JP5251276B2 - 電子部品 - Google Patents
電子部品 Download PDFInfo
- Publication number
- JP5251276B2 JP5251276B2 JP2008150150A JP2008150150A JP5251276B2 JP 5251276 B2 JP5251276 B2 JP 5251276B2 JP 2008150150 A JP2008150150 A JP 2008150150A JP 2008150150 A JP2008150150 A JP 2008150150A JP 5251276 B2 JP5251276 B2 JP 5251276B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- film
- element body
- metal
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 claims description 56
- 239000002184 metal Substances 0.000 claims description 56
- 239000011521 glass Substances 0.000 claims description 47
- 238000007747 plating Methods 0.000 claims description 35
- 239000000919 ceramic Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000000034 method Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 10
- 239000002245 particle Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000011148 porous material Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000003513 alkali Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- 208000023514 Barrett esophagus Diseases 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 229910008434 Si—Bi Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Landscapes
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Chemically Coating (AREA)
Description
次亜リン酸ナトリウム 0.19mol/L
クエン酸 0.05mol/L
塩化アンモニウム 0.65mol/L
アセチレン系添加剤 1g/L
pH 9.5
浴温度 80℃
形成された多孔質Niめっき膜を80℃において乾燥させた後、多孔質Niめっき膜を振動させながら粒径1〜5μm程度のB-Si系ガラス粒子を吹きつけ、多孔質Niめっき膜の孔部にB-Si系ガラス粒子を充填した。
2 多孔質金属めっき膜
3 支持基材
5 素体
6 電子部品
Claims (1)
- セラミック、ガラス、または樹脂を主成分とする素体と、前記素体上に形成された、ガラス成分が充填された多数の孔部を有する多孔質金属めっき膜と、を備える電子部品であって、
前記多孔質金属めっき膜の前記素体に接する面の前記孔部に多くのガラス成分が充填され、
前記多孔質金属めっき膜の前記素体に接する面の反対側の面の前記孔部にほとんどガラス成分が充填されていないことを特徴とする、電子部品。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008150150A JP5251276B2 (ja) | 2008-06-09 | 2008-06-09 | 電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008150150A JP5251276B2 (ja) | 2008-06-09 | 2008-06-09 | 電子部品 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012183861A Division JP5316827B2 (ja) | 2012-08-23 | 2012-08-23 | 電子部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009295897A JP2009295897A (ja) | 2009-12-17 |
JP5251276B2 true JP5251276B2 (ja) | 2013-07-31 |
Family
ID=41543799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008150150A Expired - Fee Related JP5251276B2 (ja) | 2008-06-09 | 2008-06-09 | 電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5251276B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017159024A1 (ja) * | 2016-03-17 | 2017-09-21 | 株式会社村田製作所 | セラミック基板、セラミック基板の製造方法、及びパワーモジュール |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6902266B2 (ja) * | 2017-07-13 | 2021-07-14 | 国立大学法人三重大学 | セラミック基板の製造方法、及びパワーモジュールの製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3317095B2 (ja) * | 1995-06-30 | 2002-08-19 | 株式会社村田製作所 | 圧電共振子及びこの圧電共振子を用いた圧電部品 |
JP2005231937A (ja) * | 2004-02-19 | 2005-09-02 | Meltex Inc | 金属ガラス接合体および金属薄膜とガラス基体との接合方法。 |
JP2007084855A (ja) * | 2005-09-20 | 2007-04-05 | Yamaha Motor Co Ltd | 黒色表面を有するチタン部材およびその製造方法 |
-
2008
- 2008-06-09 JP JP2008150150A patent/JP5251276B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017159024A1 (ja) * | 2016-03-17 | 2017-09-21 | 株式会社村田製作所 | セラミック基板、セラミック基板の製造方法、及びパワーモジュール |
Also Published As
Publication number | Publication date |
---|---|
JP2009295897A (ja) | 2009-12-17 |
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