JP5225586B2 - 受光素子 - Google Patents
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- JP5225586B2 JP5225586B2 JP2007002104A JP2007002104A JP5225586B2 JP 5225586 B2 JP5225586 B2 JP 5225586B2 JP 2007002104 A JP2007002104 A JP 2007002104A JP 2007002104 A JP2007002104 A JP 2007002104A JP 5225586 B2 JP5225586 B2 JP 5225586B2
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- 239000013078 crystal Substances 0.000 claims description 57
- 239000000758 substrate Substances 0.000 claims description 56
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims description 43
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 26
- 229910052757 nitrogen Inorganic materials 0.000 claims description 16
- 238000010521 absorption reaction Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 188
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 75
- 239000010408 film Substances 0.000 description 70
- 239000010409 thin film Substances 0.000 description 25
- 239000000203 mixture Substances 0.000 description 19
- 230000035945 sensitivity Effects 0.000 description 16
- 239000000463 material Substances 0.000 description 11
- 230000012010 growth Effects 0.000 description 9
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 229910052787 antimony Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000673 Indium arsenide Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 208000019901 Anxiety disease Diseases 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000036506 anxiety Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0304—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L31/03046—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds including ternary or quaternary compounds, e.g. GaAlAs, InGaAs, InGaAsP
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035236—Superlattices; Multiple quantum well structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
- H01L31/109—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the PN heterojunction type
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/544—Solar cells from Group III-V materials
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- Computer Hardware Design (AREA)
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- Power Engineering (AREA)
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- Inorganic Chemistry (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Light Receiving Elements (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
受光層は少なくとも一方が2.0μm〜3.0μmに感度を有するものであって、過大受光層、過小受光層の組み合わせであり、平均格子不整合は±0.2%以下とする。さらにそれぞれの受光層の厚みts、tlが臨界厚みhcs、hclの1倍〜11倍であるものとする。
hcl<tl<11hcl (5)
(6)
さらに本発明では受光層の上にInP窓層を設けたことで表面再結合が抑制でき暗電流を低減できる。また受光層の上に、InP基板との格子不整合が±0.2%以内のInGaAs層を設け、pn接合を、InGaAs層内に形成することで暗電流の低い受光素子を実現できる。
図8に示すように、Matthews/Blakesleeの式は、無限大厚みのGaAs基板の上にGaAsPのエピ層を成長させたものである。境界で格子不整合による応力が生じ、それがだんだんに増加し、ある膜厚hcでミスフィット転位を生じた方が自由エネルギーが減るので転位が発生する、というものである。
図1に示すような構造のフォトダイオードを作製した。InP基板2の上に、InPバッファ層3を形成し、GaInNAs第1受光層4、InGaAs第2受光層5を40回分交互積層(80層)し、最上部にInP窓層20を形成し、InP窓層の中央部から最上の第2受光層InGaAsに到るp領域22を設けた。InP基板2にはn電極が、p領域22にはp電極が形成されるが、簡単にするため、n電極、p電極の図示を略した。
混晶組成 Ga0.20In0.80N0.04As0.96
格子定数al=0.59334nm
格子不整合=+1.1025%
膜厚tl=70nm(臨界厚み9.1nm)
積層回数nl=40
第1受光層の膜厚合計n1t1=2800nm
混晶組成 In0.35Ga0.65As
格子定数as=0.57952nm
格子不整合=−1.2524%
膜厚ts=70nm(臨界膜厚7.4nm)
積層回数ns=40
第2受光層の膜厚合計nsts=2800nm
受光層合計厚み nltl+nsts=5600nm
平均格子不整合=−0.0735%
実施例1において、第2受光層は、2.0μm〜3.0μmの赤外光には感度がないが1.6μmまでは感度があるので、受光層として作用する。
図2に示すような構造のフォトダイオードを作製した。InP基板2の上に、InPバッファ層3を形成し、GaInNAsSb第1受光層6、GaAsSb第2受光層7をそれぞれ30回、31回分交互に積層(合計61層)し、最上部にInP窓層20を形成し、InP窓層の中央部から最上の第2受光層GaAsSbに到るp領域22を設けた。InP基板2にはn電極が、p領域22にはp電極が形成されるが簡単にするため、n電極、p電極の図示を略した。
