TWI352002B - Laser processing equipment - Google Patents

Laser processing equipment Download PDF

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Publication number
TWI352002B
TWI352002B TW097144747A TW97144747A TWI352002B TW I352002 B TWI352002 B TW I352002B TW 097144747 A TW097144747 A TW 097144747A TW 97144747 A TW97144747 A TW 97144747A TW I352002 B TWI352002 B TW I352002B
Authority
TW
Taiwan
Prior art keywords
sensor
laser beam
detection signal
laser
reflector
Prior art date
Application number
TW097144747A
Other languages
English (en)
Chinese (zh)
Other versions
TW200930489A (en
Inventor
Hyun-Jung Kim
Dae-Jin Kim
Seung-Hwan Eom
Kwang-Jae Lee
Original Assignee
Kornic Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kornic Systems Corp filed Critical Kornic Systems Corp
Publication of TW200930489A publication Critical patent/TW200930489A/zh
Application granted granted Critical
Publication of TWI352002B publication Critical patent/TWI352002B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Lasers (AREA)
  • Recrystallisation Techniques (AREA)
TW097144747A 2007-11-19 2008-11-19 Laser processing equipment TWI352002B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070117781A KR100939043B1 (ko) 2007-11-19 2007-11-19 레이저 가공장치

Publications (2)

Publication Number Publication Date
TW200930489A TW200930489A (en) 2009-07-16
TWI352002B true TWI352002B (en) 2011-11-11

Family

ID=40667978

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097144747A TWI352002B (en) 2007-11-19 2008-11-19 Laser processing equipment

Country Status (5)

Country Link
JP (1) JP5220121B2 (ko)
KR (1) KR100939043B1 (ko)
CN (1) CN101868887B (ko)
TW (1) TWI352002B (ko)
WO (1) WO2009066918A2 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2403172B1 (es) * 2011-09-22 2014-12-12 Jeanología, S.L. Método y sistema de ajuste de la alineación de un haz fotónico
JP6261844B2 (ja) * 2012-02-20 2018-01-17 株式会社ディスコ レーザー加工方法およびレーザー加工装置
CN104563976B (zh) * 2013-10-11 2018-04-27 中国石油化工股份有限公司 激光射孔系统以及激光射孔方法
EP3642664A1 (de) * 2017-06-23 2020-04-29 JENOPTIK Optical Systems GmbH Verfahren zur unterstützung einer justage eines strahlaufweiters, justageunterstützungsvorrichtung und strahlaufweiter
EP4056948B1 (en) 2018-10-26 2024-07-03 Concept Laser GmbH Determination device for determining an alignment or a misalignment of an energy beam
KR102688603B1 (ko) 2019-07-30 2024-07-25 삼성디스플레이 주식회사 레이저 결정화 장치 및 이를 이용한 폴리실리콘층을 갖는 기판 제조방법
JP7535687B2 (ja) * 2020-01-15 2024-08-19 パナソニックＩｐマネジメント株式会社 レーザ装置及びそれを用いたレーザ加工装置
CN114505578A (zh) * 2020-11-17 2022-05-17 大族激光科技产业集团股份有限公司 飞行光路的调试方法及装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5215107Y2 (ko) * 1973-09-26 1977-04-05
JPS60130935A (ja) * 1983-12-19 1985-07-12 Mitsubishi Electric Corp レ−ザビ−ム伝送装置
US4879448A (en) * 1988-10-24 1989-11-07 Storage Technology Corporation Apparatus for laser welding and annealing
US5103082A (en) 1990-07-12 1992-04-07 Grumman Aerospace Corporation Automatic laser beam expander-pinhole alignment system
JPH0780671A (ja) * 1993-09-16 1995-03-28 Sanyo Mach Works Ltd レーザ加工機のビーム異常検知方法及び装置
JPH09271971A (ja) * 1996-04-02 1997-10-21 Shinozaki Seisakusho:Kk レーザ加工装置
JP3052928B2 (ja) 1998-04-01 2000-06-19 日本電気株式会社 レーザ加工装置
JP2001284281A (ja) * 2000-03-30 2001-10-12 Sumitomo Heavy Ind Ltd レーザ加工装置及び方法
US7115503B2 (en) 2000-10-10 2006-10-03 The Trustees Of Columbia University In The City Of New York Method and apparatus for processing thin metal layers
JP3903761B2 (ja) 2001-10-10 2007-04-11 株式会社日立製作所 レ−ザアニ−ル方法およびレ−ザアニ−ル装置
US7321114B2 (en) * 2005-03-10 2008-01-22 Hitachi Via Mechanics, Ltd. Apparatus and method for beam drift compensation

Also Published As

Publication number Publication date
CN101868887B (zh) 2012-10-10
JP2011505252A (ja) 2011-02-24
WO2009066918A3 (en) 2009-09-03
WO2009066918A2 (en) 2009-05-28
TW200930489A (en) 2009-07-16
KR20090051405A (ko) 2009-05-22
KR100939043B1 (ko) 2010-01-27
CN101868887A (zh) 2010-10-20
JP5220121B2 (ja) 2013-06-26

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MM4A Annulment or lapse of patent due to non-payment of fees