JP5248918B2 - 電子部品装置及びその製造方法 - Google Patents

電子部品装置及びその製造方法 Download PDF

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Publication number
JP5248918B2
JP5248918B2 JP2008140078A JP2008140078A JP5248918B2 JP 5248918 B2 JP5248918 B2 JP 5248918B2 JP 2008140078 A JP2008140078 A JP 2008140078A JP 2008140078 A JP2008140078 A JP 2008140078A JP 5248918 B2 JP5248918 B2 JP 5248918B2
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JP
Japan
Prior art keywords
conductor
metal
sealing
electronic component
post
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008140078A
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English (en)
Japanese (ja)
Other versions
JP2009289926A (ja
JP2009289926A5 (enExample
Inventor
孝広 春日
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2008140078A priority Critical patent/JP5248918B2/ja
Publication of JP2009289926A publication Critical patent/JP2009289926A/ja
Publication of JP2009289926A5 publication Critical patent/JP2009289926A5/ja
Application granted granted Critical
Publication of JP5248918B2 publication Critical patent/JP5248918B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2008140078A 2008-05-28 2008-05-28 電子部品装置及びその製造方法 Expired - Fee Related JP5248918B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008140078A JP5248918B2 (ja) 2008-05-28 2008-05-28 電子部品装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008140078A JP5248918B2 (ja) 2008-05-28 2008-05-28 電子部品装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2009289926A JP2009289926A (ja) 2009-12-10
JP2009289926A5 JP2009289926A5 (enExample) 2011-06-02
JP5248918B2 true JP5248918B2 (ja) 2013-07-31

Family

ID=41458869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008140078A Expired - Fee Related JP5248918B2 (ja) 2008-05-28 2008-05-28 電子部品装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP5248918B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10546819B2 (en) 2016-09-15 2020-01-28 Toshiba Memory Corporation Semiconductor device and method of manufacturing the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6444707B2 (ja) 2014-11-28 2018-12-26 Ｔｏｗａ株式会社 電子部品、その製造方法及び製造装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07254654A (ja) * 1994-03-15 1995-10-03 Fujitsu Ltd 半導体装置の製造方法
JP3798620B2 (ja) * 2000-12-04 2006-07-19 富士通株式会社 半導体装置の製造方法
JP2003174124A (ja) * 2001-12-04 2003-06-20 Sainekkusu:Kk 半導体装置の外部電極形成方法
JP2003249607A (ja) * 2002-02-26 2003-09-05 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
JP3972183B2 (ja) * 2002-03-07 2007-09-05 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10546819B2 (en) 2016-09-15 2020-01-28 Toshiba Memory Corporation Semiconductor device and method of manufacturing the same

Also Published As

Publication number Publication date
JP2009289926A (ja) 2009-12-10

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