JP5240982B2 - 熱コンジット - Google Patents

熱コンジット Download PDF

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Publication number
JP5240982B2
JP5240982B2 JP2007189219A JP2007189219A JP5240982B2 JP 5240982 B2 JP5240982 B2 JP 5240982B2 JP 2007189219 A JP2007189219 A JP 2007189219A JP 2007189219 A JP2007189219 A JP 2007189219A JP 5240982 B2 JP5240982 B2 JP 5240982B2
Authority
JP
Japan
Prior art keywords
circuit board
thermal conduit
thermal
electrical
conduit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007189219A
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English (en)
Japanese (ja)
Other versions
JP2008060551A (ja
JP2008060551A5 (enExample
Inventor
マーヴィン・シイ・エスピノ
Original Assignee
パワー・インテグレーションズ・インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パワー・インテグレーションズ・インコーポレーテッド filed Critical パワー・インテグレーションズ・インコーポレーテッド
Publication of JP2008060551A publication Critical patent/JP2008060551A/ja
Publication of JP2008060551A5 publication Critical patent/JP2008060551A5/ja
Application granted granted Critical
Publication of JP5240982B2 publication Critical patent/JP5240982B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2007189219A 2006-07-20 2007-07-20 熱コンジット Expired - Fee Related JP5240982B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/490,996 2006-07-20
US11/490,996 US7593235B2 (en) 2006-07-20 2006-07-20 Thermal conduit

Publications (3)

Publication Number Publication Date
JP2008060551A JP2008060551A (ja) 2008-03-13
JP2008060551A5 JP2008060551A5 (enExample) 2010-09-02
JP5240982B2 true JP5240982B2 (ja) 2013-07-17

Family

ID=38457992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007189219A Expired - Fee Related JP5240982B2 (ja) 2006-07-20 2007-07-20 熱コンジット

Country Status (4)

Country Link
US (1) US7593235B2 (enExample)
EP (1) EP1881529A3 (enExample)
JP (1) JP5240982B2 (enExample)
CN (1) CN101111144B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7817434B2 (en) * 2004-10-14 2010-10-19 Agere Systems Inc. Method and apparatus for improving thermal energy dissipation in a direct-chip-attach coupling configuration of an integrated circuit and a circuit board
EP2370981B1 (en) * 2008-12-03 2012-10-10 Planarmag, Inc. An integrated planar variable transformer with embedded magnetic core
EP2276329A1 (en) * 2009-07-16 2011-01-19 ABB Research Ltd. Electronic circuit board with a thermal capacitor
FI20125384A7 (fi) * 2012-04-04 2013-10-05 Tellabs Oy Juotosliitoksella varustettu järjestelmä
KR101519187B1 (ko) * 2012-09-07 2015-05-11 엘지이노텍 주식회사 방열부재, 방열회로기판 및 발열소자 패키지
US20150014024A1 (en) * 2013-07-12 2015-01-15 Kevin Yang Jumper Fin
US10314164B1 (en) * 2017-12-21 2019-06-04 Astec International Limited Circuit board assemblies and methods of assembling circuit boards and bus bars
EP3633720A1 (en) * 2018-10-05 2020-04-08 Aros Electronics AB Surface mounted heat buffer

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB986824A (en) * 1962-01-02 1965-03-24 Gen Electric Co Ltd Improvements in or relating to printed electric circuits
US4254447A (en) 1979-04-10 1981-03-03 Rca Corporation Integrated circuit heat dissipator
JPS6369883A (ja) * 1986-09-12 1988-03-29 Mitsubishi Gas Chem Co Inc 熱・電気伝導性接着剤組成物
JPS63204689A (ja) * 1987-02-20 1988-08-24 オ−ケ−プリント配線株式会社 ハイブリッド基板の放熱構造
JPH0629168U (ja) * 1992-09-18 1994-04-15 株式会社富士通ゼネラル 半田付用部品
JP3207293B2 (ja) * 1993-05-10 2001-09-10 ダイヤセミコンシステムズ株式会社 Ｉｃ部品実装用のピン型ソケットおよび集合型ソケット
KR0126781Y1 (ko) 1994-08-23 1999-05-01 이형도 반도체소자 방열장치
EP0706221B8 (en) * 1994-10-07 2008-09-03 Hitachi, Ltd. Semiconductor device comprising a plurality of semiconductor elements
JPH1084175A (ja) * 1996-09-06 1998-03-31 Canon Inc 電気部品の放熱用熱伝導手段
JPH10242614A (ja) * 1997-02-26 1998-09-11 Canon Inc 部品取付板
US5920458A (en) * 1997-05-28 1999-07-06 Lucent Technologies Inc. Enhanced cooling of a heat dissipating circuit element
US5896271A (en) * 1997-07-21 1999-04-20 Packard Hughes Interconnect Company Integrated circuit with a chip on dot and a heat sink
US6097603A (en) * 1997-10-22 2000-08-01 Thermalloy, Incorporated Heat sink for direct attachment to surface mount electronic device packages
JPH11195889A (ja) * 1997-12-27 1999-07-21 Nec Home Electron Ltd プリント基板用放熱部品
JP2001135906A (ja) * 1999-11-05 2001-05-18 Yazaki Corp 配線板の電気部品接続構造
US7183640B2 (en) * 1999-12-13 2007-02-27 Lamina Ceramics, Inc. Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boards
US6351385B1 (en) * 2000-09-26 2002-02-26 Thomson Licensing, S.A. Heat sink for integrated circuit packages
JP2004253759A (ja) * 2002-12-24 2004-09-09 Auto Network Gijutsu Kenkyusho:Kk 制御回路基板及び回路構成体
JP4155048B2 (ja) * 2003-02-14 2008-09-24 住友電装株式会社 パワーモジュール及びその製造方法

Also Published As

Publication number Publication date
JP2008060551A (ja) 2008-03-13
US7593235B2 (en) 2009-09-22
US20080017406A1 (en) 2008-01-24
CN101111144B (zh) 2012-06-20
EP1881529A2 (en) 2008-01-23
EP1881529A3 (en) 2010-09-22
CN101111144A (zh) 2008-01-23

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