KR101429591B1 - 정전 척 - Google Patents

정전 척 Download PDF

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Publication number
KR101429591B1
KR101429591B1 KR1020127023625A KR20127023625A KR101429591B1 KR 101429591 B1 KR101429591 B1 KR 101429591B1 KR 1020127023625 A KR1020127023625 A KR 1020127023625A KR 20127023625 A KR20127023625 A KR 20127023625A KR 101429591 B1 KR101429591 B1 KR 101429591B1
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KR
South Korea
Prior art keywords
electrode
groove
ceramic
main surface
ceramic dielectric
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KR1020127023625A
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English (en)
Korean (ko)
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KR101429591B9 (ko
KR20120120415A (ko
Inventor
히로아키 호리
이쿠오 이타쿠라
카즈키 아나다
Original Assignee
토토 가부시키가이샤
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Publication of KR20120120415A publication Critical patent/KR20120120415A/ko
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Publication of KR101429591B1 publication Critical patent/KR101429591B1/ko
Publication of KR101429591B9 publication Critical patent/KR101429591B9/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
KR1020127023625A 2010-03-26 2011-03-23 정전 척 Active KR101429591B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2010-073689 2010-03-26
JP2010073689 2010-03-26
JP2011061737A JP5218865B2 (ja) 2010-03-26 2011-03-18 静電チャック
JPJP-P-2011-061737 2011-03-18
PCT/JP2011/057040 WO2011118659A1 (ja) 2010-03-26 2011-03-23 静電チャック

Publications (3)

Publication Number Publication Date
KR20120120415A KR20120120415A (ko) 2012-11-01
KR101429591B1 true KR101429591B1 (ko) 2014-08-12
KR101429591B9 KR101429591B9 (ko) 2025-09-25

Family

ID=44673208

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127023625A Active KR101429591B1 (ko) 2010-03-26 2011-03-23 정전 척

Country Status (6)

Country Link
US (1) US8848335B2 (enExample)
JP (1) JP5218865B2 (enExample)
KR (1) KR101429591B1 (enExample)
CN (1) CN102782831B (enExample)
TW (1) TWI471974B (enExample)
WO (1) WO2011118659A1 (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5972630B2 (ja) * 2011-03-30 2016-08-17 日本碍子株式会社 静電チャックの製法
JP5992375B2 (ja) 2013-08-08 2016-09-14 株式会社東芝 静電チャック、載置プレート支持台及び静電チャックの製造方法
DE102014008030A1 (de) * 2014-05-28 2015-12-03 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co Verfahren zur Herstellung einer elektrostatischen Haltevorrichtung
JP6424049B2 (ja) * 2014-09-12 2018-11-14 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6346855B2 (ja) 2014-12-25 2018-06-20 東京エレクトロン株式会社 静電吸着方法及び基板処理装置
JP6520160B2 (ja) * 2015-02-02 2019-05-29 住友大阪セメント株式会社 静電チャック装置
JP6124156B2 (ja) * 2015-04-21 2017-05-10 Toto株式会社 静電チャックおよびウェーハ処理装置
US10340171B2 (en) 2016-05-18 2019-07-02 Lam Research Corporation Permanent secondary erosion containment for electrostatic chuck bonds
JP2019523989A (ja) * 2016-06-01 2019-08-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 静電チャック及び静電チャックのための製造方法
US11069553B2 (en) * 2016-07-07 2021-07-20 Lam Research Corporation Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity
US10910195B2 (en) 2017-01-05 2021-02-02 Lam Research Corporation Substrate support with improved process uniformity
JP6832171B2 (ja) * 2017-01-24 2021-02-24 東京エレクトロン株式会社 プラズマ処理装置のチャンバ本体の内部のクリーニングを含むプラズマ処理方法
US10147610B1 (en) 2017-05-30 2018-12-04 Lam Research Corporation Substrate pedestal module including metallized ceramic tubes for RF and gas delivery
US11289355B2 (en) * 2017-06-02 2022-03-29 Lam Research Corporation Electrostatic chuck for use in semiconductor processing
US10190216B1 (en) 2017-07-25 2019-01-29 Lam Research Corporation Showerhead tilt mechanism
US11469084B2 (en) 2017-09-05 2022-10-11 Lam Research Corporation High temperature RF connection with integral thermal choke
JP7308254B2 (ja) * 2018-02-19 2023-07-13 日本特殊陶業株式会社 保持装置
JP6504532B1 (ja) * 2018-03-14 2019-04-24 Toto株式会社 静電チャック
KR102543933B1 (ko) * 2018-04-05 2023-06-14 램 리써치 코포레이션 냉각제 가스 존들 및 대응하는 그루브 및 단극성 정전 클램핑 전극 패턴들을 갖는 정전 척들
US11183368B2 (en) 2018-08-02 2021-11-23 Lam Research Corporation RF tuning systems including tuning circuits having impedances for setting and adjusting parameters of electrodes in electrostatic chucks
WO2020153449A1 (ja) * 2019-01-24 2020-07-30 京セラ株式会社 静電チャック
JP6729735B1 (ja) * 2019-03-05 2020-07-22 Toto株式会社 静電チャック
US20210159107A1 (en) * 2019-11-21 2021-05-27 Applied Materials, Inc. Edge uniformity tunability on bipolar electrostatic chuck
JP7548664B2 (ja) * 2020-03-02 2024-09-10 東京エレクトロン株式会社 静電チャックの製造方法、静電チャック及び基板処理装置
US20230369091A1 (en) * 2020-10-01 2023-11-16 Lam Research Corporation High temperature pedestal with extended electrostatic chuck electrode
US11776794B2 (en) * 2021-02-19 2023-10-03 Applied Materials, Inc. Electrostatic chuck assembly for cryogenic applications
CN115050682A (zh) * 2021-03-08 2022-09-13 台湾积体电路制造股份有限公司 静电夹具的操作方法和静电夹具
TWI785522B (zh) * 2021-03-08 2022-12-01 台灣積體電路製造股份有限公司 靜電夾具的操作方法和靜電夾具
JP7343069B1 (ja) 2023-03-27 2023-09-12 Toto株式会社 静電チャック
JP7545603B1 (ja) 2024-03-07 2024-09-04 日本特殊陶業株式会社 保持部材
CN118219388B (zh) * 2024-03-26 2025-10-10 君原电子科技(海宁)有限公司 一种静电卡盘陶瓷板干压成型方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09134951A (ja) * 1995-09-06 1997-05-20 Ngk Insulators Ltd 静電チャック
JP2002231799A (ja) * 2001-02-06 2002-08-16 Toto Ltd 静電チャック、静電チャックの吸着表面に形成された凹部への放電防止方法、およびその静電チャックを用いた基板固定加熱冷却装置
JP2003504871A (ja) * 1999-07-08 2003-02-04 ラム リサーチ コーポレーション 静電チャックおよびその製造方法

