JP6195085B2 - Laminated electronic components - Google Patents

Description

  The present invention relates to a laminated electronic component, and more particularly, to a laminated electronic component including an electric circuit inside a laminated body in which insulating layers are laminated.

  For example, as shown in the cross-sectional view of FIG. 8, a circuit is provided inside the stacked body 111 in which insulating layers are stacked, and the upper and lower surfaces 111b and 111c and the side surfaces of the stacked body 111 are circulated around the end surface 111a of the stacked body 111. In the electronic component 110 on which the external electrode 113 is formed, an insulating layer 114 is formed and covered on the surface of the portion 113a of the external electrode 113 along the end surface 111a of the stacked body 111 using glass or the like. Among them, it has been proposed to form external electrodes by portions 113b along the upper and lower surfaces 111b and 111c of the laminate 111 (see, for example, Patent Document 1).

JP 2002-359103 A

  However, since the insulating layer and the terminal electrode are made of different materials, the insulating layer is easily peeled off from the surface of the terminal electrode, and it is difficult to stably cover the external electrode.

  In view of such circumstances, the present invention intends to provide a laminated electronic component capable of stably covering a conductor formed on an end face of a laminated body.

  In order to solve the above-mentioned problems, the present invention provides a multilayer electronic component configured as follows.

The multilayer electronic component includes: (a) a first surface adjacent to one of a pair of main surfaces on both sides in the stacking direction where the insulating layer is stacked and the insulating layer is stacked; and a step portion from the first surface. A laminated body including a second surface adjacent to the other of the pair of main surfaces; (b) an in-plane connection conductor formed between the insulating layers adjacent to each other; ) Connected to the in-plane connection conductor, penetrates a part of the insulating layer in the stacking direction, reaches the other of the pair of main surfaces of the stacked body and the stepped portion, A first interlayer connection conductor having a plane formed flush with the second surface; and (d) the second surface of the multilayer body so as to cover the plane of the first interlayer connection conductor. A coating layer formed flush with the first surface of the laminate using an insulating material; and (e) the pair of laminates. It is formed on the other of the main surfaces, and an external electrode connected to said end surface in the stacking direction of the first interlayer connection conductor. The coating layer covers the plane of the first interlayer connection conductor so that the plane is not exposed, and the coating layer is flush with the plane of the first interlayer connection conductor. Cover the second surface of the body. The insulating layer forming the first surface of the multilayer body and the covering layer are exposed on a pair of side surfaces facing each other of the multilayer electronic component. One of the pair of main surfaces on both sides in the stacking direction of the stacked electronic component is formed of only the insulating layer.

According to the above configuration, the first interlayer connection conductor formed in the vicinity of the outer surface other than the main surface of the multilayer body can be stably covered with the coating layer, and the first interlayer connection from the multilayer body is possible. It is possible to prevent problems such as conductor dropping. In addition, since the first interlayer connection layer has a flat surface that is flush with the outer surface other than the main surface of the multilayer body, the high frequency characteristics are improved. Moreover, it is not necessary to form external electrodes exposed to the outside on the outer surface other than the main surface of the laminate.

Preferably, the covering layer, the second surface of the plane and the surface is one the laminate of the first interlayer connection conductor, covering such that the second surface is not exposed.

  Preferably, the coating layer is formed using the same kind of material as the insulating layer of the laminate.

Preferably, the first interlayer connection conductor has a semicircular shape when seen through in the stacking direction.

  In this case, there are few restrictions with respect to the area | region which forms the circuit inside a laminated body.

Preferably, the plane of the first interlayer connection conductor can be seen through the coating layer from the outside.

  In this case, it is possible to visually confirm a defect such as dropping of the interlayer connection conductor from the laminated body from the outside.

Preferably, the covering layer covers the second surface of the plane and the surface is one the laminate of the first interlayer connection conductor, it does not cover the other than the second surface of the laminate .

  Preferably, the insulating layer constituting the laminated body is a ceramic layer. The coating layer is a ceramic layer.

  Preferably, the insulating layer constituting the laminated body is a ceramic layer. The coating layer is a resin layer.

Preferably, it is connected to the in-plane connection conductor, penetrates a part of the insulating layer in the laminating direction, and end faces on both sides in the laminating direction are located inside a pair of the main surfaces of the laminated body. A second interlayer connection conductor is further provided .

