JP5248918B2 - 電子部品装置及びその製造方法 - Google Patents

電子部品装置及びその製造方法 Download PDF

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Publication number
JP5248918B2
JP5248918B2 JP2008140078A JP2008140078A JP5248918B2 JP 5248918 B2 JP5248918 B2 JP 5248918B2 JP 2008140078 A JP2008140078 A JP 2008140078A JP 2008140078 A JP2008140078 A JP 2008140078A JP 5248918 B2 JP5248918 B2 JP 5248918B2
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Japan
Prior art keywords
conductor
metal
sealing
electronic component
post
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Expired - Fee Related
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JP2008140078A
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Japanese (ja)
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JP2009289926A5 (https=
JP2009289926A (ja
Inventor
孝広 春日
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2008140078A priority Critical patent/JP5248918B2/ja
Publication of JP2009289926A publication Critical patent/JP2009289926A/ja
Publication of JP2009289926A5 publication Critical patent/JP2009289926A5/ja
Application granted granted Critical
Publication of JP5248918B2 publication Critical patent/JP5248918B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2008140078A 2008-05-28 2008-05-28 電子部品装置及びその製造方法 Expired - Fee Related JP5248918B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008140078A JP5248918B2 (ja) 2008-05-28 2008-05-28 電子部品装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008140078A JP5248918B2 (ja) 2008-05-28 2008-05-28 電子部品装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2009289926A JP2009289926A (ja) 2009-12-10
JP2009289926A5 JP2009289926A5 (https=) 2011-06-02
JP5248918B2 true JP5248918B2 (ja) 2013-07-31

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ID=41458869

Family Applications (1)

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JP2008140078A Expired - Fee Related JP5248918B2 (ja) 2008-05-28 2008-05-28 電子部品装置及びその製造方法

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JP (1) JP5248918B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10546819B2 (en) 2016-09-15 2020-01-28 Toshiba Memory Corporation Semiconductor device and method of manufacturing the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6444707B2 (ja) 2014-11-28 2018-12-26 Ｔｏｗａ株式会社 電子部品、その製造方法及び製造装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07254654A (ja) * 1994-03-15 1995-10-03 Fujitsu Ltd 半導体装置の製造方法
JP3798620B2 (ja) * 2000-12-04 2006-07-19 富士通株式会社 半導体装置の製造方法
JP2003174124A (ja) * 2001-12-04 2003-06-20 Sainekkusu:Kk 半導体装置の外部電極形成方法
JP2003249607A (ja) * 2002-02-26 2003-09-05 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
JP3972183B2 (ja) * 2002-03-07 2007-09-05 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10546819B2 (en) 2016-09-15 2020-01-28 Toshiba Memory Corporation Semiconductor device and method of manufacturing the same

Also Published As

Publication number Publication date
JP2009289926A (ja) 2009-12-10

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