JP5262374B2 - 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法 - Google Patents

樹脂成形体及び表面実装型発光装置並びにそれらの製造方法 Download PDF

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Publication number
JP5262374B2
JP5262374B2 JP2008182468A JP2008182468A JP5262374B2 JP 5262374 B2 JP5262374 B2 JP 5262374B2 JP 2008182468 A JP2008182468 A JP 2008182468A JP 2008182468 A JP2008182468 A JP 2008182468A JP 5262374 B2 JP5262374 B2 JP 5262374B2
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JP
Japan
Prior art keywords
molded body
lead
resin molded
resin
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2008182468A
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English (en)
Japanese (ja)
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JP2008252135A (ja
JP2008252135A5 (enrdf_load_stackoverflow
Inventor
雅史 蔵本
智久 岸本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
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Publication date
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Priority claimed from JP2004345195A external-priority patent/JP4608294B2/ja
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2008182468A priority Critical patent/JP5262374B2/ja
Priority to JP2008182469A priority patent/JP6346724B2/ja
Publication of JP2008252135A publication Critical patent/JP2008252135A/ja
Priority to JP2011006851A priority patent/JP2011097094A/ja
Publication of JP2008252135A5 publication Critical patent/JP2008252135A5/ja
Application granted granted Critical
Publication of JP5262374B2 publication Critical patent/JP5262374B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP2008182468A 2004-11-30 2008-07-14 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法 Expired - Lifetime JP5262374B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008182468A JP5262374B2 (ja) 2004-11-30 2008-07-14 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP2008182469A JP6346724B2 (ja) 2004-11-30 2008-07-14 表面実装型発光装置及びその製造方法
JP2011006851A JP2011097094A (ja) 2004-11-30 2011-01-17 樹脂成形体及び表面実装型発光装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004345195A JP4608294B2 (ja) 2004-11-30 2004-11-30 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP2008182468A JP5262374B2 (ja) 2004-11-30 2008-07-14 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP2008182469A JP6346724B2 (ja) 2004-11-30 2008-07-14 表面実装型発光装置及びその製造方法
JP2011006851A JP2011097094A (ja) 2004-11-30 2011-01-17 樹脂成形体及び表面実装型発光装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004345195A Division JP4608294B2 (ja) 2004-11-30 2004-11-30 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011006851A Division JP2011097094A (ja) 2004-11-30 2011-01-17 樹脂成形体及び表面実装型発光装置

Publications (3)

Publication Number Publication Date
JP2008252135A JP2008252135A (ja) 2008-10-16
JP2008252135A5 JP2008252135A5 (enrdf_load_stackoverflow) 2011-03-03
JP5262374B2 true JP5262374B2 (ja) 2013-08-14

Family

ID=48784890

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2008182468A Expired - Lifetime JP5262374B2 (ja) 2004-11-30 2008-07-14 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP2008182469A Expired - Lifetime JP6346724B2 (ja) 2004-11-30 2008-07-14 表面実装型発光装置及びその製造方法
JP2011006851A Pending JP2011097094A (ja) 2004-11-30 2011-01-17 樹脂成形体及び表面実装型発光装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2008182469A Expired - Lifetime JP6346724B2 (ja) 2004-11-30 2008-07-14 表面実装型発光装置及びその製造方法
JP2011006851A Pending JP2011097094A (ja) 2004-11-30 2011-01-17 樹脂成形体及び表面実装型発光装置

Country Status (1)

