JP5245283B2 - 熱線遮蔽塩化ビニルフィルム製造用組成物およびその製造方法、並びに、熱線遮蔽塩化ビニルフィルム - Google Patents

熱線遮蔽塩化ビニルフィルム製造用組成物およびその製造方法、並びに、熱線遮蔽塩化ビニルフィルム Download PDF

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Publication number
JP5245283B2
JP5245283B2 JP2007117019A JP2007117019A JP5245283B2 JP 5245283 B2 JP5245283 B2 JP 5245283B2 JP 2007117019 A JP2007117019 A JP 2007117019A JP 2007117019 A JP2007117019 A JP 2007117019A JP 5245283 B2 JP5245283 B2 JP 5245283B2
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Prior art keywords
vinyl chloride
heat ray
fine particles
chloride film
composition
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JP2007117019A
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English (en)
Japanese (ja)
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JP2008274047A (ja
JP2008274047A5 (enExample
Inventor
賢一 藤田
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Sumitomo Metal Mining Co Ltd
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Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to JP2007117019A priority Critical patent/JP5245283B2/ja
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to ES08751940.1T priority patent/ES2587382T3/es
Priority to BRPI0810694A priority patent/BRPI0810694B1/pt
Priority to EP08751940.1A priority patent/EP2143762B1/en
Priority to KR1020097024129A priority patent/KR101507186B1/ko
Priority to US12/450,963 priority patent/US8258226B2/en
Priority to CN2008800134719A priority patent/CN101668812B/zh
Priority to PCT/JP2008/057802 priority patent/WO2008136317A1/ja
Priority to AU2008246747A priority patent/AU2008246747B2/en
Publication of JP2008274047A publication Critical patent/JP2008274047A/ja
Publication of JP2008274047A5 publication Critical patent/JP2008274047A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/203—Solid polymers with solid and/or liquid additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G41/00—Compounds of tungsten
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G41/00—Compounds of tungsten
    • C01G41/02—Oxides; Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G49/00—Compounds of iron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
    • C08L27/06—Homopolymers or copolymers of vinyl chloride
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/30—Three-dimensional structures
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2327/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
    • C08J2327/06—Homopolymers or copolymers of vinyl chloride
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/27—Web or sheet containing structurally defined element or component, the element or component having a specified weight per unit area [e.g., gms/sq cm, lbs/sq ft, etc.]

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Composite Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
JP2007117019A 2007-04-26 2007-04-26 熱線遮蔽塩化ビニルフィルム製造用組成物およびその製造方法、並びに、熱線遮蔽塩化ビニルフィルム Active JP5245283B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2007117019A JP5245283B2 (ja) 2007-04-26 2007-04-26 熱線遮蔽塩化ビニルフィルム製造用組成物およびその製造方法、並びに、熱線遮蔽塩化ビニルフィルム
AU2008246747A AU2008246747B2 (en) 2007-04-26 2008-04-23 Composition for producing vinyl chloride film for shielding heat ray, method for production of the composition, and vinyl chloride film for shielding heat ray
EP08751940.1A EP2143762B1 (en) 2007-04-26 2008-04-23 Composition for producing a heat ray shielding polyvinyl chloride film, method for production of the composition, and heat ray shielding polyvinyl chloride film
KR1020097024129A KR101507186B1 (ko) 2007-04-26 2008-04-23 열선 차폐 염화 비닐 필름 제조용 조성물 및 이의 제조방법, 및 열선 차폐 염화 비닐 필름
US12/450,963 US8258226B2 (en) 2007-04-26 2008-04-23 Composition for manufacturing heat ray-shielding polyvinyl chloride film and manufacturing method of the same, and heat ray-shielding polyvinyl chloride film
CN2008800134719A CN101668812B (zh) 2007-04-26 2008-04-23 热线屏蔽氯乙烯膜制造用组合物及其制造方法、以及热线屏蔽氯乙烯膜
ES08751940.1T ES2587382T3 (es) 2007-04-26 2008-04-23 Composición para producir una película de poli(cloruro de vinilo) protectora de la radiación térmica, procedimiento de producción de la composición y película de poli(cloruro de vinilo) protectora de la radiación térmica
BRPI0810694A BRPI0810694B1 (pt) 2007-04-26 2008-04-23 método de manufatura de uma composição, composição para manufaturar um filme de poli (cloreto de vinila), e, filme de poli (cloreto de vinila) para blindagem contra radiação de calor
PCT/JP2008/057802 WO2008136317A1 (ja) 2007-04-26 2008-04-23 熱線遮蔽塩化ビニルフィルム製造用組成物およびその製造方法、並びに、熱線遮蔽塩化ビニルフィルム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007117019A JP5245283B2 (ja) 2007-04-26 2007-04-26 熱線遮蔽塩化ビニルフィルム製造用組成物およびその製造方法、並びに、熱線遮蔽塩化ビニルフィルム

Publications (3)

Publication Number Publication Date
JP2008274047A JP2008274047A (ja) 2008-11-13
JP2008274047A5 JP2008274047A5 (enExample) 2010-01-28
JP5245283B2 true JP5245283B2 (ja) 2013-07-24

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JP2007117019A Active JP5245283B2 (ja) 2007-04-26 2007-04-26 熱線遮蔽塩化ビニルフィルム製造用組成物およびその製造方法、並びに、熱線遮蔽塩化ビニルフィルム

Country Status (9)

Country Link
US (1) US8258226B2 (enExample)
EP (1) EP2143762B1 (enExample)
JP (1) JP5245283B2 (enExample)
KR (1) KR101507186B1 (enExample)
CN (1) CN101668812B (enExample)
AU (1) AU2008246747B2 (enExample)
BR (1) BRPI0810694B1 (enExample)
ES (1) ES2587382T3 (enExample)
WO (1) WO2008136317A1 (enExample)

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JP2012016679A (ja) * 2010-07-09 2012-01-26 Showa Denko Kk 銅イオンで修飾された酸化タングステン系光触媒の分散液の製造方法
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JP6673353B2 (ja) * 2015-06-30 2020-03-25 住友金属鉱山株式会社 熱線遮蔽膜、熱線遮蔽合わせ透明基材、自動車、建造物
US20170363788A1 (en) * 2016-06-20 2017-12-21 Sumitomo Metal Mining Co., Ltd. Heat-ray shielding particle dispersing liquid, heat-ray shielding particle dispersing body, heat-ray shielding laminated transparent substrate and heat-ray shielding transparent substrate
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Also Published As

Publication number Publication date
CN101668812A (zh) 2010-03-10
JP2008274047A (ja) 2008-11-13
US8258226B2 (en) 2012-09-04
BRPI0810694A2 (pt) 2014-10-21
KR20100017145A (ko) 2010-02-16
US20100140533A1 (en) 2010-06-10
KR101507186B1 (ko) 2015-03-30
ES2587382T3 (es) 2016-10-24
AU2008246747A1 (en) 2008-11-13
AU2008246747B2 (en) 2014-04-24
BRPI0810694B1 (pt) 2018-08-28
EP2143762B1 (en) 2016-05-18
CN101668812B (zh) 2013-07-10
EP2143762A1 (en) 2010-01-13
EP2143762A4 (en) 2010-12-08
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