JP5220121B2 - レーザー加工装置 - Google Patents

レーザー加工装置 Download PDF

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Publication number
JP5220121B2
JP5220121B2 JP2010533971A JP2010533971A JP5220121B2 JP 5220121 B2 JP5220121 B2 JP 5220121B2 JP 2010533971 A JP2010533971 A JP 2010533971A JP 2010533971 A JP2010533971 A JP 2010533971A JP 5220121 B2 JP5220121 B2 JP 5220121B2
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JP
Japan
Prior art keywords
sensor
laser beam
detection signal
outputs
time
Prior art date
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Expired - Fee Related
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JP2010533971A
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English (en)
Japanese (ja)
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JP2011505252A (ja
Inventor
キム，ヒョン−ジュン
キム，デ−ジン
オム，スン−ファン
リー，クァン−ジェ
Original Assignee
コーニック システムズ カンパニー リミテッド
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Publication of JP2011505252A publication Critical patent/JP2011505252A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Lasers (AREA)
  • Recrystallisation Techniques (AREA)
JP2010533971A 2007-11-19 2008-11-18 レーザー加工装置 Expired - Fee Related JP5220121B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020070117781A KR100939043B1 (ko) 2007-11-19 2007-11-19 레이저 가공장치
KR10-2007-0117781 2007-11-19
PCT/KR2008/006783 WO2009066918A2 (en) 2007-11-19 2008-11-18 Laser processing equipment

Publications (2)

Publication Number Publication Date
JP2011505252A JP2011505252A (ja) 2011-02-24
JP5220121B2 true JP5220121B2 (ja) 2013-06-26

Family

ID=40667978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010533971A Expired - Fee Related JP5220121B2 (ja) 2007-11-19 2008-11-18 レーザー加工装置

Country Status (5)

Country Link
JP (1) JP5220121B2 (ko)
KR (1) KR100939043B1 (ko)
CN (1) CN101868887B (ko)
TW (1) TWI352002B (ko)
WO (1) WO2009066918A2 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2403172B1 (es) * 2011-09-22 2014-12-12 Jeanología, S.L. Método y sistema de ajuste de la alineación de un haz fotónico
JP6261844B2 (ja) * 2012-02-20 2018-01-17 株式会社ディスコ レーザー加工方法およびレーザー加工装置
CN104563976B (zh) * 2013-10-11 2018-04-27 中国石油化工股份有限公司 激光射孔系统以及激光射孔方法
EP3642664A1 (de) * 2017-06-23 2020-04-29 JENOPTIK Optical Systems GmbH Verfahren zur unterstützung einer justage eines strahlaufweiters, justageunterstützungsvorrichtung und strahlaufweiter
EP4056948B1 (en) 2018-10-26 2024-07-03 Concept Laser GmbH Determination device for determining an alignment or a misalignment of an energy beam
KR102688603B1 (ko) 2019-07-30 2024-07-25 삼성디스플레이 주식회사 레이저 결정화 장치 및 이를 이용한 폴리실리콘층을 갖는 기판 제조방법
JP7535687B2 (ja) * 2020-01-15 2024-08-19 パナソニックＩｐマネジメント株式会社 レーザ装置及びそれを用いたレーザ加工装置
CN114505578A (zh) * 2020-11-17 2022-05-17 大族激光科技产业集团股份有限公司 飞行光路的调试方法及装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5215107Y2 (ko) * 1973-09-26 1977-04-05
JPS60130935A (ja) * 1983-12-19 1985-07-12 Mitsubishi Electric Corp レ−ザビ−ム伝送装置
US4879448A (en) * 1988-10-24 1989-11-07 Storage Technology Corporation Apparatus for laser welding and annealing
US5103082A (en) 1990-07-12 1992-04-07 Grumman Aerospace Corporation Automatic laser beam expander-pinhole alignment system
JPH0780671A (ja) * 1993-09-16 1995-03-28 Sanyo Mach Works Ltd レーザ加工機のビーム異常検知方法及び装置
JPH09271971A (ja) * 1996-04-02 1997-10-21 Shinozaki Seisakusho:Kk レーザ加工装置
JP3052928B2 (ja) 1998-04-01 2000-06-19 日本電気株式会社 レーザ加工装置
JP2001284281A (ja) * 2000-03-30 2001-10-12 Sumitomo Heavy Ind Ltd レーザ加工装置及び方法
US7115503B2 (en) 2000-10-10 2006-10-03 The Trustees Of Columbia University In The City Of New York Method and apparatus for processing thin metal layers
JP3903761B2 (ja) 2001-10-10 2007-04-11 株式会社日立製作所 レ−ザアニ−ル方法およびレ−ザアニ−ル装置
US7321114B2 (en) * 2005-03-10 2008-01-22 Hitachi Via Mechanics, Ltd. Apparatus and method for beam drift compensation

Also Published As

Publication number Publication date
CN101868887B (zh) 2012-10-10
JP2011505252A (ja) 2011-02-24
WO2009066918A3 (en) 2009-09-03
WO2009066918A2 (en) 2009-05-28
TWI352002B (en) 2011-11-11
TW200930489A (en) 2009-07-16
KR20090051405A (ko) 2009-05-22
KR100939043B1 (ko) 2010-01-27
CN101868887A (zh) 2010-10-20

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