混晶組成Ga0.25In0.75N0.04Sb0.05As0.91
格子定数al=0.59343nm
格子不整合=+1.1178%
膜厚tl=80nm(臨界厚み9.1nm)
積層回数nl=30
第1受光層の膜厚合計=tlnl=2400nm
混晶組成GaAs0.65Sb0.35
格子定数as=0.58081nm
格子不整合=−1.0326%
膜厚ts=75nm(臨界膜厚9.2nm)
積層回数ns=31
第2受光層の膜厚合計nsts=2325nm
受光層合計厚み nltl+nsts=4725nm
平均格子不整合=−0.0597%
平均格子不整合は{+1.1178×2400+(−1.0326)×2325}/4725=+0.0597%である。
図3に示すような構造のフォトダイオードを作製した。InP基板2の上に、InPバッファ層3を形成し、GaInNAsSbP第1受光層8、GaInNAs第2受光層9をそれぞれ26回、25回分交互に積層(合計51層)し、最上部にInP窓層20を形成し、InP窓層の中央部から最上の第1受光層GaInNAsSbPに到るp領域22を設けた。InP基板2にはn電極が、p領域22にはp電極が形成されるが簡単にするため、n電極、p電極の図示を略した。
混晶組成 Ga0.25In0.75N0.04Sb0.05P0.01As0.90
格子定数al=0.593475nm
格子不整合=+1.1255%
膜厚tl=90nm(臨界厚み8.8nm)
積層回数nl=26
第1受光層の膜厚合計nltl=2340nm
混晶組成Ga0.51In0.49N0.04As0.96
格子定数as=0.58071nm
格子不整合=−1.0496%
膜厚ts=100nm(臨界膜厚9.5nm)
積層回数ns=25
第2受光層の膜厚合計nsts=2500nm
受光層合計厚み nltl+nsts=4840nm
平均格子不整合=0.0274%
平均格子不整合は{+1.1255×2340+(−1.0496)×2500}/4840=+0.0018%である。
実施例1のGaInNAs/InGaAs交互多層膜構造において、交互膜の最上層とInP窓層20の間に、InGaAs層23を入れたものである。InGaAs層23はInP基板と整合する組成のものである。pn接合はInGaAs層23にある。InGaAs層23のために一層暗電流が減少する。
実施例2のGaInNAsSb/GaAsSb交互多層膜構造において、交互膜の最上層とInP窓層20の間に、InGaAs層23を入れたものである。InGaAs層23はInP基板と整合する組成のものである。pn接合はInGaAs層23にある。InGaAs層23のために一層暗電流が減少する。
実施例3のGaInNAsSbP/GaInNAs交互多層膜構造において、交互膜の最上層とInP窓層20の間に、InGaAs層23を入れたものである。InGaAs層23はInP基板と整合する組成のものである。pn接合はInGaAs層23にある。InGaAs層23のために一層暗電流が減少する。
Claims (4)
- InP基板と、窒素混晶比が5%以下でInP基板格子定数a0より大きい格子定数aのGaInNAsSbP混晶よりなりhc=b(1−νcos2α){log(hc/b)+1}/8πf(1+ν)cosλ(logは自然対数、b=a/21/2、νはポアソン比、fはInPとの格子不整合(a−a0)/a0、cosλ=0.5、cosα=0.5)によって決まる臨界膜厚hcの1倍〜11倍の厚みを持つ過大受光層と、窒素混晶比が5%以下でInP基板格子定数a0より小さい格子定数aのGaInNAsSbP混晶よりなりhc=b(1−νcos2α){log(hc/b)+1}/8πf(1+ν)cosλ(logは自然対数、b=a/21/2、νはポアソン比、fはInPとの格子不整合(a−a0)/a0、cosλ=0.5、cosα=0.5)によって決まる臨界膜厚hcの1倍〜11倍の厚みを持つ過小受光層とを交互積層してなる受光層を有し、過大受光層および過小受光層のInP基板との格子不整合が±0.5%〜±5%であり、過大受光層と過小受光層の少なくとも一方が2.0μm〜3.0μmの間に吸収端波長を持ち、過小受光層、過大受光層のそれぞれの合計厚みが2.0μm〜4.0μmであり、格子不整合に厚みを掛けて平均した平均格子不整合が±0.2%以下であることを特徴とする受光素子。
- 過大受光層が、GaInNAs、GaInNAsSb、GaInNAsP、GaInNAsSbPのいずれかであって、吸収端波長が2.0μm〜3.0μmであることを特徴とする請求項1に記載の受光素子。
- 受光層の上にInP窓層を設けたことを特徴とする請求項1又は2に記載の受光素子。
- 受光層の上に、InP基板との格子不整合が±0.2%以内のInGaAs層を設け、pn接合は、InGaAs層内に形成されていることを特徴とする請求項1〜3のいずれかに記載の受光素子。
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JP2007002104A JP5225586B2 (ja) | 2007-01-10 | 2007-01-10 | 受光素子 |
US12/522,296 US8120061B2 (en) | 2007-01-10 | 2008-01-07 | Light receiving device |
PCT/JP2008/050026 WO2008084772A1 (ja) | 2007-01-10 | 2008-01-07 | 受光素子 |
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JP6132746B2 (ja) * | 2013-11-05 | 2017-05-24 | 浜松ホトニクス株式会社 | 赤外線検出素子 |
US10361243B2 (en) * | 2017-12-15 | 2019-07-23 | Atomera Incorporated | Method for making CMOS image sensor including superlattice to enhance infrared light absorption |
US10396223B2 (en) | 2017-12-15 | 2019-08-27 | Atomera Incorporated | Method for making CMOS image sensor with buried superlattice layer to reduce crosstalk |
US10304881B1 (en) | 2017-12-15 | 2019-05-28 | Atomera Incorporated | CMOS image sensor with buried superlattice layer to reduce crosstalk |
US10355151B2 (en) | 2017-12-15 | 2019-07-16 | Atomera Incorporated | CMOS image sensor including photodiodes with overlying superlattices to reduce crosstalk |
US10276625B1 (en) | 2017-12-15 | 2019-04-30 | Atomera Incorporated | CMOS image sensor including superlattice to enhance infrared light absorption |
US10461118B2 (en) | 2017-12-15 | 2019-10-29 | Atomera Incorporated | Method for making CMOS image sensor including photodiodes with overlying superlattices to reduce crosstalk |
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