JP5182314B2 - 空気流量測定装置 - Google Patents
空気流量測定装置 Download PDFInfo
- Publication number
- JP5182314B2 JP5182314B2 JP2010070590A JP2010070590A JP5182314B2 JP 5182314 B2 JP5182314 B2 JP 5182314B2 JP 2010070590 A JP2010070590 A JP 2010070590A JP 2010070590 A JP2010070590 A JP 2010070590A JP 5182314 B2 JP5182314 B2 JP 5182314B2
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- deep groove
- air flow
- recess
- sensor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005259 measurement Methods 0.000 title description 3
- 239000000758 substrate Substances 0.000 claims description 65
- 238000011144 upstream manufacturing Methods 0.000 claims description 58
- 238000010438 heat treatment Methods 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000000630 rising effect Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000010409 thin film Substances 0.000 description 6
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
- G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
- G01F1/692—Thin-film arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/6842—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow with means for influencing the fluid flow
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/6845—Micromachined devices
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010070590A JP5182314B2 (ja) | 2009-05-01 | 2010-03-25 | 空気流量測定装置 |
DE201010028387 DE102010028387A1 (de) | 2009-05-01 | 2010-04-29 | Luftstrommessvorrichtung |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009111907 | 2009-05-01 | ||
JP2009111907 | 2009-05-01 | ||
JP2010070590A JP5182314B2 (ja) | 2009-05-01 | 2010-03-25 | 空気流量測定装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012236557A Division JP5477446B2 (ja) | 2009-05-01 | 2012-10-26 | 空気流量測定装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010281809A JP2010281809A (ja) | 2010-12-16 |
JP5182314B2 true JP5182314B2 (ja) | 2013-04-17 |
Family
ID=42813894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010070590A Active JP5182314B2 (ja) | 2009-05-01 | 2010-03-25 | 空気流量測定装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5182314B2 (de) |
DE (1) | DE102010028387A1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5533590B2 (ja) * | 2010-11-23 | 2014-06-25 | 株式会社デンソー | 感熱式流量センサ |
JP5435059B2 (ja) | 2011-08-26 | 2014-03-05 | 株式会社デンソー | 空気流量測定装置 |
JP5710538B2 (ja) | 2012-04-06 | 2015-04-30 | 日立オートモティブシステムズ株式会社 | 流量センサ |
JP5758851B2 (ja) | 2012-06-15 | 2015-08-05 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
JP5755185B2 (ja) * | 2012-06-15 | 2015-07-29 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
JP5971199B2 (ja) | 2013-06-12 | 2016-08-17 | 株式会社デンソー | 空気流量調整装置 |
JP6129225B2 (ja) * | 2015-03-04 | 2017-05-17 | 日立オートモティブシステムズ株式会社 | 流量センサ |
US10757973B2 (en) * | 2016-07-25 | 2020-09-01 | Fontem Holdings 1 B.V. | Electronic cigarette with mass air flow sensor |
WO2018141637A1 (en) * | 2017-01-31 | 2018-08-09 | Belimo Holding Ag | Flow sensor and air flow device with such flow sensor |
JP6416357B1 (ja) * | 2017-10-05 | 2018-10-31 | 三菱電機株式会社 | 流量測定装置 |
US11965762B2 (en) | 2019-10-21 | 2024-04-23 | Flusso Limited | Flow sensor |
US11262224B2 (en) | 2020-06-19 | 2022-03-01 | Honeywell International Inc. | Flow sensing device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10035538A1 (de) * | 2000-07-21 | 2002-02-07 | Bosch Gmbh Robert | Sensor |
JP2002139360A (ja) * | 2000-10-31 | 2002-05-17 | Mitsubishi Electric Corp | 感熱式流量センサ |
JP4705766B2 (ja) * | 2004-07-30 | 2011-06-22 | 株式会社山武 | 流量センサ |
JP4609019B2 (ja) * | 2004-09-24 | 2011-01-12 | 株式会社デンソー | 熱式流量センサ及びその製造方法 |
JP4488031B2 (ja) | 2007-06-14 | 2010-06-23 | 株式会社デンソー | 空気流量測定装置 |
-
2010
- 2010-03-25 JP JP2010070590A patent/JP5182314B2/ja active Active
- 2010-04-29 DE DE201010028387 patent/DE102010028387A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JP2010281809A (ja) | 2010-12-16 |
DE102010028387A1 (de) | 2010-11-04 |
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