  ADVANTAGE OF THE INVENTION According to this invention, the conductor formed in the end surface of the laminated body of a laminated electronic component can be coat | covered stably.

It is (a) perspective view of laminated electronic component, (b) sectional drawing, (c) side view. ( Reference Example 1) It is sectional drawing which shows the manufacturing process of an electronic component. Example 1 It is sectional drawing which shows the manufacturing process of an electronic component. Example 1 It is a perspective view of a multilayer electronic component. ( Reference Example 2) It is sectional drawing of a laminated electronic component. ( Reference Example 2) It is (a) perspective view of laminated electronic component, (b) sectional drawing, (c) side view. (Comparative Example 1) It is (a) perspective view of laminated electronic component, (b) sectional drawing, (c) side view. (Comparative Example 2) It is sectional drawing of a laminated electronic component. (Conventional example)

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

About <Example 1> multilayer electronic component of Example 1 will be described with reference to FIGS.

FIG. 1A is a perspective view of the multilayer electronic component 10 of Reference Example 1. FIG. 1B is a cross-sectional view taken along line BB in FIG. 1A, that is, a cross-sectional view cut so as to include two later-described interlayer connection conductors 16 formed on different side surfaces. . FIG.1 (c) is the side view seen along line CC of FIG.1 (a), ie, the side view seen from the direction perpendicular | vertical to the coating layer 13 mentioned later.

  As shown in FIGS. 1A to 1C, in the laminated electronic component 10, a covering layer 13 is formed on the side surface 12 s of the laminated body 12 on which the insulating layers are laminated, and one main surface 12 b of the laminated body 12. Further, external electrodes 18 for mounting the laminated electronic component 10 on a circuit board or the like are formed.

  As shown in FIG. 1B, in the laminated body 12, in-plane connection conductors 15 are formed between adjacent insulating layers. In addition, interlayer connection conductors 16 and 17 penetrating the insulating layer are formed in the stacking direction in which the insulating layers are stacked (vertical direction in the figure). The interlayer connection conductors 16 and 17 are connected to the in-plane connection conductor 15. An electrical circuit such as an LC resonator is formed inside the multilayer electronic component 10 by the in-plane connection conductor 15 and the interlayer connection conductors 16 and 17.

  As shown in FIGS. 1A and 1B, a recess 12c is formed in the side surface 12s of the multilayer body 12, and an interlayer connection conductor 16 is formed of a conductive material filled in the recess 12c. Yes. The interlayer connection conductor 16 has a flat surface 16 a that is flush with the side surface 12 s of the multilayer body 12.

  As shown in FIGS. 1A to 1C, the covering layer 13 is formed so as to cover the interlayer connection conductor 16. Since the covering layer 13 is thin, the flat surface 16a of the interlayer connection conductor 16 can be seen through the covering layer 13 from the outside as shown in FIG. Therefore, it is possible to visually confirm problems such as dropping of the interlayer connection conductor 16 from the multilayer body 12 from the outside.

  One end face 16 b in the stacking direction of the interlayer connection conductor 16 is connected to an external electrode 18 formed on one main surface 12 b of the multilayer body 12. Therefore, it is not necessary for the multilayer electronic component 10 to form external electrodes that are exposed to the outside on the outer surface other than the main surfaces 12a and 12b of the multilayer body 12.

  The covering layer 13 is formed of the same material as the insulating layer of the laminated body 12, for example, ceramic when the insulating layer of the laminated body 12 is ceramic, and resin when the insulating layer of the laminated body 12 is resin. . As a result, the covering layer 13 is firmly bonded to the laminated body 12 and does not peel off, and the covering layer 13 stably stabilizes the interlayer connection conductor 16 formed in the recess 12c of the laminated body 12 over a long period of time. Can be coated.

  Moreover, since the interlayer connection conductor 16 has a flat surface 16a that is flush with the side surface 12s of the multilayer body 12, compared to an interlayer connection conductor in which conical portions formed so as to penetrate the insulating layer are connected to each other. The high frequency characteristics are improved.

  The interlayer connection conductor 16 is semicircular when seen through in the stacking direction. In the multilayer electronic component 10, the interlayer connection conductor 16 having a shape that is substantially half of the substantially cylindrical shape is disposed along the side surface 12 s of the multilayer body 12, so that the columnar interlayer connection conductor is disposed inside the multilayer body. The wiring area in which an electric circuit can be formed in the laminated body 12 is wider than in the case where the laminated body 12 is formed. Therefore, restrictions on the wiring area inside the multilayer body can be reduced.

