CA2651392A1 - Dispositif de controle non destructif d'une piece par analyse de dissipation de rayonnement - Google Patents

Dispositif de controle non destructif d'une piece par analyse de dissipation de rayonnement Download PDF

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Publication number
CA2651392A1
CA2651392A1 CA002651392A CA2651392A CA2651392A1 CA 2651392 A1 CA2651392 A1 CA 2651392A1 CA 002651392 A CA002651392 A CA 002651392A CA 2651392 A CA2651392 A CA 2651392A CA 2651392 A1 CA2651392 A1 CA 2651392A1
Authority
CA
Canada
Prior art keywords
control device
radiation
microsensors
control
flexible support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002651392A
Other languages
English (en)
French (fr)
Inventor
Marie-Anne De Smet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Airbus Operations SAS
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2651392A1 publication Critical patent/CA2651392A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00Investigating or analyzing materials by the use of thermal means
    • G01N25/72Investigating presence of flaws
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/15Charge-coupled device [CCD] image sensors
    • H10F39/159Charge-coupled device [CCD] image sensors comprising a photoconductive layer deposited on the CCD structure

Landscapes

  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Radiation Pyrometers (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
CA002651392A 2006-05-24 2007-05-16 Dispositif de controle non destructif d'une piece par analyse de dissipation de rayonnement Abandoned CA2651392A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0651902 2006-05-24
FR0651902A FR2901609B1 (fr) 2006-05-24 2006-05-24 Dispositif de controle non destructif d'une piece par analyse de dissipation de rayonnement
PCT/EP2007/054762 WO2007135059A1 (fr) 2006-05-24 2007-05-16 Dispositif de contrôle non destructif d'une pièce par analyse de dissipation de rayonnement

Publications (1)

Publication Number Publication Date
CA2651392A1 true CA2651392A1 (fr) 2007-11-29

Family

ID=37607011

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002651392A Abandoned CA2651392A1 (fr) 2006-05-24 2007-05-16 Dispositif de controle non destructif d'une piece par analyse de dissipation de rayonnement

Country Status (9)

Country Link
US (1) US8173964B2 (enExample)
EP (1) EP2027457A1 (enExample)
JP (1) JP5187695B2 (enExample)
CN (1) CN101449153B (enExample)
BR (1) BRPI0712211A2 (enExample)
CA (1) CA2651392A1 (enExample)
FR (1) FR2901609B1 (enExample)
RU (1) RU2439545C2 (enExample)
WO (1) WO2007135059A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8986778B2 (en) * 2006-07-06 2015-03-24 Siemens Energy, Inc. Coating method for non-destructive examination of articles of manufacture
RU2494434C1 (ru) * 2012-06-07 2013-09-27 Закрытое акционерное общество "ГИАП-ДИСТцентр" Способ управления промышленной безопасностью и диагностики эксплуатационного состояния промышленного объекта
RU2502058C1 (ru) * 2012-08-23 2013-12-20 Сергей Михайлович Мужичек Способ контроля состояния конструкции летательного аппарата и устройство для его осуществления
CN110304195A (zh) * 2019-07-01 2019-10-08 上海外高桥造船有限公司 船体应力的检测方法及系统
CN113702441A (zh) * 2021-09-23 2021-11-26 合肥维信诺科技有限公司 断裂检测装置及断裂检测方法
CN120276013B (zh) * 2025-06-12 2025-09-09 聚变新能(安徽)有限公司 测试装置