Country Link
JP (3) JP5262374B2 (enrdf_load_stackoverflow)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5482293B2 (ja) * 2009-03-05 2014-05-07 日亜化学工業株式会社 光半導体装置及びその製造方法
KR101614490B1 (ko) * 2009-11-27 2016-04-21 서울바이오시스 주식회사 발광 다이오드 패키지
US9178120B2 (en) 2010-04-02 2015-11-03 Kaneka Corporation Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode
JP5533203B2 (ja) * 2010-04-30 2014-06-25 日亜化学工業株式会社 発光装置および発光装置の製造方法
CN102376855B (zh) * 2010-08-09 2015-08-19 Lg伊诺特有限公司 发光器件和具有发光器件的照明系统
JP2013030600A (ja) * 2011-07-28 2013-02-07 Sumitomo Bakelite Co Ltd 発熱デバイス
JP2013030597A (ja) * 2011-07-28 2013-02-07 Sumitomo Bakelite Co Ltd 発熱デバイス
TWI424591B (zh) * 2011-08-23 2014-01-21 Jentech Prec Ind Co Ltd 發光二極體封裝結構及其製造方法
CN103258937A (zh) * 2013-04-27 2013-08-21 杭州杭科光电股份有限公司 一种透明贴片式led光源
JP6237826B2 (ja) * 2015-09-30 2017-11-29 日亜化学工業株式会社 パッケージ及び発光装置、並びにそれらの製造方法
CN107086263B (zh) * 2017-04-07 2019-05-03 深圳市华星光电技术有限公司 显示装置及其四面发光led

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07106638A (ja) * 1993-09-30 1995-04-21 Rohm Co Ltd チップ型発光ダイオードの製造方法
JP2908255B2 (ja) * 1994-10-07 1999-06-21 日本電気株式会社 半導体装置
JP3877410B2 (ja) * 1997-12-26 2007-02-07 三洋電機株式会社 半導体装置の製造方法
JP4065051B2 (ja) * 1998-04-17 2008-03-19 スタンレー電気株式会社 表面実装ｌｅｄとその製造方法
JPH11340517A (ja) * 1998-05-22 1999-12-10 Sanken Electric Co Ltd 半導体発光装置
JP4390317B2 (ja) * 1999-07-02 2009-12-24 株式会社ルネサステクノロジ 樹脂封止型半導体パッケージ
JP2003179269A (ja) * 2001-01-24 2003-06-27 Nichia Chem Ind Ltd 光半導体素子
JP2002344030A (ja) * 2001-05-18 2002-11-29 Stanley Electric Co Ltd 横方向発光型面実装ｌｅｄ及びその製造方法
JP4250949B2 (ja) * 2001-11-01 2009-04-08 日亜化学工業株式会社 発光装置及びその製造方法
JP2003209293A (ja) * 2002-01-17 2003-07-25 Stanley Electric Co Ltd 発光ダイオード
JP2003234511A (ja) * 2002-02-06 2003-08-22 Toshiba Corp 半導体発光素子およびその製造方法
JP2003234425A (ja) * 2002-02-07 2003-08-22 Mitsui Chemicals Inc 半導体素子装着用中空パッケージ
JP2003277479A (ja) * 2002-03-22 2003-10-02 Sanyu Rec Co Ltd Ｌｅｄベアチップ搭載用基板の製造方法及び樹脂組成物
JP4611617B2 (ja) * 2002-04-26 2011-01-12 株式会社カネカ 発光ダイオード
JP2004134699A (ja) * 2002-10-15 2004-04-30 Toyoda Gosei Co Ltd 発光装置
JP4633333B2 (ja) * 2003-01-23 2011-02-16 株式会社光波 発光装置
JP3910171B2 (ja) * 2003-02-18 2007-04-25 シャープ株式会社 半導体発光装置、その製造方法および電子撮像装置
CA2464153A1 (en) * 2003-04-14 2004-10-14 Integral Technologies, Inc. Low cost lighting circuits manufactured from conductive loaded resin-based materials
JP4341951B2 (ja) * 2003-05-07 2009-10-14 シチズン電子株式会社 発光ダイオード及びそのパッケージ構造
JP2005243795A (ja) * 2004-02-25 2005-09-08 Matsushita Electric Ind Co Ltd 光半導体装置
JP2005259972A (ja) * 2004-03-11 2005-09-22 Stanley Electric Co Ltd 表面実装型ｌｅｄ
JP4608294B2 (ja) * 2004-11-30 2011-01-12 日亜化学工業株式会社 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法

Also Published As

Publication number Publication date
JP2008252135A (ja) 2008-10-16
JP6346724B2 (ja) 2018-06-20
JP2008252136A (ja) 2008-10-16
JP2011097094A (ja) 2011-05-12

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