JP5218865B2 - 静電チャック - Google Patents

静電チャック Download PDF

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Publication number
JP5218865B2
JP5218865B2 JP2011061737A JP2011061737A JP5218865B2 JP 5218865 B2 JP5218865 B2 JP 5218865B2 JP 2011061737 A JP2011061737 A JP 2011061737A JP 2011061737 A JP2011061737 A JP 2011061737A JP 5218865 B2 JP5218865 B2 JP 5218865B2
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JP
Japan
Prior art keywords
electrode
groove
main surface
ceramic
ceramic dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011061737A
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English (en)
Japanese (ja)
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JP2011222977A (ja
JP2011222977A5 (enExample
Inventor
裕明 堀
郁夫 板倉
和輝 穴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toto Ltd
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2011061737A priority Critical patent/JP5218865B2/ja
Application filed by Toto Ltd filed Critical Toto Ltd
Priority to PCT/JP2011/057040 priority patent/WO2011118659A1/ja
Priority to US13/635,778 priority patent/US8848335B2/en
Priority to KR1020127023625A priority patent/KR101429591B1/ko
Priority to CN201180012562.2A priority patent/CN102782831B/zh
Priority to TW100110169A priority patent/TWI471974B/zh
Publication of JP2011222977A publication Critical patent/JP2011222977A/ja
Publication of JP2011222977A5 publication Critical patent/JP2011222977A5/ja
Application granted granted Critical
Publication of JP5218865B2 publication Critical patent/JP5218865B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
JP2011061737A 2010-03-26 2011-03-18 静電チャック Active JP5218865B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2011061737A JP5218865B2 (ja) 2010-03-26 2011-03-18 静電チャック
US13/635,778 US8848335B2 (en) 2010-03-26 2011-03-23 Electrostatic chuck
KR1020127023625A KR101429591B1 (ko) 2010-03-26 2011-03-23 정전 척
CN201180012562.2A CN102782831B (zh) 2010-03-26 2011-03-23 静电吸盘
PCT/JP2011/057040 WO2011118659A1 (ja) 2010-03-26 2011-03-23 静電チャック
TW100110169A TWI471974B (zh) 2010-03-26 2011-03-24 Electrostatic sucker

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010073689 2010-03-26
JP2010073689 2010-03-26
JP2011061737A JP5218865B2 (ja) 2010-03-26 2011-03-18 静電チャック

Publications (3)

Publication Number Publication Date
JP2011222977A JP2011222977A (ja) 2011-11-04
JP2011222977A5 JP2011222977A5 (enExample) 2012-10-18
JP5218865B2 true JP5218865B2 (ja) 2013-06-26

Family

ID=44673208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011061737A Active JP5218865B2 (ja) 2010-03-26 2011-03-18 静電チャック

Country Status (6)

Country Link
US (1) US8848335B2 (enExample)
JP (1) JP5218865B2 (enExample)
KR (1) KR101429591B1 (enExample)
CN (1) CN102782831B (enExample)
TW (1) TWI471974B (enExample)
WO (1) WO2011118659A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016143760A (ja) * 2015-02-02 2016-08-08 住友大阪セメント株式会社 静電チャック装置
US12033837B2 (en) 2021-02-19 2024-07-09 Applied Materials, Inc. Electrostatic chuck assembly for cryogenic applications

