JP5244262B1 - 表示デバイス用前面板貼り合わせ用接着剤、表示デバイス用前面板貼り合わせ用接着剤セット、表示デバイスの製造方法、及び、表示デバイス - Google Patents
表示デバイス用前面板貼り合わせ用接着剤、表示デバイス用前面板貼り合わせ用接着剤セット、表示デバイスの製造方法、及び、表示デバイス Download PDFInfo
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- JP5244262B1 JP5244262B1 JP2012544781A JP2012544781A JP5244262B1 JP 5244262 B1 JP5244262 B1 JP 5244262B1 JP 2012544781 A JP2012544781 A JP 2012544781A JP 2012544781 A JP2012544781 A JP 2012544781A JP 5244262 B1 JP5244262 B1 JP 5244262B1
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- Prior art keywords
- front plate
- display device
- agent
- adhesive
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
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- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
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- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
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- 150000008366 benzophenones Chemical class 0.000 description 1
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- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- KOMDZQSPRDYARS-UHFFFAOYSA-N cyclopenta-1,3-diene titanium Chemical class [Ti].C1C=CC=C1.C1C=CC=C1 KOMDZQSPRDYARS-UHFFFAOYSA-N 0.000 description 1
- ZOJPTQRKWVDKTP-UHFFFAOYSA-N decane methanol prop-2-enoic acid Chemical compound C(C=C)(=O)O.C(C=C)(=O)O.CO.CO.CCCCCCCCCC ZOJPTQRKWVDKTP-UHFFFAOYSA-N 0.000 description 1
- XJOBOFWTZOKMOH-UHFFFAOYSA-N decanoyl decaneperoxoate Chemical compound CCCCCCCCCC(=O)OOC(=O)CCCCCCCCC XJOBOFWTZOKMOH-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
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- 238000001879 gelation Methods 0.000 description 1
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- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
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- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
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- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
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- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
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- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical group C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- SRSFOMHQIATOFV-UHFFFAOYSA-N octanoyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(=O)CCCCCCC SRSFOMHQIATOFV-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- UOMUPDCRXJLVGR-UHFFFAOYSA-N propane-1,2,2-triol Chemical group CC(O)(O)CO UOMUPDCRXJLVGR-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910021647 smectite Inorganic materials 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
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- 229910052623 talc Inorganic materials 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012544781A JP5244262B1 (ja) | 2011-09-05 | 2012-09-05 | 表示デバイス用前面板貼り合わせ用接着剤、表示デバイス用前面板貼り合わせ用接着剤セット、表示デバイスの製造方法、及び、表示デバイス |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2011193007 | 2011-09-05 | ||
| JP2011193007 | 2011-09-05 | ||
| JP2012015505 | 2012-01-27 | ||
| JP2012015505 | 2012-01-27 | ||
| JP2012544781A JP5244262B1 (ja) | 2011-09-05 | 2012-09-05 | 表示デバイス用前面板貼り合わせ用接着剤、表示デバイス用前面板貼り合わせ用接着剤セット、表示デバイスの製造方法、及び、表示デバイス |
| PCT/JP2012/072565 WO2013035723A1 (ja) | 2011-09-05 | 2012-09-05 | 表示デバイス用前面板貼り合わせ用接着剤、表示デバイス用前面板貼り合わせ用接着剤セット、表示デバイスの製造方法、及び、表示デバイス |
