JP5193592B2 - 半熱硬化性異方導電性フィルム組成物 - Google Patents
半熱硬化性異方導電性フィルム組成物 Download PDFInfo
- Publication number
- JP5193592B2 JP5193592B2 JP2007339600A JP2007339600A JP5193592B2 JP 5193592 B2 JP5193592 B2 JP 5193592B2 JP 2007339600 A JP2007339600 A JP 2007339600A JP 2007339600 A JP2007339600 A JP 2007339600A JP 5193592 B2 JP5193592 B2 JP 5193592B2
- Authority
- JP
- Japan
- Prior art keywords
- anisotropic conductive
- conductive film
- group
- weight
- film composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20060138670 | 2006-12-29 | ||
KR10-2006-0138670 | 2006-12-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008243798A JP2008243798A (ja) | 2008-10-09 |
JP5193592B2 true JP5193592B2 (ja) | 2013-05-08 |
Family
ID=39610356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007339600A Active JP5193592B2 (ja) | 2006-12-29 | 2007-12-28 | 半熱硬化性異方導電性フィルム組成物 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5193592B2 (ko) |
KR (1) | KR100902714B1 (ko) |
CN (1) | CN101210095A (ko) |
TW (1) | TWI425072B (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009110913A (ja) * | 2007-10-30 | 2009-05-21 | Cheil Industries Inc | 半熱硬化性異方導電性フィルム組成物 |
US8702040B2 (en) | 2010-05-14 | 2014-04-22 | Japan Aerospace Exploration Agency | Panel type artificial satellite and artificial satellite system therewith |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010150362A (ja) * | 2008-12-25 | 2010-07-08 | Sumitomo Electric Ind Ltd | フィルム状接着剤及び異方導電性接着剤 |
KR101279980B1 (ko) * | 2010-12-29 | 2013-07-05 | 제일모직주식회사 | 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름 |
CN104169389B (zh) * | 2012-04-25 | 2018-07-13 | 日立化成株式会社 | 电路连接材料、电路连接结构体、粘接膜以及卷绕体 |
CN103131226B (zh) * | 2013-01-23 | 2017-08-01 | 长兴材料工业股份有限公司 | 涂料组合物及其用途 |
JP6175258B2 (ja) * | 2013-03-25 | 2017-08-02 | 株式会社タムラ製作所 | 感光性樹脂組成物 |
JP6114647B2 (ja) * | 2013-06-28 | 2017-04-12 | リンテック株式会社 | 粘着性組成物、粘着剤および粘着シート |
CN104371574B (zh) * | 2014-11-18 | 2016-05-04 | 深圳市键键通科技有限公司 | 一种耐热抗老化导电粘胶及其制备方法 |
CN107406747B (zh) * | 2015-03-02 | 2020-09-11 | 三键有限公司 | 热固化型导电性粘合剂 |
JP5892282B1 (ja) * | 2015-04-27 | 2016-03-23 | 東洋インキScホールディングス株式会社 | 導電性接着剤、導電性接着シート、および配線デバイス |
JP6632115B2 (ja) | 2015-07-17 | 2020-01-15 | 藤森工業株式会社 | 接着性樹脂層及び接着性樹脂フィルム |
CN107922804A (zh) * | 2015-09-07 | 2018-04-17 | 株式会社巴川制纸所 | 导电性粘接剂组合物、导电性粘接片和使用了其的配线器件 |
WO2017079484A1 (en) * | 2015-11-04 | 2017-05-11 | Google Inc. | Connectors for connecting electronics embedded in garments to external devices |
KR20240005192A (ko) * | 2017-03-29 | 2024-01-11 | 가부시끼가이샤 레조낙 | 접착제 조성물 및 구조체 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3344886B2 (ja) * | 1995-12-20 | 2002-11-18 | 住友ベークライト株式会社 | 異方導電フィルム |
JPH10338860A (ja) * | 1997-06-06 | 1998-12-22 | Bridgestone Corp | 異方性導電フィルム |
JP2001323233A (ja) * | 2000-05-15 | 2001-11-22 | Sumitomo Bakelite Co Ltd | 異方導電性接着剤 |
KR100601342B1 (ko) * | 2004-05-28 | 2006-07-14 | 엘에스전선 주식회사 | 광안정한 이방도전성 회로접속용 접착제 및 이를 이용한필름 |
KR100642445B1 (ko) * | 2004-12-29 | 2006-11-02 | 제일모직주식회사 | 이방 도전성 접착제용 수지 조성물 |
KR100662176B1 (ko) * | 2004-12-30 | 2006-12-27 | 제일모직주식회사 | 이방성 도전 필름용 조성물 |
-
2007
- 2007-10-30 KR KR1020070109690A patent/KR100902714B1/ko active IP Right Grant
- 2007-12-26 TW TW096150188A patent/TWI425072B/zh active
- 2007-12-28 JP JP2007339600A patent/JP5193592B2/ja active Active
- 2007-12-29 CN CNA200710301668XA patent/CN101210095A/zh active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009110913A (ja) * | 2007-10-30 | 2009-05-21 | Cheil Industries Inc | 半熱硬化性異方導電性フィルム組成物 |
US8702040B2 (en) | 2010-05-14 | 2014-04-22 | Japan Aerospace Exploration Agency | Panel type artificial satellite and artificial satellite system therewith |
Also Published As
Publication number | Publication date |
---|---|
KR100902714B1 (ko) | 2009-06-15 |
TWI425072B (zh) | 2014-02-01 |
JP2008243798A (ja) | 2008-10-09 |
TW200842180A (en) | 2008-11-01 |
KR20080063053A (ko) | 2008-07-03 |
CN101210095A (zh) | 2008-07-02 |
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