Next, a method of manufacturing the multilayer electronic component of Example 1 configured substantially the same as the multilayer electronic component 10 will be described with reference to the cross-sectional views of FIGS. Here, the case where the insulating layer of the multilayer body 12 of the multilayer electronic component 10 is ceramic and a plurality of layers are manufactured simultaneously will be described as an example.

  First, as shown in FIG. 2A, a plurality of laminated electronic components are obtained by laminating and press-bonding ceramic green sheets in which portions to be interlayer connection conductors 16 and 17 and in-plane connection conductors 15 are formed in advance. The laminated body 12 including the part to be formed is formed.

  That is, the ceramic green sheet is formed with through holes by laser processing or the like before being laminated, and the through holes are filled with a conductive paste by a method such as printing, thereby forming the interlayer connection conductors 16 and 17. Is formed. Further, the in-plane connection conductor 15 and the external electrode 18 are formed by applying a conductive paste to the main surface of the ceramic green sheet by a method such as screen printing.

  Next, as shown in FIG. 2B, the first groove 20 is formed in the multilayer body 12 using a dicer or the like so that the interlayer connection conductor 16 is cut in the lamination direction and divided into two. As shown in FIG. 2C, which is a cross-sectional view taken along the line XX in FIG. 2B, the interlayer connection conductor 16 that has been cut and divided is half-cut when viewed through from the stacking direction. It is circular.

  Next, as shown in FIG. 3D, the first groove 20 formed in the stacked body 12 is filled with a ceramic paste 13 x that is an insulating material for forming the coating layer 13.

  Next, as shown in FIG. 3 (e), a dicer or the like is provided so that the second groove 22 having a width smaller than the width of the first groove 20 reaches the holding sheet 2 holding the stacked body 12. By using and forming, the laminated body 12 is divided | segmented into the piece of laminated electronic components. At this time, as shown in FIG. 3F, which is a cross-sectional view taken along the line XX in FIG. 3E, the first groove 20 is filled on both sides of the second groove 22. The ceramic paste 13x remains so that the coating layer 13 is formed.

  Next, by firing the laminated body 12 divided into individual pieces, the ceramic green sheet of the laminated body 12, the conductive paste of the in-plane connection conductor 15 and the interlayer connection conductors 16 and 17, and the ceramic paste of the coating layer 13 And the laminated electronic component is completed.

Through the above process, has been in the laminated electronic component of Example 1 coated with the interlayer connection conductor 16 formed in the vicinity of the side surface 12s of the laminated body 12 is the coating layer 13, can be easily manufactured.
As shown in FIG. 3E, the multilayer body 12 of the multilayer electronic component of Example 1 includes a first surface 12t adjacent to one main surface 12a of the pair of main surfaces 12a and 12b on both sides in the stacking direction. As shown in FIGS. 3E and 3F, the second surface adjacent to the other main surface 12b of the pair of main surfaces 12a and 12b is retracted from the first surface 12t via the stepped portion 12k. Surface 12s.
As shown in FIG. 3E, the interlayer connection conductor 16 of the multilayer electronic component of Example 1 is connected to the in-plane connection conductor 15 and penetrates a part of the insulating layer in the stacking direction to the other side of the stack 12. The main surface 12b and the step portion 12k are reached. As shown in FIGS. 3E and 3F, the interlayer connection conductor 16 has a flat surface 16a formed flush with the second surface 12s of the multilayer body 12. The interlayer connection conductor 16 is the “first interlayer connection conductor” in the present invention.
As shown in FIGS. 3E and 3F, the covering layer 13 of the multilayer electronic component of the first embodiment uses an insulating material so as to cover the flat surface 16a of the interlayer connection conductor 16, and the first layer 12 of the multilayer body 12 is covered. The second surface 12s is formed flush with the first surface 12t of the laminate 12. The covering layer 13 covers the flat surface 16a of the interlayer connection conductor 16 so that the flat surface 16a is not exposed, and the covering layer 13 is flush with the flat surface 16a of the interlayer connection conductor 16. Cover 12s.
The external electrode 18 of the multilayer electronic component of Example 1 is formed on the other main surface 12 b of the multilayer body 12 and connected to the end surface of the interlayer connection conductor 16 in the stack direction.
The multilayer electronic component of Example 1 is connected to the in-plane connection conductor 15, penetrates a part of the insulating layer in the stacking direction, and the end surfaces on both sides in the stacking direction are inside the pair of main surfaces 12a and 12b of the stack. The interlayer connection conductor 17 is provided. The interlayer connection conductor 17 is a “second interlayer connection conductor” in the present invention.

