JP5204124B2 - スパッタリングターゲット修復用の方法 - Google Patents

スパッタリングターゲット修復用の方法 Download PDF

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Publication number
JP5204124B2
JP5204124B2 JP2009543294A JP2009543294A JP5204124B2 JP 5204124 B2 JP5204124 B2 JP 5204124B2 JP 2009543294 A JP2009543294 A JP 2009543294A JP 2009543294 A JP2009543294 A JP 2009543294A JP 5204124 B2 JP5204124 B2 JP 5204124B2
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Japan
Prior art keywords
sputtering target
target
powder
metal
repaired
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JP2009543294A
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English (en)
Japanese (ja)
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JP2010514921A5 (enExample
JP2010514921A (ja
Inventor
アッカー，ロバート
ガングリー，アドリッシュ
ティー． ウィルソン，マシュー
Original Assignee
マテリオン アドバンスト マテリアルズ テクノロジーズ アンド サービシーズ インコーポレイティド
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/082—Coating starting from inorganic powder by application of heat or pressure and heat without intermediate formation of a liquid in the layer
    • C23C24/085—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
    • C23C24/087—Coating with metal alloys or metal elements only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F2007/068—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts repairing articles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T82/00—Turning
    • Y10T82/10—Process of turning

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
JP2009543294A 2007-07-17 2008-07-16 スパッタリングターゲット修復用の方法 Active JP5204124B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US95026407P 2007-07-17 2007-07-17
US60/950,264 2007-07-17
PCT/US2008/070109 WO2009012278A1 (en) 2007-07-17 2008-07-16 Process for the refurbishing of a sputtering target

Publications (3)

Publication Number Publication Date
JP2010514921A JP2010514921A (ja) 2010-05-06
JP2010514921A5 JP2010514921A5 (enExample) 2011-04-07
JP5204124B2 true JP5204124B2 (ja) 2013-06-05

Family

ID=40260042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009543294A Active JP5204124B2 (ja) 2007-07-17 2008-07-16 スパッタリングターゲット修復用の方法

Country Status (7)

Country Link
US (1) US7871563B2 (enExample)
EP (1) EP2087144B1 (enExample)
JP (1) JP5204124B2 (enExample)
DK (1) DK2087144T3 (enExample)
ES (1) ES2436778T3 (enExample)
TW (1) TWI376281B (enExample)
WO (1) WO2009012278A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080145688A1 (en) 2006-12-13 2008-06-19 H.C. Starck Inc. Method of joining tantalum clade steel structures
US8197894B2 (en) 2007-05-04 2012-06-12 H.C. Starck Gmbh Methods of forming sputtering targets
US20090255808A1 (en) * 2008-04-11 2009-10-15 Seagate Technology Llc Target for efficient use of precious deposition material
US8246903B2 (en) 2008-09-09 2012-08-21 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
JP4348396B1 (ja) * 2008-12-26 2009-10-21 田中貴金属工業株式会社 再生ターゲットの製造方法
US9399816B2 (en) 2010-11-30 2016-07-26 Dow Global Technologies Llc Refurbishing copper and indium containing alloy sputter targets and use of such targets in making copper and indium-based films
JP2013001971A (ja) * 2011-06-17 2013-01-07 Solar Applied Materials Technology Corp 再製スパッタリングターゲット及びその製造方法
US9108273B2 (en) 2011-09-29 2015-08-18 H.C. Starck Inc. Methods of manufacturing large-area sputtering targets using interlocking joints
US9802233B2 (en) 2014-05-01 2017-10-31 Praxair S. T. Technology, Inc. Gold evaporative sources with reduced contaminants and methods for making the same
US11149343B2 (en) * 2015-05-28 2021-10-19 Materion Corporation Processes for refurbishing a spent sputtering target
JP7072664B2 (ja) * 2018-09-25 2022-05-20 Ｊｘ金属株式会社 スパッタリングターゲット及びスパッタリングターゲットの製造方法
CN116676575A (zh) * 2023-07-03 2023-09-01 福建阿石创新材料股份有限公司 一种靶材的修复方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62230967A (ja) * 1986-03-31 1987-10-09 Mitsubishi Metal Corp 光磁気記録薄膜の形成に用いられた強磁性材製使用済みターゲットの再生方法
JPS6393859A (ja) * 1986-10-09 1988-04-25 Toshiba Corp スパツタリングタ−ゲツトとその製造方法
US4954170A (en) 1989-06-30 1990-09-04 Westinghouse Electric Corp. Methods of making high performance compacts and products
JP3609682B2 (ja) * 1991-01-25 2005-01-12 株式会社東芝 半導体素子の製造方法
JPH0565635A (ja) * 1991-03-11 1993-03-19 Mitsubishi Materials Corp マグネトロンスパツタ用貴金属ターゲツトの修復方法
US6582641B1 (en) 1994-08-25 2003-06-24 Praxair S.T. Technology, Inc. Apparatus and method for making metal oxide sputtering targets
US5857611A (en) * 1995-08-16 1999-01-12 Sony Corporation Sputter target/backing plate assembly and method of making same
KR20000028741A (ko) 1998-10-12 2000-05-25 안자키 사토루 열전반도체 재료 또는 소자의 제조방법 및 열전모듈의제조방법
US6042777A (en) 1999-08-03 2000-03-28 Sony Corporation Manufacturing of high density intermetallic sputter targets
JP2001342562A (ja) * 2000-06-01 2001-12-14 Hitachi Metals Ltd ターゲット材およびその製造方法
WO2003025244A2 (en) * 2001-09-17 2003-03-27 Heraeus, Inc. Refurbishing spent sputtering targets
FI112026B (fi) * 2002-02-18 2003-10-15 Raute Oyj Laitteisto levymäisen tuotteen puristamiskuumentamiseksi
US20070189916A1 (en) 2002-07-23 2007-08-16 Heraeus Incorporated Sputtering targets and methods for fabricating sputtering targets having multiple materials
JP2004225091A (ja) 2003-01-21 2004-08-12 Sumitomo Metal Mining Co Ltd スパッタリングターゲットの製造方法
JP4211558B2 (ja) * 2003-10-07 2009-01-21 住友金属鉱山株式会社 スパッタリングターゲット材料、その製造方法、及びそれを用いた透明導電膜の製造方法
US20060021870A1 (en) * 2004-07-27 2006-02-02 Applied Materials, Inc. Profile detection and refurbishment of deposition targets

Also Published As

Publication number Publication date
EP2087144A1 (en) 2009-08-12
US20090022616A1 (en) 2009-01-22
EP2087144A4 (en) 2011-04-13
ES2436778T3 (es) 2014-01-07
DK2087144T3 (da) 2013-11-04
US7871563B2 (en) 2011-01-18
EP2087144B1 (en) 2013-09-04
JP2010514921A (ja) 2010-05-06
TWI376281B (en) 2012-11-11
WO2009012278A1 (en) 2009-01-22
TW200914171A (en) 2009-04-01

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