JP5187695B2 - 放射散逸の解析による部品の非破壊検査装置 - Google Patents

放射散逸の解析による部品の非破壊検査装置 Download PDF

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JP5187695B2
JP5187695B2 JP2009511474A JP2009511474A JP5187695B2 JP 5187695 B2 JP5187695 B2 JP 5187695B2 JP 2009511474 A JP2009511474 A JP 2009511474A JP 2009511474 A JP2009511474 A JP 2009511474A JP 5187695 B2 JP5187695 B2 JP 5187695B2
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inspection
inspection apparatus
radiation
computing system
microsensor
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Japanese (ja)
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JP2009537836A5 (enExample
JP2009537836A (ja
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デ．スメット．マリー−アンヌ
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エアバス オペラシオン（エス．ア．エス）
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/15—Charge-coupled device [CCD] image sensors
    • H10F39/159—Charge-coupled device [CCD] image sensors comprising a photoconductive layer deposited on the CCD structure

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  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Radiation Pyrometers (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
JP2009511474A 2006-05-24 2007-05-16 放射散逸の解析による部品の非破壊検査装置 Expired - Fee Related JP5187695B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0651902 2006-05-24
FR0651902A FR2901609B1 (fr) 2006-05-24 2006-05-24 Dispositif de controle non destructif d'une piece par analyse de dissipation de rayonnement
PCT/EP2007/054762 WO2007135059A1 (fr) 2006-05-24 2007-05-16 Dispositif de contrôle non destructif d'une pièce par analyse de dissipation de rayonnement

Publications (3)

Publication Number Publication Date
JP2009537836A JP2009537836A (ja) 2009-10-29
JP2009537836A5 JP2009537836A5 (enExample) 2010-07-01
JP5187695B2 true JP5187695B2 (ja) 2013-04-24

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JP2009511474A Expired - Fee Related JP5187695B2 (ja) 2006-05-24 2007-05-16 放射散逸の解析による部品の非破壊検査装置

Country Status (9)

Country Link
US (1) US8173964B2 (enExample)
EP (1) EP2027457A1 (enExample)
JP (1) JP5187695B2 (enExample)
CN (1) CN101449153B (enExample)
BR (1) BRPI0712211A2 (enExample)
CA (1) CA2651392A1 (enExample)
FR (1) FR2901609B1 (enExample)
RU (1) RU2439545C2 (enExample)
WO (1) WO2007135059A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8986778B2 (en) * 2006-07-06 2015-03-24 Siemens Energy, Inc. Coating method for non-destructive examination of articles of manufacture
RU2494434C1 (ru) * 2012-06-07 2013-09-27 Закрытое акционерное общество "ГИАП-ДИСТцентр" Способ управления промышленной безопасностью и диагностики эксплуатационного состояния промышленного объекта
RU2502058C1 (ru) * 2012-08-23 2013-12-20 Сергей Михайлович Мужичек Способ контроля состояния конструкции летательного аппарата и устройство для его осуществления
CN110304195A (zh) * 2019-07-01 2019-10-08 上海外高桥造船有限公司 船体应力的检测方法及系统
CN113702441A (zh) * 2021-09-23 2021-11-26 合肥维信诺科技有限公司 断裂检测装置及断裂检测方法
CN120276013B (zh) * 2025-06-12 2025-09-09 聚变新能(安徽)有限公司 测试装置

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US4232554A (en) * 1978-11-30 1980-11-11 Grumman Aerospace Corporation Thermal emission flaw detection method
US4433637A (en) * 1979-06-04 1984-02-28 Vectra International Corporation Microencapsulated cholesteric liquid crystal temperature measuring device for determining the temperature of non-planar or planar surfaces
FR2598250B1 (fr) * 1986-04-30 1988-07-08 Thomson Csf Panneau de prise de vue radiologique, et procede de fabrication
JPS63157024A (ja) * 1986-12-22 1988-06-30 Hiroshi Ogawa 検出素子
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US5166573A (en) * 1989-09-26 1992-11-24 Atochem North America, Inc. Ultrasonic contact transducer and array
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JPH05107212A (ja) * 1991-10-18 1993-04-27 Fujitsu Ltd 部品類が実装されたプリント板の外観検査法
US5315234A (en) 1992-04-03 1994-05-24 General Electric Company Eddy current device for inspecting a component having a flexible support with a plural sensor array
WO1993025877A1 (en) * 1992-06-11 1993-12-23 Honeywell, Inc. Use of vanadium oxide in microbolometer sensors
DE4220544B4 (de) * 1992-06-24 2005-10-20 Woelfel Horst Verfahren zum Messen mechanischer Spannungskomponenten an der Oberfläche von dynamisch belasteten Meßobjekten
IT1273248B (it) * 1994-03-15 1997-07-07 Europiana S R L Apparecchiatura per la misurazione della temperatura dell'epidermide
US5659248A (en) 1994-10-17 1997-08-19 General Electric Company Multilayer eddy current probe array for complete coverage of an inspection surface without mechanical scanning
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US5911158A (en) * 1996-02-29 1999-06-08 The United States Of America As Represented By The Secretary Of The Air Force Piezoelectric strain sensor array
TW346688B (en) * 1996-04-15 1998-12-01 Matsushita Electric Works Ltd Pyroelectric-type IR receiving element and IR sensor using the same
US5915277A (en) 1997-06-23 1999-06-22 General Electric Co. Probe and method for inspecting an object
JP3778659B2 (ja) * 1997-07-07 2006-05-24 浜松ホトニクス株式会社 放射線位置検出装置
US6077228A (en) * 1998-11-04 2000-06-20 Schonberger; Milton Breast temperature scanner
JP2000171418A (ja) * 1998-12-02 2000-06-23 Ishikawajima Harima Heavy Ind Co Ltd 耐熱鋼のクリープひずみ量の非破壊的推定法
CN1112584C (zh) * 1998-12-18 2003-06-25 中国科学院金属研究所 X射线应力智能分析仪
US7039326B1 (en) * 1999-09-29 2006-05-02 Ess Technology, Inc. Infrared communication system utilizing receiver with multiple photo-sensors
JP2001337059A (ja) * 2000-05-26 2001-12-07 Toshiba Corp プリント配線板の劣化検出方法および装置
JP2002232640A (ja) * 2001-02-01 2002-08-16 Fuji Photo Film Co Ltd ラインセンサおよびそれを用いた放射線画像情報読取装置
DE10136756C2 (de) * 2001-07-27 2003-07-31 Siemens Ag Röntgendiagnostikeinrichtung mit einem flexiblen Festkörper-Röntgendetektor
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JP3812559B2 (ja) 2003-09-18 2006-08-23 Ｔｄｋ株式会社 渦電流プローブ

Also Published As

Publication number Publication date
FR2901609A1 (fr) 2007-11-30
RU2439545C2 (ru) 2012-01-10
US20100011861A1 (en) 2010-01-21
EP2027457A1 (fr) 2009-02-25
BRPI0712211A2 (pt) 2012-03-13
RU2008151170A (ru) 2010-06-27
US8173964B2 (en) 2012-05-08
CA2651392A1 (fr) 2007-11-29
CN101449153B (zh) 2012-07-11
FR2901609B1 (fr) 2009-01-16
WO2007135059A1 (fr) 2007-11-29
CN101449153A (zh) 2009-06-03
JP2009537836A (ja) 2009-10-29

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