JP5214347B2 - 半導体装置の製造方法および半導体装置の製造装置 - Google Patents

半導体装置の製造方法および半導体装置の製造装置 Download PDF

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Publication number
JP5214347B2
JP5214347B2 JP2008164692A JP2008164692A JP5214347B2 JP 5214347 B2 JP5214347 B2 JP 5214347B2 JP 2008164692 A JP2008164692 A JP 2008164692A JP 2008164692 A JP2008164692 A JP 2008164692A JP 5214347 B2 JP5214347 B2 JP 5214347B2
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Japan
Prior art keywords
wafer
heating
wafers
holder
heating surface
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Expired - Fee Related
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JP2008164692A
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English (en)
Japanese (ja)
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JP2010010210A5 (enExample
JP2010010210A (ja
Inventor
昌己 上村
健一 吉野
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Toshiba Corp
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Toshiba Corp
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Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2008164692A priority Critical patent/JP5214347B2/ja
Priority to US12/490,753 priority patent/US7897524B2/en
Publication of JP2010010210A publication Critical patent/JP2010010210A/ja
Priority to US12/929,364 priority patent/US8420555B2/en
Publication of JP2010010210A5 publication Critical patent/JP2010010210A5/ja
Application granted granted Critical
Publication of JP5214347B2 publication Critical patent/JP5214347B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H01L21/2686—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation using incoherent radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2008164692A 2008-06-24 2008-06-24 半導体装置の製造方法および半導体装置の製造装置 Expired - Fee Related JP5214347B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008164692A JP5214347B2 (ja) 2008-06-24 2008-06-24 半導体装置の製造方法および半導体装置の製造装置
US12/490,753 US7897524B2 (en) 2008-06-24 2009-06-24 Manufacturing method for semiconductor device and manufacturing apparatus for semiconductor device
US12/929,364 US8420555B2 (en) 2008-06-24 2011-01-19 Manufacturing method for semiconductor device and manufacturing apparatus for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008164692A JP5214347B2 (ja) 2008-06-24 2008-06-24 半導体装置の製造方法および半導体装置の製造装置

Publications (3)

Publication Number Publication Date
JP2010010210A JP2010010210A (ja) 2010-01-14
JP2010010210A5 JP2010010210A5 (enExample) 2012-08-09
JP5214347B2 true JP5214347B2 (ja) 2013-06-19

Family

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Family Applications (1)

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JP2008164692A Expired - Fee Related JP5214347B2 (ja) 2008-06-24 2008-06-24 半導体装置の製造方法および半導体装置の製造装置

Country Status (2)

Country Link
US (2) US7897524B2 (enExample)
JP (1) JP5214347B2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2571529B2 (ja) 1993-11-11 1997-01-16 有限会社トーワ マットの製造方法
US8563121B2 (en) 2000-03-15 2013-10-22 C-Eng Co., Ltd. Three-dimensional netted structure having four molded surfaces

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150090295A1 (en) * 2013-09-28 2015-04-02 Applied Materials, Inc. Apparatus and methods for a mask inverter
KR20160004601A (ko) * 2014-07-03 2016-01-13 삼성전자주식회사 반도체 패키지의 제조 시스템 및 이의 제조 방법
GB2560299B (en) 2017-02-01 2021-07-07 Nicoventures Trading Ltd Heating element and method of analysing
GB201701633D0 (en) 2017-02-01 2017-03-15 Nicoventures Holdings Ltd Heating element selection method
JP7325350B2 (ja) * 2020-02-03 2023-08-14 東京エレクトロン株式会社 成膜装置

Family Cites Families (23)

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Publication number Priority date Publication date Assignee Title
US4804633A (en) * 1988-02-18 1989-02-14 Northern Telecom Limited Silicon-on-insulator substrates annealed in polysilicon tube
JPH0513355A (ja) * 1991-07-05 1993-01-22 Hitachi Ltd ランプアニール装置
US5445675A (en) 1992-07-09 1995-08-29 Tel-Varian Limited Semiconductor processing apparatus
US5830277A (en) * 1995-05-26 1998-11-03 Mattson Technology, Inc. Thermal processing system with supplemental resistive heater and shielded optical pyrometry
US6332835B1 (en) * 1997-11-20 2001-12-25 Canon Kabushiki Kaisha Polishing apparatus with transfer arm for moving polished object without drying it
JPH11340157A (ja) * 1998-05-29 1999-12-10 Sony Corp 光照射熱処理装置および光照射熱処理方法
JP2000286200A (ja) * 1999-03-31 2000-10-13 Kokusai Electric Co Ltd 熱処理方法および熱処理装置
JP3327289B2 (ja) * 2000-03-29 2002-09-24 株式会社ニコン 工程終了点測定装置及び測定方法及び研磨装置及び半導体デバイス製造方法及び信号処理プログラムを記録した記録媒体
TW550635B (en) * 2001-03-09 2003-09-01 Toshiba Corp Manufacturing system of electronic devices
JP3755814B2 (ja) * 2001-08-07 2006-03-15 東京エレクトロン株式会社 熱処理方法及び熱処理装置
JP2003077974A (ja) * 2001-08-31 2003-03-14 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
JP4663184B2 (ja) * 2001-09-26 2011-03-30 パナソニック株式会社 半導体装置の製造方法
US6849831B2 (en) 2002-03-29 2005-02-01 Mattson Technology, Inc. Pulsed processing semiconductor heating methods using combinations of heating sources
US6932871B2 (en) * 2002-04-16 2005-08-23 Applied Materials, Inc. Multi-station deposition apparatus and method
JP2004186495A (ja) * 2002-12-04 2004-07-02 Toshiba Corp 半導体装置の製造装置、半導体装置の製造方法、および半導体装置
US8658945B2 (en) * 2004-02-27 2014-02-25 Applied Materials, Inc. Backside rapid thermal processing of patterned wafers
US7283734B2 (en) 2004-08-24 2007-10-16 Fujitsu Limited Rapid thermal processing apparatus and method of manufacture of semiconductor device
JP4786925B2 (ja) 2005-04-04 2011-10-05 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP2007095889A (ja) * 2005-09-28 2007-04-12 Ushio Inc 光照射式加熱方法
WO2007091638A1 (ja) * 2006-02-09 2007-08-16 Sumco Techxiv Corporation サセプタおよびエピタキシャルウェハの製造装置
JP2007258286A (ja) * 2006-03-22 2007-10-04 Tokyo Electron Ltd 熱処理装置、熱処理方法及び記憶媒体
TWI395272B (zh) 2008-05-02 2013-05-01 Applied Materials Inc 用於旋轉基板之非徑向溫度控制系統
US20090298300A1 (en) 2008-05-09 2009-12-03 Applied Materials, Inc. Apparatus and Methods for Hyperbaric Rapid Thermal Processing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2571529B2 (ja) 1993-11-11 1997-01-16 有限会社トーワ マットの製造方法
US8563121B2 (en) 2000-03-15 2013-10-22 C-Eng Co., Ltd. Three-dimensional netted structure having four molded surfaces

Also Published As

Publication number Publication date
JP2010010210A (ja) 2010-01-14
US20090325324A1 (en) 2009-12-31
US7897524B2 (en) 2011-03-01
US8420555B2 (en) 2013-04-16
US20110117512A1 (en) 2011-05-19

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