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5972630B2 (ja) * 2011-03-30 2016-08-17 日本碍子株式会社 静電チャックの製法
JP5992375B2 (ja) 2013-08-08 2016-09-14 株式会社東芝 静電チャック、載置プレート支持台及び静電チャックの製造方法
DE102014008030A1 (de) * 2014-05-28 2015-12-03 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co Verfahren zur Herstellung einer elektrostatischen Haltevorrichtung
JP6424049B2 (ja) * 2014-09-12 2018-11-14 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6346855B2 (ja) 2014-12-25 2018-06-20 東京エレクトロン株式会社 静電吸着方法及び基板処理装置
JP6124156B2 (ja) * 2015-04-21 2017-05-10 Toto株式会社 静電チャックおよびウェーハ処理装置
US10340171B2 (en) 2016-05-18 2019-07-02 Lam Research Corporation Permanent secondary erosion containment for electrostatic chuck bonds
JP2019523989A (ja) * 2016-06-01 2019-08-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 静電チャック及び静電チャックのための製造方法
US11069553B2 (en) * 2016-07-07 2021-07-20 Lam Research Corporation Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity
US10910195B2 (en) 2017-01-05 2021-02-02 Lam Research Corporation Substrate support with improved process uniformity
JP6832171B2 (ja) * 2017-01-24 2021-02-24 東京エレクトロン株式会社 プラズマ処理装置のチャンバ本体の内部のクリーニングを含むプラズマ処理方法
US10147610B1 (en) 2017-05-30 2018-12-04 Lam Research Corporation Substrate pedestal module including metallized ceramic tubes for RF and gas delivery
US11289355B2 (en) * 2017-06-02 2022-03-29 Lam Research Corporation Electrostatic chuck for use in semiconductor processing
US10190216B1 (en) 2017-07-25 2019-01-29 Lam Research Corporation Showerhead tilt mechanism
US11469084B2 (en) 2017-09-05 2022-10-11 Lam Research Corporation High temperature RF connection with integral thermal choke
JP7308254B2 (ja) * 2018-02-19 2023-07-13 日本特殊陶業株式会社 保持装置
JP6504532B1 (ja) * 2018-03-14 2019-04-24 Toto株式会社 静電チャック
KR102543933B1 (ko) * 2018-04-05 2023-06-14 램 리써치 코포레이션 냉각제 가스 존들 및 대응하는 그루브 및 단극성 정전 클램핑 전극 패턴들을 갖는 정전 척들
US11183368B2 (en) 2018-08-02 2021-11-23 Lam Research Corporation RF tuning systems including tuning circuits having impedances for setting and adjusting parameters of electrodes in electrostatic chucks
WO2020153449A1 (ja) * 2019-01-24 2020-07-30 京セラ株式会社 静電チャック
JP6729735B1 (ja) * 2019-03-05 2020-07-22 Toto株式会社 静電チャック
US20210159107A1 (en) * 2019-11-21 2021-05-27 Applied Materials, Inc. Edge uniformity tunability on bipolar electrostatic chuck
JP7548664B2 (ja) * 2020-03-02 2024-09-10 東京エレクトロン株式会社 静電チャックの製造方法、静電チャック及び基板処理装置
US20230369091A1 (en) * 2020-10-01 2023-11-16 Lam Research Corporation High temperature pedestal with extended electrostatic chuck electrode
CN115050682A (zh) * 2021-03-08 2022-09-13 台湾积体电路制造股份有限公司 静电夹具的操作方法和静电夹具
TWI785522B (zh) * 2021-03-08 2022-12-01 台灣積體電路製造股份有限公司 靜電夾具的操作方法和靜電夾具
JP7343069B1 (ja) 2023-03-27 2023-09-12 Toto株式会社 静電チャック
JP7545603B1 (ja) 2024-03-07 2024-09-04 日本特殊陶業株式会社 保持部材
CN118219388B (zh) * 2024-03-26 2025-10-10 君原电子科技(海宁)有限公司 一种静电卡盘陶瓷板干压成型方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100430643B1 (ko) 1994-01-31 2004-05-12 어플라이드 머티어리얼스, 인코포레이티드 두께가 균일한 절연체 막을 갖는 정전기 척
US5822171A (en) 1994-02-22 1998-10-13 Applied Materials, Inc. Electrostatic chuck with improved erosion resistance
JP3457477B2 (ja) 1995-09-06 2003-10-20 日本碍子株式会社 静電チャック
US5810933A (en) 1996-02-16 1998-09-22 Novellus Systems, Inc. Wafer cooling device
EP1194954B1 (en) * 1999-07-08 2011-05-18 Lam Research Corporation Electrostatic chuck and its manufacturing method
JP2002231799A (ja) * 2001-02-06 2002-08-16 Toto Ltd 静電チャック、静電チャックの吸着表面に形成された凹部への放電防止方法、およびその静電チャックを用いた基板固定加熱冷却装置
KR20040070008A (ko) * 2003-01-29 2004-08-06 쿄세라 코포레이션 정전척
TWI267940B (en) 2004-06-28 2006-12-01 Kyocera Corp Electrostatic chuck
US20090086400A1 (en) 2007-09-28 2009-04-02 Intevac, Inc. Electrostatic chuck apparatus
JP4974873B2 (ja) * 2007-12-26 2012-07-11 新光電気工業株式会社 静電チャック及び基板温調固定装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016143760A (ja) * 2015-02-02 2016-08-08 住友大阪セメント株式会社 静電チャック装置
US12033837B2 (en) 2021-02-19 2024-07-09 Applied Materials, Inc. Electrostatic chuck assembly for cryogenic applications
KR102799182B1 (ko) * 2021-02-19 2025-04-21 어플라이드 머티어리얼스, 인코포레이티드 극저온 응용들을 위한 정전 척 조립체
US12347659B2 (en) 2021-02-19 2025-07-01 Applied Materials, Inc. Electrostatic chuck assembly for cryogenic applications

Also Published As

Publication number Publication date
US8848335B2 (en) 2014-09-30
WO2011118659A1 (ja) 2011-09-29
KR101429591B1 (ko) 2014-08-12
TW201138020A (en) 2011-11-01
CN102782831B (zh) 2015-02-18
TWI471974B (zh) 2015-02-01
KR101429591B9 (ko) 2025-09-25
KR20120120415A (ko) 2012-11-01
US20130027838A1 (en) 2013-01-31
JP2011222977A (ja) 2011-11-04
CN102782831A (zh) 2012-11-14

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