JP5212348B2 - 耐燃料性パッケージ - Google Patents
耐燃料性パッケージ Download PDFInfo
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Description
図1は、本発明の第1実施形態に係る耐燃料性パッケージS1の概略断面構成を示す図である。図1に示されるように、このパッケージS1は、芳香族またはエタノールを含む燃料雰囲気1にさらされた状態で使用されるものであり、たとえば自動車に搭載される各種センサ装置として適用される。ここで、燃料としては芳香族またはエタノールを含むガソリン、いわゆる劣化ガソリン等が挙げられる。
まず、封止材70のエポキシ樹脂のガラス転移温度を180℃以上とすることについて述べる。これについては、封止材70としてエポキシ樹脂のガラス転移温度が100℃未満のものと、180℃のものとについて、80℃の劣化ガソリン中に1000時間浸漬する浸漬試験を行い、浸漬前後でNMR測定を行い、そのスペクトルから、劣化ガソリン中の芳香族とエタノールに起因するピークの増減を調べた。
次に、ガラス転移温度が180℃以上のエポキシ樹脂として、ナフタレン系エポキシを用いた場合とグリシジルアミン系エポキシを用いた場合とを比較し、誘電率および分子構造の相違による硬化を調査した。具体的には、当該両場合の封止材を、80℃の劣化ガソリン中に浸漬し、その浸漬時間と封止材の質量変化との関係を求めた。
次に、フィラーの含有量については、樹脂よりなる封止材70中の樹脂成分が多すぎると、燃料中の上記成分の透過量も多くなることから、ある程度フィラーの含有量を多くして封止材70中の樹脂部分を少なくすれば、燃料中の上記成分の透過量が抑制されると考えられる。そこで、フィラーの含有量と燃料中の上記成分の透過度合との関係について、実験的に調査した。
硬化剤については、封止材70の塗布の段階で適度な低粘性を確保するものとして、比較的低粘性であるアミン系硬化剤と酸無水物系硬化剤とを選択し、これらについて、封止材70と被封止材71との密着力に着目して比較を行った。まず、当該密着力は、封止材70中の樹脂のOH基による水素結合が大きく寄与していると考えられることから、当該両硬化剤について、グリシジルアミン系エポキシの開環率を調査した。
また、本発明者は、エポキシ樹脂としてのガラス転移温度が180℃、誘電率が3.5である上記グリシジルアミン系エポキシと、アミン系硬化剤と含む樹脂に、フィラーが80重量%含有されてなる封止材70について、その機械的強度を調査した。
図7は、本発明の第2実施形態に係る耐燃料性パッケージの要部の概略断面構成を示す図である。本実施形態は、上記第1実施形態に比べて、封止材70で封止される対象物が相違するものであり、ここでは、その相違点を中心に述べることとする。
図8は、本発明の第3実施形態に係る耐燃料性パッケージの概略断面構成を示す図である。図8に示されるように、本実施形態のパッケージでは、上記第1実施形態のパッケージS1(図1参照)に比べて、ワイヤ30およびその近傍のセンサチップ10が、封止材70ではなく、第1の樹脂部61により封止されている。
図9は、本発明の第4実施形態に係る耐燃料性パッケージの概略断面構成を示す図である。本実施形態は、上記第1実施形態に比べて、封止材70で封止される対象物が相違するものである。
図10は、本発明の第5実施形態に係る耐燃料性パッケージの概略断面構成を示す図である。本実施形態のパッケージは、回路チップ11、接着剤50、第1の基板20およびワイヤ30といった上記図9と同様の構成に加え、第1の基板20に接合された第2の基板40、第1の基板20の一面上にて回路チップ11およびワイヤ30の全体を封止する第1の樹脂部61、さらに第1の樹脂部61の一部および両基板20、40の一部を封止する第2の樹脂部62により、被封止材75が構成されている。
なお、封止材70中のエポキシ樹脂としては、ガラス転移温度が180℃以上、誘電率が3.5以下であるものであればよく、上記実施形態に示したグリシジルアミン系エポキシなどに限定されるものではない。たとえば、グリシジルアミン系エポキシ以外の多環能式エポキシであってもよい。
20 第2の部材としての第1の基板
30 接続部材としてのワイヤ
31 接続部材としてのバンプ
61 第1の樹脂部
62 第2の樹脂部
70 封止材
71〜75 被封止材
Claims (3)
- 芳香族またはエタノールを含む燃料雰囲気にて使用される被封止材(71〜75)と、前記被封止材(71〜75)を封止して前記燃料より保護する封止材(70)とを有する耐燃料性パッケージであって、
前記封止材(70)は、ガラス転移温度が180℃以上、誘電率が3.5以下であるグリシジルアミン系エポキシ、このグリシジルアミン系エポキシを開環させて硬化するアミン系硬化剤、およびシリカよりなるフィラーが含有された樹脂より、形成されたものであることを特徴とする耐燃料性パッケージ。 - 前記被封止材(71)は、第1の部材(10)と第2の部材(20)とこれら両部材(10、20)を電気的に接続する接続部材(30、31)とを備えたものであり、
前記接続部材(30、31)が前記封止材(70)により封止されていることを特徴とする請求項1に記載の耐燃料性パッケージ。 - 前記被封止材(71、73)は、一次成形された第1の樹脂部(61)と前記第1の樹脂部(61)に接して二次成形された第2の樹脂部(62)とを備えたものであり、
前記第1の樹脂部(61)と前記第2の樹脂部(62)との界面部が前記封止材(70)により封止されていることを特徴とする請求項1または2に記載の耐燃料性パッケージ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2009283719A JP5212348B2 (ja) | 2009-12-15 | 2009-12-15 | 耐燃料性パッケージ |
US12/965,014 US20110139802A1 (en) | 2009-12-15 | 2010-12-10 | Fuel resistance package |
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JP2009283719A JP5212348B2 (ja) | 2009-12-15 | 2009-12-15 | 耐燃料性パッケージ |
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JP2011129553A JP2011129553A (ja) | 2011-06-30 |
JP5212348B2 true JP5212348B2 (ja) | 2013-06-19 |
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JP2009283719A Expired - Fee Related JP5212348B2 (ja) | 2009-12-15 | 2009-12-15 | 耐燃料性パッケージ |
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JP (1) | JP5212348B2 (ja) |
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JP5648527B2 (ja) * | 2011-02-22 | 2015-01-07 | 株式会社デンソー | コネクタ付半導体装置とその製造方法 |
DE112013003548T5 (de) * | 2012-07-16 | 2015-04-02 | Denso Corporation | Elektronische Vorrichtung und Verfahren zum Herstellen derselben |
DE102013226236A1 (de) * | 2013-12-17 | 2015-06-18 | Robert Bosch Gmbh | Elektrische Baugruppe |
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US4168394A (en) * | 1977-09-26 | 1979-09-18 | Yuey David D | Electric penetration assembly |
JP3890739B2 (ja) * | 1998-04-24 | 2007-03-07 | 株式会社デンソー | 半導体圧力センサ装置 |
JP2001305152A (ja) * | 2000-04-18 | 2001-10-31 | Fuji Electric Co Ltd | 半導体センサチップおよびその製造方法、半導体センサチップを備えた半導体センサ |
JP2004354294A (ja) * | 2003-05-30 | 2004-12-16 | Hitachi Ltd | 圧力センサ |
JP4969931B2 (ja) * | 2006-07-10 | 2012-07-04 | 日本化薬株式会社 | エポキシ樹脂、その製造方法及びその用途 |
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US20110139802A1 (en) | 2011-06-16 |
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