  2 and 3, the first groove 20 does not reach the holding sheet 2 that holds the laminated body 12, but when the first groove 22 is formed so as to reach the holding sheet 2, FIG. As shown in FIG. 1, the coating layer 13 covers the entire side surface 12 s of the laminate 12.

Reference Example 2 Refer to FIGS. 4 and 5 for the laminated electronic component 10k of Reference Example 2. FIG. Laminated electronic component 10k of Reference Example 2 is substantially the same structure as the laminated electronic component 10 of Example 1, hereinafter, the same reference numerals are used for similar components as in Reference Example 1, difference between Reference Example 1 The explanation will be focused on.

  FIG. 4 is a perspective view of the multilayer electronic component 10k. FIG. 5 is a cross-sectional view taken along line XX of FIG.

  As shown in FIGS. 4 and 5, first and second recesses 12m and 12n are formed on the side surface 12s of the laminated body 12, and the conductivity filled in the first and second recesses 12m and 12n is increased. The first and second interlayer connection conductors 16m and 16n are formed of the material having them. The first and second interlayer connection conductors 16m and 16n are formed with planes 16u and 16v that are flush with the side surface 12s of the multilayer body 12, and the planes 16u and 16v are exposed on the side surface 12s of the multilayer body 12.

  End surfaces 16p and 16q on both sides in the stacking direction of the first interlayer connection conductor 16m are connected to external electrodes 18a and 18b formed on the main surfaces 10a and 10b on both sides in the stacking direction of the multilayer electronic component 10k.

  The end surfaces 16s and 16t on both sides in the stacking direction of the second interlayer connection conductor 16n are located inside the main surfaces 12a and 12b of the stacked body 12, and are not connected to the external electrodes 18a and 18b. The second interlayer connection conductor 16n is connected to a plurality of in-plane connection conductors (not shown) formed inside the multilayer body 12, and connects the plurality of in-plane connection conductors.

  The first and second interlayer connection conductors 16m and 16n are semicircular when viewed in the stacking direction. Thereby, the restrictions with respect to the wiring area inside a laminated body can be reduced.

  The first and second interlayer connection conductors 16m and 16n have flat surfaces 16u and 16v that are flush with the side surface 12s of the multilayer body 12. Thereby, the high frequency characteristics are improved.

  Comparative Example 1 A laminated electronic component 50 of Comparative Example 1 will be described with reference to FIG.

  FIG. 6A is a perspective view of the multilayer electronic component 50. FIG. 6B is a cross-sectional view taken along the line BB in FIG. FIG.6 (c) is the side view seen along line CC of Fig.6 (a).

  As shown in FIGS. 6A to 6C, the multilayer electronic component 50 covers the end faces 52p, 52q of the multilayer body 52 in which the interlayer connection conductor 56 and the in-plane connection conductor 58 are formed, and the end faces 52p, An external electrode 54 is formed so as to go around the side surfaces 52s and 52t and the upper and lower surfaces 50a and 50b in the vicinity of 52q.

  Since the in-plane connection conductor 58 formed inside the multilayer body 52 is connected to the external electrode 54 at the end faces 52p and 52q of the multilayer body 52, the external electrode 54 does not narrow the design area. However, it is necessary to form the external electrode 54 after the laminated body 52 is divided into individual pieces, and handling of the individual pieces is not easy. Therefore, a device for forming the external electrode 54 is necessary in the manufacturing process.

  Comparative Example 2 A laminated electronic component 10x of Comparative Example 2 will be described with reference to FIG.

  FIG. 7A is a perspective view of the multilayer electronic component 10x. FIG.7 (b) is sectional drawing cut | disconnected along line BB of Fig.7 (a). FIG.7 (c) is the side view seen along line CC of Fig.7 (a).

  7A to 7C, in the multilayer electronic component 10x of Comparative Example 2, the side surface 12s of the multilayer body 12 on which the in-plane connection conductor 15 and the interlayer connection conductors 16 and 17 are formed is exposed to the outside. doing. The interlayer connection conductor 16 formed in the recess 12c of the multilayer body 12 has a flat surface 16a formed flush with the side surface 12s of the multilayer body 12 exposed to the outside. Therefore, in the multilayer electronic component 10x, the interlayer connection conductor 16 may fall off the multilayer body 12.