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| JP5244262B1 true JP5244262B1 (ja) | 2013-07-24 |
| JPWO2013035723A1 JPWO2013035723A1 (ja) | 2015-03-23 |
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| Country | Link |
|---|---|
| JP (1) | JP5244262B1 (zh) |
| KR (1) | KR101436274B1 (zh) |
| CN (1) | CN103502372B (zh) |
| TW (1) | TWI429726B (zh) |
| WO (1) | WO2013035723A1 (zh) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014168173A1 (ja) * | 2013-04-10 | 2014-10-16 | 電気化学工業株式会社 | 硬化性樹脂組成物 |
| WO2014174775A1 (ja) * | 2013-04-26 | 2014-10-30 | 昭和電工株式会社 | 貼り合わせ方法および液状流失防止剤 |
| US10377949B2 (en) * | 2013-10-22 | 2019-08-13 | Jnc Corporation | Liquid crystal composition and liquid crystal display device |
| CN105047831B (zh) * | 2015-09-14 | 2017-06-13 | 上海天马有机发光显示技术有限公司 | 一种封装薄膜、显示器件及其封装方法 |
| JP6710125B2 (ja) * | 2016-08-04 | 2020-06-17 | 日本化薬株式会社 | 液晶シール剤及びそれを用いた液晶表示セル |
| US9960389B1 (en) | 2017-05-05 | 2018-05-01 | 3M Innovative Properties Company | Polymeric films and display devices containing such films |
| CN108468691B (zh) * | 2018-03-07 | 2020-06-23 | 金龙机电（杭州）有限公司 | 一种曲面3d触摸屏或显示屏的ab型水胶贴合工艺 |
| JPWO2023112873A1 (zh) * | 2021-12-13 | 2023-06-22 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007510041A (ja) * | 2003-10-27 | 2007-04-19 | アドヒーシブズ・リサーチ・インコーポレイテッド | ポリ（アルキレンオキシド）ポリマー系感圧接着剤及びこれから形成されるテープ |
| JP2007161909A (ja) * | 2005-12-15 | 2007-06-28 | Soken Chem & Eng Co Ltd | 光重合性粘着剤組成物及びこれを利用した粘着シート |
| WO2008056787A1 (fr) * | 2006-11-10 | 2008-05-15 | Asahi Glass Company, Limited | Procédé de fabrication d'un dispositif d'affichage à cristaux liquides et dispositif d'affichage à cristaux liquides |
| JP2008174667A (ja) * | 2007-01-19 | 2008-07-31 | Okura Ind Co Ltd | 活性エネルギー線硬化型接着剤組成物及びそれを用いた偏光板 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6029753B2 (ja) * | 1976-11-01 | 1985-07-12 | 日本合成化学工業株式会社 | 紫外線硬化性樹脂組成物 |
| US8309003B2 (en) * | 2008-10-30 | 2012-11-13 | Lg Display Co., Ltd. | In-plane printing resin material and method of manufacturing liquid crystal display device using the same |
-
2012
- 2012-09-05 TW TW101132455A patent/TWI429726B/zh not_active IP Right Cessation
- 2012-09-05 WO PCT/JP2012/072565 patent/WO2013035723A1/ja active Application Filing
- 2012-09-05 KR KR1020137025347A patent/KR101436274B1/ko active IP Right Grant
- 2012-09-05 CN CN201280021150.XA patent/CN103502372B/zh not_active Expired - Fee Related
- 2012-09-05 JP JP2012544781A patent/JP5244262B1/ja not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007510041A (ja) * | 2003-10-27 | 2007-04-19 | アドヒーシブズ・リサーチ・インコーポレイテッド | ポリ（アルキレンオキシド）ポリマー系感圧接着剤及びこれから形成されるテープ |
| JP2007161909A (ja) * | 2005-12-15 | 2007-06-28 | Soken Chem & Eng Co Ltd | 光重合性粘着剤組成物及びこれを利用した粘着シート |
| WO2008056787A1 (fr) * | 2006-11-10 | 2008-05-15 | Asahi Glass Company, Limited | Procédé de fabrication d'un dispositif d'affichage à cristaux liquides et dispositif d'affichage à cristaux liquides |
| JP2008174667A (ja) * | 2007-01-19 | 2008-07-31 | Okura Ind Co Ltd | 活性エネルギー線硬化型接着剤組成物及びそれを用いた偏光板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2013035723A1 (ja) | 2015-03-23 |
| KR101436274B1 (ko) | 2014-08-29 |
| WO2013035723A1 (ja) | 2013-03-14 |
| CN103502372B (zh) | 2014-08-27 |
| TWI429726B (zh) | 2014-03-11 |
| KR20130126718A (ko) | 2013-11-20 |
| CN103502372A (zh) | 2014-01-08 |
| TW201319200A (zh) | 2013-05-16 |
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