JP5201854B2 - 有機ｅｌパネルの製造方法 - Google Patents

有機ｅｌパネルの製造方法 Download PDF

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Publication number
JP5201854B2
JP5201854B2 JP2007057244A JP2007057244A JP5201854B2 JP 5201854 B2 JP5201854 B2 JP 5201854B2 JP 2007057244 A JP2007057244 A JP 2007057244A JP 2007057244 A JP2007057244 A JP 2007057244A JP 5201854 B2 JP5201854 B2 JP 5201854B2
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Japan
Prior art keywords
organic
protective layer
panel
manufacturing
laminated
Prior art date
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Active
Application number
JP2007057244A
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English (en)
Japanese (ja)
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JP2008218323A (ja
JP2008218323A5 (enExample
Inventor
一郎 片岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2007057244A priority Critical patent/JP5201854B2/ja
Priority to US12/035,057 priority patent/US8557067B2/en
Publication of JP2008218323A publication Critical patent/JP2008218323A/ja
Publication of JP2008218323A5 publication Critical patent/JP2008218323A5/ja
Application granted granted Critical
Publication of JP5201854B2 publication Critical patent/JP5201854B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y10T156/1057—Subsequent to assembly of laminae

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
JP2007057244A 2007-03-07 2007-03-07 有機ｅｌパネルの製造方法 Active JP5201854B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007057244A JP5201854B2 (ja) 2007-03-07 2007-03-07 有機ｅｌパネルの製造方法
US12/035,057 US8557067B2 (en) 2007-03-07 2008-02-21 Method for manufacturing organic electroluminescence panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007057244A JP5201854B2 (ja) 2007-03-07 2007-03-07 有機ｅｌパネルの製造方法

Publications (3)

Publication Number Publication Date
JP2008218323A JP2008218323A (ja) 2008-09-18
JP2008218323A5 JP2008218323A5 (enExample) 2010-04-22
JP5201854B2 true JP5201854B2 (ja) 2013-06-05

Family

ID=39741908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007057244A Active JP5201854B2 (ja) 2007-03-07 2007-03-07 有機ｅｌパネルの製造方法

Country Status (2)

Country Link
US (1) US8557067B2 (enExample)
JP (1) JP5201854B2 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010067721A1 (ja) * 2008-12-10 2010-06-17 コニカミノルタホールディングス株式会社 有機エレクトロルミネッセンス素子の製造方法、有機エレクトロルミネッセンス素子
JP2011018554A (ja) * 2009-07-09 2011-01-27 Casio Computer Co Ltd 表示装置
JP5447244B2 (ja) * 2010-07-12 2014-03-19 コニカミノルタ株式会社 有機エレクトロルミネッセンスパネルの製造方法
KR20140066974A (ko) 2011-09-26 2014-06-03 파나소닉 주식회사 발광 장치의 제조 방법 및 발광 장치
KR101971202B1 (ko) * 2012-11-22 2019-04-23 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조방법
DE102013105128A1 (de) 2013-05-17 2014-11-20 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
KR102300582B1 (ko) * 2014-09-01 2021-09-09 엘지디스플레이 주식회사 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법
KR102295614B1 (ko) * 2014-09-29 2021-08-27 엘지디스플레이 주식회사 유기 발광 표시 장치
KR102307693B1 (ko) * 2014-12-12 2021-10-06 삼성디스플레이 주식회사 표시패널 및 이의 제조방법
CN105374950A (zh) * 2015-10-30 2016-03-02 上海和辉光电有限公司 一种有机发光器件的制备方法
CN105609655B (zh) * 2015-12-28 2018-06-12 天马微电子股份有限公司 有机发光显示面板的制作方法
KR102548461B1 (ko) 2016-06-10 2023-06-28 삼성디스플레이 주식회사 표시장치 및 이의 제조방법
CN107359284B (zh) * 2017-07-24 2019-11-26 武汉华星光电半导体显示技术有限公司 一种显示面板的切割方法以及显示面板
CN107919364B (zh) * 2017-11-17 2021-05-11 京东方科技集团股份有限公司 显示基板母板、显示基板及制作方法、显示装置
CN110676394B (zh) * 2018-07-03 2022-08-12 上海和辉光电股份有限公司 一种柔性oled的制作方法
CN110473983B (zh) * 2019-07-31 2021-04-27 武汉华星光电半导体显示技术有限公司 显示面板母板和显示面板母板的制备方法
CN114068655A (zh) * 2020-08-06 2022-02-18 乐金显示有限公司 母基板、显示面板及其制造方法
KR20220169172A (ko) * 2021-06-18 2022-12-27 엘지디스플레이 주식회사 초박막 글라스의 제조 방법, 초박막 글라스 및 초박막 글라스를 포함하는 표시 장치
US11729909B2 (en) * 2021-07-20 2023-08-15 Honeywell Federal Manufacturing & Technologies, Llc Multi-layered diamond-like carbon coating for electronic components
CN115275056A (zh) * 2022-07-29 2022-11-01 合肥维信诺科技有限公司 柔性显示面板及其制备方法和显示装置

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Publication number Priority date Publication date Assignee Title
GB9928014D0 (en) * 1999-11-26 2000-01-26 Cambridge Display Tech Ltd Method of producing an organic light-emissive device
JP2003051380A (ja) * 2001-08-07 2003-02-21 Toyota Central Res & Dev Lab Inc 有機電界発光素子を用いた線状光源及びその製造方法
JP2003223111A (ja) * 2002-01-30 2003-08-08 Seiko Epson Corp 表示装置の製造方法、表示装置の封止側原型基板、表示装置の集合体、表示装置および電子機器
JP2003234179A (ja) * 2002-02-07 2003-08-22 Matsushita Electric Ind Co Ltd Ｏｌｅｄディスプレイ
JP2003249354A (ja) 2002-02-26 2003-09-05 Toyota Industries Corp 有機ｅｌ表示パネルの製造方法
US7259505B2 (en) * 2002-10-15 2007-08-21 Eastman Kodak Company OLED display with circular polarizer
KR100539877B1 (ko) * 2003-09-30 2005-12-28 삼성전자주식회사 출력 파워들의 독립적인 제어가 가능한 이중 출력 구조를갖는 광대역 광원
JP4744862B2 (ja) * 2004-12-16 2011-08-10 東芝モバイルディスプレイ株式会社 表示装置の製造方法
WO2006067997A1 (ja) * 2004-12-22 2006-06-29 Konica Minolta Holdings, Inc. ホログラム素子内蔵レンズ製造方法
JP4592473B2 (ja) * 2005-03-31 2010-12-01 三洋電機株式会社 発光パネルの製造方法、表示パネルの製造方法及び表示パネル
JP2007059209A (ja) * 2005-08-24 2007-03-08 Toyota Industries Corp エレクトロルミネッセンスパネル及びその製造方法
JP2007173084A (ja) * 2005-12-22 2007-07-05 Canon Inc 発光素子

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Publication number Publication date
US20080220151A1 (en) 2008-09-11
US8557067B2 (en) 2013-10-15
JP2008218323A (ja) 2008-09-18

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