 203 of the curved blade 202. At this point, it is still difficult to generate a shearing force between the peripheral edge of the recess 203 of the upper punch 201 and the hole of the mold (not shown).

When the recess 203 of the upper punch 201 reaches the second ceramic green sheet, a shearing force starts to be generated between the peripheral edge of the upper punch 201 and the hole of the mold, and finally the second ceramic green sheet is formed. An elliptical through hole as shown is formed. Since the inner side surface with which the curved blade 202 of the through hole comes into contact is cut, as a result, the inner side surface is hardly inclined. On the other hand, the region of the through hole that is separated from the curved blade 202 and contacts the upper punch 201 is sheared between the peripheral edge of the upper punch 201 and the mold hole due to the clearance between the upper punch 201 and the mold hole. Since the inner surface is moderately inclined by the force, the punching start surface 205 is thus circular, and the punching end surface 206 is formed with an elliptical through hole.

When a through hole is formed in the first ceramic green sheet by punching using a mold, the diameter of the through hole is about 80 to 200 μm. If the above method is used, the through hole is formed from a small opening. Even in the groove portion 108, a through-hole having a gradually changing inclination of the inner side surface can be stably formed, and this side conductor 109 can be easily formed in the groove portion 108 by filling the through-hole with a metallized paste. Can do. Note that the method for forming the through hole to be the groove 108 is not limited to a method using a punch, and the through hole may be formed by, for example, laser or drilling.

  Note that the metallized paste that becomes the side conductor 109 may be formed by being applied in a layered manner to the inner side surface of the through hole of the ceramic green sheet that becomes the groove 108. In this case as well, the conductor angle θ2 can be adjusted to be larger than the groove angle θ1 by, for example, a method of adjusting the mold clearance during punching to form the opening. However, it is necessary to apply the metallized paste with a printing thickness that allows such adjustment.

Further, the groove 108 and the side conductor 109 are prepared by first producing a frame-shaped ceramic green sheet to be the upper insulating layer 104, and the groove 108 is formed on the inner surface thereof by mechanical grinding or the like, and on the inner surface thereof. You may form by apply | coating the metallized paste used as the side conductor 109. FIG. In this case, at the time of grinding and application, adjustment is made so that the groove portion angle θ1 and the conductor angle θ2 become predetermined angles.

In recent years, there has been a demand for improvement in reliability (temperature cycle), that is, so-called environmental resistance performance, when temperature environmental stress is repeatedly and continuously applied. In response to such a demand, the electronic component storage package manufactured by the manufacturing method of the present invention is effective in suppressing the decrease in electrical conductivity and disconnection of the side conductor 109 and also preventing the side conductor 109 from being ground or peeled off. There is.

Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the above embodiment,
The shape of the wiring board region 102 is a rectangular shape having different long sides and short sides, but may be a square shape. Further, although the wiring board region 102 is composed of two insulating layers (lower and upper insulating layers 103 and 104), it may be composed of three or more insulating layers in accordance with the accommodation form of the electronic component. Further, although the wiring conductor 112 is formed at two places in the corner portion of the mounting portion 105, it may be formed at three or more places according to the number of terminals of the electronic component. Further, in order to join the lid 110 to the upper surface of the frame-like metallized layer 107 by seam welding, a metal frame (not shown) made of a square-frame iron-nickel-cobalt alloy metal is joined with a brazing material. Also good.

101 ... Mother board
102 ・ ・ ・ Wiring board area
103 ... lower insulation layer
104 ... Upper insulating layer
105 ・ ・ ・ Mounting part
106 ・ ・ ・ Recess
107 ・ ・ ・ Frame metallization layer
108 ・ ・ ・ Groove
109 ・ ・ ・ Side conductor
110 ... lid
111 ・ ・ ・ Division groove
112 ・ ・ ・ Wiring conductor
113 ・ ・ ・ External connection conductor
114 ・ ・ ・ Castellation
115: Auxiliary conductor θ1: Angle formed between the upper surface of the upper insulating layer and the inner surface of the groove θ2: Angle formed between the upper surface of the upper insulating layer and the exposed surface of the side conductor
201 ... upper punch
202 ... Curved blade
203 ... dent
204 ... Tip of curved blade
205 ... Punching start surface
206 ・ ・ ・ Punching finish

Claims (6)

A lower insulating layer having an upper surface including a mounting portion for mounting an electronic component; and a frame-shaped upper insulating layer stacked on the lower insulating layer so as to surround the mounting portion. An insulating substrate having a groove formed on the inner surface of the layer from the lower end to the upper end of the inner surface;
A side conductor provided in the groove,
In a longitudinal sectional view of the groove and the side conductor provided in the groove, an angle θ1 formed by the upper surface of the lower insulating layer and the inner surface of the groove is provided in the upper surface and the groove. An electronic component storage package characterized by being smaller than an angle θ2 formed with the exposed surface of the side conductor. The angle θ1 formed between the upper surface of the lower insulating layer and the inner surface of the groove is smaller as the distance from the center of the opening on the inner surface of the upper insulating layer to the outer periphery of the upper insulating layer in plan view is smaller. The electronic component storage package according to claim 1. 3. The electronic component storage package according to claim 1, wherein the upper insulating layer has a rectangular frame shape in a top view, and the groove is located at a corner of the upper insulating layer. . The upper surface of the lower insulating layer further comprises an auxiliary conductor provided directly connected to the lower end of the side conductor,
4. The electronic component storage package according to claim 1, wherein an outer periphery of the auxiliary conductor on the side of the mounting portion is shaped along the exposed surface of the side conductor. 5. 5. A package assembly, wherein a plurality of electronic component storage packages according to claim 1 are arranged and integrated. Preparing a first ceramic green sheet having a flat plate shape and a second ceramic green sheet having a frame shape having an inner surface and extending from the lower end to the upper end of the inner surface;
Applying metallized paste to the inner surface of the groove;
Laminating the second ceramic green sheet coated with the metallized paste on the upper surface of the first ceramic green sheet,
In the step of preparing the second ceramic green sheet, an angle θ1 formed by the upper surface of the first ceramic green sheet and an inner surface of the groove portion of the second ceramic green sheet in the laminate is determined by the upper surface and the groove portion. A method of manufacturing an electronic component storage package, wherein the groove is formed to be smaller than an angle θ2 formed with an exposed surface of the metallized paste applied inside.

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