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US3970074A (en) * 1974-08-22 1976-07-20 Spitalul Clinic Filantropia Bucuresti Method of and apparatus for making medical thermographs
US4232554A (en) * 1978-11-30 1980-11-11 Grumman Aerospace Corporation Thermal emission flaw detection method
US4433637A (en) * 1979-06-04 1984-02-28 Vectra International Corporation Microencapsulated cholesteric liquid crystal temperature measuring device for determining the temperature of non-planar or planar surfaces
FR2598250B1 (fr) * 1986-04-30 1988-07-08 Thomson Csf Panneau de prise de vue radiologique, et procede de fabrication
JPS63157024A (ja) * 1986-12-22 1988-06-30 Hiroshi Ogawa 検出素子
JPS63250554A (ja) * 1987-04-08 1988-10-18 Fujita Corp 腐食診断法及び診断装置
US5166573A (en) * 1989-09-26 1992-11-24 Atochem North America, Inc. Ultrasonic contact transducer and array
US5047719A (en) 1990-05-25 1991-09-10 The Failure Group, Inc. Flexible coil assembly for reflectance-mode nondestructive eddy-current examination
JPH05107212A (ja) * 1991-10-18 1993-04-27 Fujitsu Ltd 部品類が実装されたプリント板の外観検査法
US5315234A (en) 1992-04-03 1994-05-24 General Electric Company Eddy current device for inspecting a component having a flexible support with a plural sensor array
WO1993025877A1 (en) * 1992-06-11 1993-12-23 Honeywell, Inc. Use of vanadium oxide in microbolometer sensors
DE4220544B4 (de) * 1992-06-24 2005-10-20 Woelfel Horst Verfahren zum Messen mechanischer Spannungskomponenten an der Oberfläche von dynamisch belasteten Meßobjekten
IT1273248B (it) * 1994-03-15 1997-07-07 Europiana S R L Apparecchiatura per la misurazione della temperatura dell'epidermide
US5659248A (en) 1994-10-17 1997-08-19 General Electric Company Multilayer eddy current probe array for complete coverage of an inspection surface without mechanical scanning
US5793206A (en) 1995-08-25 1998-08-11 Jentek Sensors, Inc. Meandering winding test circuit
US5911158A (en) * 1996-02-29 1999-06-08 The United States Of America As Represented By The Secretary Of The Air Force Piezoelectric strain sensor array
TW346688B (en) * 1996-04-15 1998-12-01 Matsushita Electric Works Ltd Pyroelectric-type IR receiving element and IR sensor using the same
US5915277A (en) 1997-06-23 1999-06-22 General Electric Co. Probe and method for inspecting an object
JP3778659B2 (ja) * 1997-07-07 2006-05-24 浜松ホトニクス株式会社 放射線位置検出装置
US6077228A (en) * 1998-11-04 2000-06-20 Schonberger; Milton Breast temperature scanner
JP2000171418A (ja) * 1998-12-02 2000-06-23 Ishikawajima Harima Heavy Ind Co Ltd 耐熱鋼のクリープひずみ量の非破壊的推定法
CN1112584C (zh) * 1998-12-18 2003-06-25 中国科学院金属研究所 X射线应力智能分析仪
US7039326B1 (en) * 1999-09-29 2006-05-02 Ess Technology, Inc. Infrared communication system utilizing receiver with multiple photo-sensors
JP2001337059A (ja) * 2000-05-26 2001-12-07 Toshiba Corp プリント配線板の劣化検出方法および装置
JP2002232640A (ja) * 2001-02-01 2002-08-16 Fuji Photo Film Co Ltd ラインセンサおよびそれを用いた放射線画像情報読取装置
DE10136756C2 (de) * 2001-07-27 2003-07-31 Siemens Ag Röntgendiagnostikeinrichtung mit einem flexiblen Festkörper-Röntgendetektor
FR2836994B1 (fr) * 2002-03-05 2004-12-17 Airbus France Procede et dispositif de controle de pieces par rayons x
US7078702B2 (en) * 2002-07-25 2006-07-18 General Electric Company Imager
US6812697B2 (en) 2002-09-24 2004-11-02 General Electric Company Molded eddy current array probe
JP3812559B2 (ja) 2003-09-18 2006-08-23 Tdk株式会社 渦電流プローブ

Also Published As

Publication number Publication date
FR2901609A1 (fr) 2007-11-30
RU2439545C2 (ru) 2012-01-10
US20100011861A1 (en) 2010-01-21
EP2027457A1 (fr) 2009-02-25
BRPI0712211A2 (pt) 2012-03-13
RU2008151170A (ru) 2010-06-27
US8173964B2 (en) 2012-05-08
CN101449153B (zh) 2012-07-11
FR2901609B1 (fr) 2009-01-16
WO2007135059A1 (fr) 2007-11-29
CN101449153A (zh) 2009-06-03
JP2009537836A (ja) 2009-10-29
JP5187695B2 (ja) 2013-04-24

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Legal Events

Date Code Title Description
EEER Examination request
FZDE Discontinued

Effective date: 20151124