  On the other hand, when the interlayer connection conductor 16 is covered with the coating layer 13 formed on the side surface 12s of the multilayer body 12 as in the first embodiment, the interlayer connection conductor 16 is prevented from falling off from the multilayer body 12. can do.

  <Summary> As described above, the interlayer connection conductor formed so as to be flush with the side surface of the multilayer body can be stably coated with the coating layer.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

  For example, the insulating layer of the laminated body is not limited to ceramic but may be resin or the like. Moreover, the coating layer formed on the side surface of the laminate is not limited to ceramic, but may be a resin or a magnetic material.

2 Holding sheet 10, 10k, 10x Laminated electronic component 12 Laminated body 12a, 12b Main surface 12c, 12m, 12n Recessed portion 12s Side surface 13 Coating layer 13x Ceramic paste 15 In-plane connecting conductor 16 Interlayer connecting conductor (first interlayer connecting conductor)
16a plane 16b end face 16m, 16n interlayer connection conductor 16p, 16q end face 16s, 16t end face 16u, 16v plane 17 interlayer connection conductor (second interlayer connection conductor)
18 External electrode 18a, 18b External electrode 20 1st groove 22 2nd groove 50 Laminated electronic components 50a, 50b Upper and lower surfaces 52 Laminated body 52p, 52q End face 52s, 52t Side face 54 External electrode 56 Interlayer connection conductor 58 In-plane connection conductor

Claims (9)

An insulating layer is stacked, a first surface adjacent to one of a pair of main surfaces on both sides in the stacking direction of the stacked insulating layers, and a receding from the first surface via a stepped portion, A laminate including a second surface adjacent to the other of the main surfaces;
In-plane connection conductors formed between the insulating layers adjacent to each other;
Connected to the in-plane connection conductor, penetrates a part of the insulating layer in the stacking direction, reaches the other of the pair of main surfaces of the stacked body and the stepped portion, and the first of the stacked body A first interlayer connection conductor having a plane formed flush with the two surfaces;
A covering layer formed on the second surface of the multilayer body so as to cover the flat surface of the first interlayer connection conductor, using an insulating material and flush with the first surface of the multilayer body When,
An external electrode formed on the other of the pair of main surfaces of the multilayer body and connected to an end surface of the first interlayer connection conductor in the stacking direction;
A laminated electronic component comprising :
The coating layer covers the plane of the first interlayer connection conductor so that the plane is not exposed, and the coating layer is flush with the plane of the first interlayer connection conductor. not covering the second face of the body,
The insulating layer forming the first surface of the multilayer body and the covering layer are exposed on a pair of side surfaces facing each other of the multilayer electronic component,
One of the pair of main surfaces on both sides in the stacking direction of the multilayer electronic component is formed of only the insulating layer .   The covering layer covers the second surface of the multilayer body that is flush with the flat surface of the first interlayer connection conductor so that the second surface is not exposed. The laminated electronic component according to 1.   3. The multilayer electronic component according to claim 1, wherein the coating layer is formed using the same material as the insulating layer of the multilayer body.   4. The multilayer electronic component according to claim 1, wherein the first interlayer connection conductor has a semicircular shape when seen through in the stacking direction. 5.   5. The multilayer electronic component according to claim 1, wherein the plane of the first interlayer connection conductor can be seen through from the outside through the coating layer. 6.   The coating layer covers the second surface of the multilayer body that is flush with the flat surface of the first interlayer connection conductor, and does not cover the multilayer body except for the second surface. The multilayer electronic component according to any one of claims 1 to 5. The insulating layer constituting the laminate is a ceramic layer,
The multilayer electronic component according to claim 1, wherein the coating layer is a ceramic layer. The insulating layer constituting the laminate is a ceramic layer,
The laminated electronic component according to claim 1, wherein the coating layer is a resin layer.   A second conductor connected to the in-plane connection conductor, penetrating a part of the insulating layer in the laminating direction, and having end faces on both sides in the laminating direction located on the inner side of the pair of main surfaces of the laminated body; The multilayer electronic component according to any one of claims 1 to 5, further comprising an interlayer connection conductor.

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