JP5215985B2 - プリント配線板の放熱構造 - Google Patents
プリント配線板の放熱構造 Download PDFInfo
- Publication number
- JP5215985B2 JP5215985B2 JP2009284241A JP2009284241A JP5215985B2 JP 5215985 B2 JP5215985 B2 JP 5215985B2 JP 2009284241 A JP2009284241 A JP 2009284241A JP 2009284241 A JP2009284241 A JP 2009284241A JP 5215985 B2 JP5215985 B2 JP 5215985B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating material
- pattern
- clearance
- conductive insulating
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 title claims description 11
- 239000011810 insulating material Substances 0.000 claims description 52
- 239000007787 solid Substances 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 19
- 239000002344 surface layer Substances 0.000 claims description 18
- 239000010410 layer Substances 0.000 claims description 17
- 238000009413 insulation Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- 239000010949 copper Substances 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 238000007796 conventional method Methods 0.000 description 6
- 238000004088 simulation Methods 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
Claims (1)
- 発熱源となる電子部品若しくは回路パターンと、特定幅のクリアランスを介して設けられる複数の導体べたパターンとから成る配線層を少なくとも1層以上有するプリント配線板の放熱構造であって、温度低減を図りたい発熱源側表層面において、前記各パターン間のクリアランスに、このクリアランスの両側の前記各パターンに接触するように電気絶縁性のある熱伝導率が1W/m・K以上の高熱伝導絶縁材を設け、前記クリアランス上にのみこの高熱伝導絶縁材を部品搭載面積を除くプリント配線板の前記発熱源側表層面の全表面積の80%未満の面積で設け、前記高熱伝導絶縁材が接触している前記クリアランスの両側の各パターンをネットとし、全ネット間の総当り組み合わせにおいて絶縁抵抗を測定した際、絶縁抵抗が全ての組み合わせで10 6 Ω以上となるように前記高熱伝導絶縁材を設けたことを特徴とするプリント配線板の放熱構造。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009284241A JP5215985B2 (ja) | 2009-12-15 | 2009-12-15 | プリント配線板の放熱構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009284241A JP5215985B2 (ja) | 2009-12-15 | 2009-12-15 | プリント配線板の放熱構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011129581A JP2011129581A (ja) | 2011-06-30 |
JP5215985B2 true JP5215985B2 (ja) | 2013-06-19 |
Family
ID=44291890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009284241A Active JP5215985B2 (ja) | 2009-12-15 | 2009-12-15 | プリント配線板の放熱構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5215985B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5664527B2 (ja) * | 2011-11-11 | 2015-02-04 | 株式会社デンソー | 配線基板 |
JP2018093030A (ja) * | 2016-12-01 | 2018-06-14 | 三菱電機株式会社 | 電子機器および電子機器の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5623906Y2 (ja) * | 1975-05-10 | 1981-06-04 | ||
JPH06167806A (ja) * | 1992-11-30 | 1994-06-14 | Sony Corp | ソルダーレジストインキ組成物及びこれを用いたプリント配線基板 |
JPH07147467A (ja) * | 1993-11-25 | 1995-06-06 | Hitachi Ltd | 電子部品の放熱方法 |
JP3956516B2 (ja) * | 1999-01-11 | 2007-08-08 | 株式会社デンソー | プリント基板の実装構造 |
KR100336401B1 (ko) * | 2000-04-10 | 2002-05-10 | 조병우 | 인쇄 회로 기판의 제작 장치 및 그 방법 |
JP2009295648A (ja) * | 2008-06-03 | 2009-12-17 | Cmk Corp | プリント配線板 |
-
2009
- 2009-12-15 JP JP2009284241A patent/JP5215985B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2011129581A (ja) | 2011-06-30 |
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