JP5268425B2 - 表面形状測定装置及び露光装置 - Google Patents

表面形状測定装置及び露光装置 Download PDF

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Publication number
JP5268425B2
JP5268425B2 JP2008129231A JP2008129231A JP5268425B2 JP 5268425 B2 JP5268425 B2 JP 5268425B2 JP 2008129231 A JP2008129231 A JP 2008129231A JP 2008129231 A JP2008129231 A JP 2008129231A JP 5268425 B2 JP5268425 B2 JP 5268425B2
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JP
Japan
Prior art keywords
light
surface shape
substrate
wavelength
measured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008129231A
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English (en)
Japanese (ja)
Other versions
JP2009276269A (ja
JP2009276269A5 (enExample
Inventor
孝一 千徳
隆宏 松本
哲 大石
秀樹 稲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2008129231A priority Critical patent/JP5268425B2/ja
Priority to US12/465,567 priority patent/US7952725B2/en
Priority to KR1020090042578A priority patent/KR101045482B1/ko
Publication of JP2009276269A publication Critical patent/JP2009276269A/ja
Publication of JP2009276269A5 publication Critical patent/JP2009276269A5/ja
Application granted granted Critical
Publication of JP5268425B2 publication Critical patent/JP5268425B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • G03B27/54—Lamp housings; Illuminating means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7015—Reference, i.e. alignment of original or workpiece with respect to a reference not on the original or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/12—Generating the spectrum; Monochromators
    • G01J2003/1213—Filters in general, e.g. dichroic, band
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/12—Generating the spectrum; Monochromators
    • G01J2003/1226—Interference filters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/28—Investigating the spectrum
    • G01J3/45—Interferometric spectrometry

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Surface Treatment Of Optical Elements (AREA)
JP2008129231A 2008-05-16 2008-05-16 表面形状測定装置及び露光装置 Expired - Fee Related JP5268425B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008129231A JP5268425B2 (ja) 2008-05-16 2008-05-16 表面形状測定装置及び露光装置
US12/465,567 US7952725B2 (en) 2008-05-16 2009-05-13 Surface shape measurement apparatus and exposure apparatus
KR1020090042578A KR101045482B1 (ko) 2008-05-16 2009-05-15 표면 형상 측정 장치 및 노광 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008129231A JP5268425B2 (ja) 2008-05-16 2008-05-16 表面形状測定装置及び露光装置

Publications (3)

Publication Number Publication Date
JP2009276269A JP2009276269A (ja) 2009-11-26
JP2009276269A5 JP2009276269A5 (enExample) 2011-06-30
JP5268425B2 true JP5268425B2 (ja) 2013-08-21

Family

ID=41316492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008129231A Expired - Fee Related JP5268425B2 (ja) 2008-05-16 2008-05-16 表面形状測定装置及び露光装置

Country Status (3)

Country Link
US (1) US7952725B2 (enExample)
JP (1) JP5268425B2 (enExample)
KR (1) KR101045482B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107588728A (zh) * 2017-08-24 2018-01-16 中国科学院长春光学精密机械与物理研究所 用于扫描干涉场曝光系统的精密光栅位移测量系统及方法

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* Cited by examiner, † Cited by third party
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NL2007361A (en) * 2010-09-29 2012-04-02 Asml Netherlands Bv Inspection apparatus and method, lithographic apparatus and lithographic processing cell.
CN102486623A (zh) * 2010-12-03 2012-06-06 上海微电子装备有限公司 用于光刻设备的调焦测控装置及方法
NL2009273A (en) 2011-08-31 2013-03-04 Asml Netherlands Bv Level sensor arrangement for lithographic apparatus, lithographic apparatus and device manufacturing method.
WO2013043818A1 (en) * 2011-09-23 2013-03-28 The Trustees Of Columbia University In The City Of New York Microsphere superlens based superresolution imaging platform
KR101358287B1 (ko) * 2012-04-27 2014-02-05 (주)하드램 레이저 빔 스캔 장치의 캘리브레이션 시스템
TW201505743A (zh) * 2013-08-13 2015-02-16 Hon Hai Prec Ind Co Ltd 雷射加工裝置
CN111243945B (zh) * 2020-01-15 2022-11-22 合肥维信诺科技有限公司 一种图形化、蚀刻、显示面板的制作方法及显示面板
KR102804207B1 (ko) * 2022-10-04 2025-05-09 세메스 주식회사 기판 검사 장치 및 방법
KR102738312B1 (ko) * 2023-10-31 2024-12-03 정창수 기판 뒷면 반사 영향을 받지 않는 광학적 박막 분석 장치 및 그에 의한 분석 방법

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US4606638A (en) * 1983-11-03 1986-08-19 Zygo Corporation Distance measuring interferometer and method of use
US4861162A (en) * 1985-05-16 1989-08-29 Canon Kabushiki Kaisha Alignment of an object
JP3309927B2 (ja) 1993-03-03 2002-07-29 株式会社ニコン 露光方法、走査型露光装置、及びデバイス製造方法
US6002480A (en) * 1997-06-02 1999-12-14 Izatt; Joseph A. Depth-resolved spectroscopic optical coherence tomography
JP4246326B2 (ja) * 1999-08-27 2009-04-02 東レエンジニアリング株式会社 表面形状測定方法及びその装置
KR100487055B1 (ko) * 2000-01-28 2005-05-04 아사히 가세이 가부시키가이샤 광열 변환 분광 분석 장치
JP2001241916A (ja) * 2000-02-28 2001-09-07 Fuji Photo Optical Co Ltd 斜入射干渉計用光学系およびこれを用いた装置
JP2002286409A (ja) * 2001-03-26 2002-10-03 Fuji Photo Optical Co Ltd 干渉計装置
SG103865A1 (en) * 2001-06-01 2004-05-26 Toshiba Kk Film quality inspecting method and film quality inspecting apparatus
JP4096303B2 (ja) 2001-12-28 2008-06-04 エスアイアイ・ナノテクノロジー株式会社 走査型プローブ顕微鏡
US7292346B2 (en) * 2003-09-15 2007-11-06 Zygo Corporation Triangulation methods and systems for profiling surfaces through a thin film coating
KR100831806B1 (ko) * 2004-04-19 2008-05-28 아리스트 인스트루먼트, 인크. 박막 및 ｃｄ 측정들을 위한 빔 프로파일 복합 반사율시스템 및 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107588728A (zh) * 2017-08-24 2018-01-16 中国科学院长春光学精密机械与物理研究所 用于扫描干涉场曝光系统的精密光栅位移测量系统及方法
CN107588728B (zh) * 2017-08-24 2019-10-29 中国科学院长春光学精密机械与物理研究所 用于扫描干涉场曝光系统的精密光栅位移测量系统及方法

Also Published As

Publication number Publication date
JP2009276269A (ja) 2009-11-26
KR101045482B1 (ko) 2011-06-30
KR20090119738A (ko) 2009-11-19
US20090286172A1 (en) 2009-11-19
US7952725B2 (en) 2011-05-31

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