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* Cited by examiner, † Cited by third party
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KR100430643B1 (ko) 1994-01-31 2004-05-12 어플라이드 머티어리얼스, 인코포레이티드 두께가 균일한 절연체 막을 갖는 정전기 척
US5822171A (en) 1994-02-22 1998-10-13 Applied Materials, Inc. Electrostatic chuck with improved erosion resistance
US5810933A (en) 1996-02-16 1998-09-22 Novellus Systems, Inc. Wafer cooling device
KR20040070008A (ko) * 2003-01-29 2004-08-06 쿄세라 코포레이션 정전척
TWI267940B (en) 2004-06-28 2006-12-01 Kyocera Corp Electrostatic chuck
US20090086400A1 (en) 2007-09-28 2009-04-02 Intevac, Inc. Electrostatic chuck apparatus
JP4974873B2 (ja) * 2007-12-26 2012-07-11 新光電気工業株式会社 静電チャック及び基板温調固定装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09134951A (ja) * 1995-09-06 1997-05-20 Ngk Insulators Ltd 静電チャック
JP2003504871A (ja) * 1999-07-08 2003-02-04 ラム リサーチ コーポレーション 静電チャックおよびその製造方法
JP2002231799A (ja) * 2001-02-06 2002-08-16 Toto Ltd 静電チャック、静電チャックの吸着表面に形成された凹部への放電防止方法、およびその静電チャックを用いた基板固定加熱冷却装置

Also Published As

Publication number Publication date
US8848335B2 (en) 2014-09-30
WO2011118659A1 (ja) 2011-09-29
JP5218865B2 (ja) 2013-06-26
TW201138020A (en) 2011-11-01
CN102782831B (zh) 2015-02-18
TWI471974B (zh) 2015-02-01
KR101429591B9 (ko) 2025-09-25
KR20120120415A (ko) 2012-11-01
US20130027838A1 (en) 2013-01-31
JP2011222977A (ja) 2011-11-04
CN102782831A (zh) 2012-11-14

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