JP5181220B2 - 回路接続用接着フィルム、接続構造体及びその製造方法 - Google Patents

回路接続用接着フィルム、接続構造体及びその製造方法 Download PDF

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Publication number
JP5181220B2
JP5181220B2 JP2008002577A JP2008002577A JP5181220B2 JP 5181220 B2 JP5181220 B2 JP 5181220B2 JP 2008002577 A JP2008002577 A JP 2008002577A JP 2008002577 A JP2008002577 A JP 2008002577A JP 5181220 B2 JP5181220 B2 JP 5181220B2
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JP
Japan
Prior art keywords
adhesive layer
circuit
connection
circuit member
connection terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008002577A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008288551A (ja
JP2008288551A5 (enExample
Inventor
征宏 有福
日臣 望月
宏治 小林
和良 小島
孝 中澤
幸寿 廣澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2008002577A priority Critical patent/JP5181220B2/ja
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to KR1020097023996A priority patent/KR101139073B1/ko
Priority to CN201210096198.9A priority patent/CN102638944B/zh
Priority to CN2008800049491A priority patent/CN101611659B/zh
Priority to PCT/JP2008/057534 priority patent/WO2008133186A1/ja
Priority to TW097114352A priority patent/TWI399420B/zh
Publication of JP2008288551A publication Critical patent/JP2008288551A/ja
Publication of JP2008288551A5 publication Critical patent/JP2008288551A5/ja
Application granted granted Critical
Publication of JP5181220B2 publication Critical patent/JP5181220B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
JP2008002577A 2007-04-19 2008-01-09 回路接続用接着フィルム、接続構造体及びその製造方法 Active JP5181220B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008002577A JP5181220B2 (ja) 2007-04-19 2008-01-09 回路接続用接着フィルム、接続構造体及びその製造方法
CN201210096198.9A CN102638944B (zh) 2007-04-19 2008-04-17 电路连接用粘接薄膜、连接结构体以及其制造方法
CN2008800049491A CN101611659B (zh) 2007-04-19 2008-04-17 电路连接用粘接薄膜、连接结构体以及其制造方法
PCT/JP2008/057534 WO2008133186A1 (ja) 2007-04-19 2008-04-17 回路接続用接着フィルム、接続構造体及びその製造方法
KR1020097023996A KR101139073B1 (ko) 2007-04-19 2008-04-17 회로 접속용 접착 필름, 접속 구조체 및 그의 제조 방법
TW097114352A TWI399420B (zh) 2007-04-19 2008-04-18 Circuit connecting adhesive film, connection structure and a manufacturing method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007110385 2007-04-19
JP2007110385 2007-04-19
JP2008002577A JP5181220B2 (ja) 2007-04-19 2008-01-09 回路接続用接着フィルム、接続構造体及びその製造方法

Publications (3)

Publication Number Publication Date
JP2008288551A JP2008288551A (ja) 2008-11-27
JP2008288551A5 JP2008288551A5 (enExample) 2010-10-14
JP5181220B2 true JP5181220B2 (ja) 2013-04-10

Family

ID=40147951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008002577A Active JP5181220B2 (ja) 2007-04-19 2008-01-09 回路接続用接着フィルム、接続構造体及びその製造方法

Country Status (4)

Country Link
JP (1) JP5181220B2 (enExample)
KR (1) KR101139073B1 (enExample)
CN (2) CN101611659B (enExample)
TW (1) TWI399420B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5521848B2 (ja) * 2010-07-21 2014-06-18 デクセリアルズ株式会社 異方性導電フィルム、接続構造体及びそれらの製造方法
JP5823117B2 (ja) * 2010-11-16 2015-11-25 デクセリアルズ株式会社 異方性導電フィルム、接合体、及び接合体の製造方法
JP5972009B2 (ja) * 2012-03-30 2016-08-17 デクセリアルズ株式会社 回路接続材料、及びこれを用いた実装体の製造方法
CN105225729B (zh) * 2015-08-26 2017-02-22 京东方科技集团股份有限公司 各向异性导电膜、及覆晶薄膜与柔性电路板的邦定方法
JP2017098077A (ja) * 2015-11-24 2017-06-01 デクセリアルズ株式会社 異方性導電フィルム、及び接続方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100643640B1 (ko) * 1997-02-27 2007-06-07 세이코 엡슨 가부시키가이샤 접속구조체,액정장치,전자기기와이방도전성접착제및그제조방법
JP4214416B2 (ja) * 1997-02-27 2009-01-28 セイコーエプソン株式会社 接着方法及び液晶装置の製造方法
JP4011157B2 (ja) * 1997-08-08 2007-11-21 日立化成フィルテック株式会社 包装用ラップフィルムの収納ケース
KR100463558B1 (ko) * 2000-04-25 2004-12-29 히다치 가세고교 가부시끼가이샤 회로접속용 접착제 및 그것을 사용한 회로접속방법 및 회로접속구조체
JP4747396B2 (ja) * 2000-05-17 2011-08-17 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP2003049152A (ja) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた接続方法、接続構造体
JP4325379B2 (ja) * 2003-12-02 2009-09-02 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

Also Published As

Publication number Publication date
CN101611659B (zh) 2012-05-23
TWI399420B (zh) 2013-06-21
JP2008288551A (ja) 2008-11-27
CN102638944B (zh) 2014-12-10
CN101611659A (zh) 2009-12-23
CN102638944A (zh) 2012-08-15
TW200911950A (en) 2009-03-16
KR20100002284A (ko) 2010-01-06
KR101139073B1 (ko) 2012-04-30

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