JP5246679B2 - 架橋性シロキサンポリマー、シロキサン系の架橋性組成物及びシリコーン膜 - Google Patents

架橋性シロキサンポリマー、シロキサン系の架橋性組成物及びシリコーン膜 Download PDF

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JP5246679B2
JP5246679B2 JP2007125074A JP2007125074A JP5246679B2 JP 5246679 B2 JP5246679 B2 JP 5246679B2 JP 2007125074 A JP2007125074 A JP 2007125074A JP 2007125074 A JP2007125074 A JP 2007125074A JP 5246679 B2 JP5246679 B2 JP 5246679B2
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carbon atoms
independently
crosslinkable
hydrogen
alkyl
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JP2008280420A (ja
JP2008280420A5 (zh
Inventor
雅司 國武
悠子 村上
すみれ 知念
智之 大場
清志 坂井
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JNC Corp
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JNC Corp
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  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
JP2007125074A 2007-05-09 2007-05-09 架橋性シロキサンポリマー、シロキサン系の架橋性組成物及びシリコーン膜 Expired - Fee Related JP5246679B2 (ja)

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JP2007125074A JP5246679B2 (ja) 2007-05-09 2007-05-09 架橋性シロキサンポリマー、シロキサン系の架橋性組成物及びシリコーン膜

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JP2007125074A JP5246679B2 (ja) 2007-05-09 2007-05-09 架橋性シロキサンポリマー、シロキサン系の架橋性組成物及びシリコーン膜

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JP2008280420A JP2008280420A (ja) 2008-11-20
JP2008280420A5 JP2008280420A5 (zh) 2010-06-24
JP5246679B2 true JP5246679B2 (ja) 2013-07-24

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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5403730B2 (ja) * 2008-03-07 2014-01-29 株式会社Ａｄｅｋａ 低誘電性絶縁膜、プラズマディスプレイおよびその製造方法
JP5610379B2 (ja) * 2008-11-12 2014-10-22 Jnc株式会社 シロキサンポリマー、シロキサン系の架橋性組成物及びシリコーン膜
JP5369629B2 (ja) * 2008-11-12 2013-12-18 Ｊｎｃ株式会社 架橋性ケイ素化合物、その製造方法、架橋性組成物、シロキサンポリマー、シリコーン膜、該架橋性ケイ素化合物の原料となるケイ素化合物、及びその製造方法
JP2011190413A (ja) * 2010-03-16 2011-09-29 Kumamoto Univ シロキサンポリマー架橋硬化物
WO2013134018A1 (en) * 2012-03-09 2013-09-12 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
CN103030812B (zh) * 2013-01-07 2015-03-04 山东省科学院新材料研究所 一种改性苯基倍半硅氧烷及其制备方法
JP2015155541A (ja) * 2015-02-25 2015-08-27 国立大学法人 熊本大学 シロキサンポリマー架橋硬化物
JP7173689B2 (ja) * 2017-05-24 2022-11-16 ダウ・東レ株式会社 固体シリコーン材料、それを用いてなる積層体および発光デバイス
KR20200014742A (ko) 2017-05-31 2020-02-11 히타치가세이가부시끼가이샤 규소 화합물 및 그 제조 방법
JP2021155462A (ja) * 2018-06-29 2021-10-07 Jnc株式会社 シロキサンポリマー架橋硬化物
JP2020090572A (ja) * 2018-12-04 2020-06-11 Jnc株式会社 縮合硬化型樹脂組成物、硬化物、成形体、及び半導体装置
JPWO2022030354A1 (zh) 2020-08-06 2022-02-10

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0802236B1 (en) * 1995-08-15 2002-04-10 Dow Corning Asia, Ltd. Curable polymethylsilsesquioxane composition
JP4800460B2 (ja) * 1999-12-28 2011-10-26 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物およびその硬化物
JP4742216B2 (ja) * 2004-07-08 2011-08-10 Ｊｎｃ株式会社 ケイ素化合物
JP2007070600A (ja) * 2005-08-11 2007-03-22 Asahi Kasei Corp 封止材用組成物及び光学デバイス

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JP2008280420A (ja) 2008-11-20

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