JP5193592B2 - 半熱硬化性異方導電性フィルム組成物 - Google Patents

半熱硬化性異方導電性フィルム組成物 Download PDF

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Publication number
JP5193592B2
JP5193592B2 JP2007339600A JP2007339600A JP5193592B2 JP 5193592 B2 JP5193592 B2 JP 5193592B2 JP 2007339600 A JP2007339600 A JP 2007339600A JP 2007339600 A JP2007339600 A JP 2007339600A JP 5193592 B2 JP5193592 B2 JP 5193592B2
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Prior art keywords
anisotropic conductive
conductive film
group
weight
film composition
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JP2007339600A
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Japanese (ja)
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JP2008243798A (ja
Inventor
カン ペ ヨン
ギョン ソ パク
チョン ソク リ
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Cheil Industries Inc
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Cheil Industries Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2007339600A 2006-12-29 2007-12-28 半熱硬化性異方導電性フィルム組成物 Active JP5193592B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20060138670 2006-12-29
KR10-2006-0138670 2006-12-29

Publications (2)

Publication Number Publication Date
JP2008243798A JP2008243798A (ja) 2008-10-09
JP5193592B2 true JP5193592B2 (ja) 2013-05-08

Family

ID=39610356

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JP2007339600A Active JP5193592B2 (ja) 2006-12-29 2007-12-28 半熱硬化性異方導電性フィルム組成物

Country Status (4)

Country Link
JP (1) JP5193592B2 (ko)
KR (1) KR100902714B1 (ko)
CN (1) CN101210095A (ko)
TW (1) TWI425072B (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009110913A (ja) * 2007-10-30 2009-05-21 Cheil Industries Inc 半熱硬化性異方導電性フィルム組成物
US8702040B2 (en) 2010-05-14 2014-04-22 Japan Aerospace Exploration Agency Panel type artificial satellite and artificial satellite system therewith

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010150362A (ja) * 2008-12-25 2010-07-08 Sumitomo Electric Ind Ltd フィルム状接着剤及び異方導電性接着剤
KR101279980B1 (ko) * 2010-12-29 2013-07-05 제일모직주식회사 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름
CN104169389B (zh) * 2012-04-25 2018-07-13 日立化成株式会社 电路连接材料、电路连接结构体、粘接膜以及卷绕体
CN103131226B (zh) * 2013-01-23 2017-08-01 长兴材料工业股份有限公司 涂料组合物及其用途
JP6175258B2 (ja) * 2013-03-25 2017-08-02 株式会社タムラ製作所 感光性樹脂組成物
JP6114647B2 (ja) * 2013-06-28 2017-04-12 リンテック株式会社 粘着性組成物、粘着剤および粘着シート
CN104371574B (zh) * 2014-11-18 2016-05-04 深圳市键键通科技有限公司 一种耐热抗老化导电粘胶及其制备方法
CN107406747B (zh) * 2015-03-02 2020-09-11 三键有限公司 热固化型导电性粘合剂
JP5892282B1 (ja) * 2015-04-27 2016-03-23 東洋インキＳｃホールディングス株式会社 導電性接着剤、導電性接着シート、および配線デバイス
JP6632115B2 (ja) 2015-07-17 2020-01-15 藤森工業株式会社 接着性樹脂層及び接着性樹脂フィルム
CN107922804A (zh) * 2015-09-07 2018-04-17 株式会社巴川制纸所 导电性粘接剂组合物、导电性粘接片和使用了其的配线器件
WO2017079484A1 (en) * 2015-11-04 2017-05-11 Google Inc. Connectors for connecting electronics embedded in garments to external devices
KR20240005192A (ko) * 2017-03-29 2024-01-11 가부시끼가이샤 레조낙 접착제 조성물 및 구조체

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3344886B2 (ja) * 1995-12-20 2002-11-18 住友ベークライト株式会社 異方導電フィルム
JPH10338860A (ja) * 1997-06-06 1998-12-22 Bridgestone Corp 異方性導電フィルム
JP2001323233A (ja) * 2000-05-15 2001-11-22 Sumitomo Bakelite Co Ltd 異方導電性接着剤
KR100601342B1 (ko) * 2004-05-28 2006-07-14 엘에스전선 주식회사 광안정한 이방도전성 회로접속용 접착제 및 이를 이용한필름
KR100642445B1 (ko) * 2004-12-29 2006-11-02 제일모직주식회사 이방 도전성 접착제용 수지 조성물
KR100662176B1 (ko) * 2004-12-30 2006-12-27 제일모직주식회사 이방성 도전 필름용 조성물

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009110913A (ja) * 2007-10-30 2009-05-21 Cheil Industries Inc 半熱硬化性異方導電性フィルム組成物
US8702040B2 (en) 2010-05-14 2014-04-22 Japan Aerospace Exploration Agency Panel type artificial satellite and artificial satellite system therewith

Also Published As

Publication number Publication date
KR100902714B1 (ko) 2009-06-15
TWI425072B (zh) 2014-02-01
JP2008243798A (ja) 2008-10-09
TW200842180A (en) 2008-11-01
KR20080063053A (ko) 2008-07-03
CN101210095A (zh) 2008-07-02

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