JP5214671B2 - プリント配線基板の製造方法 - Google Patents
プリント配線基板の製造方法 Download PDFInfo
- Publication number
- JP5214671B2 JP5214671B2 JP2010155137A JP2010155137A JP5214671B2 JP 5214671 B2 JP5214671 B2 JP 5214671B2 JP 2010155137 A JP2010155137 A JP 2010155137A JP 2010155137 A JP2010155137 A JP 2010155137A JP 5214671 B2 JP5214671 B2 JP 5214671B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- multilayer substrate
- printed wiring
- wiring board
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Description
11,24…金属箔
12,14,21,23…プリプレグ
13,15,22…コア基板
20…第2の多層基板
Claims (3)
- 金属箔又はコア基板と、層間接続用のプリプレグとが積層されて成る第1の多層基板に導通孔を設け、
前記導通孔の内側の壁面にメッキ加工を施し、
前記メッキ加工を施した導通孔に樹脂を充填し、
前記樹脂を充填した導通孔を塞ぐように前記第1の多層基板に蓋メッキ加工を施し、
前記第1の多層基板の一方の表面に、前記蓋メッキ加工を施した導通孔の上から第2の多層基板を積層し、
前記第1の多層基板から前記第2の多層基板まで貫通する貫通孔を、前記メッキ加工が施された部分が前記貫通孔を囲むように設け、
前記導通孔に充填された樹脂を除去することを特徴とするプリント配線基板の製造方法。 - 前記導通孔は、単一の孔であり、
前記貫通孔は、前記導通孔よりも小さいことを特徴とする請求項1記載のプリント配線基板の製造方法。 - 前記導通孔は、複数の孔であり、
前記複数の孔は、前記貫通孔と一部が重なり、かつ、前記貫通孔を囲む位置にそれぞれ設けられ、
前記貫通孔は、前記複数の孔の一部を除去するように設けられることを特徴とする請求項1記載のプリント配線基板の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010155137A JP5214671B2 (ja) | 2010-07-07 | 2010-07-07 | プリント配線基板の製造方法 |
ES11173152T ES2433670T3 (es) | 2010-07-07 | 2011-07-07 | Método para la fabricación de una placa de circuito impreso |
EP20110173152 EP2405726B1 (en) | 2010-07-07 | 2011-07-07 | Method for manufacturing a printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010155137A JP5214671B2 (ja) | 2010-07-07 | 2010-07-07 | プリント配線基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012019049A JP2012019049A (ja) | 2012-01-26 |
JP5214671B2 true JP5214671B2 (ja) | 2013-06-19 |
Family
ID=44653895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010155137A Expired - Fee Related JP5214671B2 (ja) | 2010-07-07 | 2010-07-07 | プリント配線基板の製造方法 |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2405726B1 (ja) |
JP (1) | JP5214671B2 (ja) |
ES (1) | ES2433670T3 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108882568B (zh) * | 2018-08-27 | 2020-07-24 | 生益电子股份有限公司 | 一种pcb的制作方法 |
CN113826450A (zh) | 2019-05-31 | 2021-12-21 | 京瓷株式会社 | 印刷布线板以及印刷布线板的制造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06164138A (ja) * | 1992-11-27 | 1994-06-10 | Hitachi Telecom Technol Ltd | 片面スルーホール基板 |
MY120077A (en) * | 1998-06-26 | 2005-08-30 | Ibiden Co Ltd | Multilayer printed wiring board having a roughened inner conductor layer and production method thereof |
JP3838800B2 (ja) * | 1998-12-15 | 2006-10-25 | 富士通株式会社 | 多層プリント配線板製造方法 |
JP2001189559A (ja) * | 1999-12-28 | 2001-07-10 | Matsushita Electric Works Ltd | ビルドアッププリント配線板の製造方法 |
JP2005235963A (ja) * | 2004-02-19 | 2005-09-02 | Hitachi Ltd | プリント基板スルーホール形成方法 |
JP2009099621A (ja) * | 2007-10-12 | 2009-05-07 | Fujitsu Ltd | 基板の製造方法 |
JP2009158815A (ja) * | 2007-12-27 | 2009-07-16 | Fujitsu Ltd | 多層配線基板の製造方法および多層配線基板構造 |
JP2009164353A (ja) * | 2008-01-07 | 2009-07-23 | Fujitsu Ltd | 配線板及びその製造方法、配線板組立体 |
-
2010
- 2010-07-07 JP JP2010155137A patent/JP5214671B2/ja not_active Expired - Fee Related
-
2011
- 2011-07-07 ES ES11173152T patent/ES2433670T3/es active Active
- 2011-07-07 EP EP20110173152 patent/EP2405726B1/en not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
EP2405726A3 (en) | 2012-08-29 |
EP2405726A2 (en) | 2012-01-11 |
JP2012019049A (ja) | 2012-01-26 |
EP2405726B1 (en) | 2013-10-23 |
ES2433670T3 (es) | 2013-12-12 |
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