CN101611659B - 电路连接用粘接薄膜、连接结构体以及其制造方法 - Google Patents

电路连接用粘接薄膜、连接结构体以及其制造方法 Download PDF

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Publication number
CN101611659B
CN101611659B CN2008800049491A CN200880004949A CN101611659B CN 101611659 B CN101611659 B CN 101611659B CN 2008800049491 A CN2008800049491 A CN 2008800049491A CN 200880004949 A CN200880004949 A CN 200880004949A CN 101611659 B CN101611659 B CN 101611659B
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CN
China
Prior art keywords
circuit
splicing ear
bond layer
adhesive film
circuit block
Prior art date
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Active
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CN2008800049491A
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English (en)
Chinese (zh)
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CN101611659A (zh
Inventor
有福征宏
望月日臣
小林宏治
小岛和良
中泽孝
广泽幸寿
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Resonac Corp
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Hitachi Chemical Co Ltd
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Priority claimed from PCT/JP2008/057534 external-priority patent/WO2008133186A1/ja
Publication of CN101611659A publication Critical patent/CN101611659A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
CN2008800049491A 2007-04-19 2008-04-17 电路连接用粘接薄膜、连接结构体以及其制造方法 Active CN101611659B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2007110385 2007-04-19
JP110385/2007 2007-04-19
JP2008002577A JP5181220B2 (ja) 2007-04-19 2008-01-09 回路接続用接着フィルム、接続構造体及びその製造方法
JP002577/2008 2008-01-09
PCT/JP2008/057534 WO2008133186A1 (ja) 2007-04-19 2008-04-17 回路接続用接着フィルム、接続構造体及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201210096198.9A Division CN102638944B (zh) 2007-04-19 2008-04-17 电路连接用粘接薄膜、连接结构体以及其制造方法

Publications (2)

Publication Number Publication Date
CN101611659A CN101611659A (zh) 2009-12-23
CN101611659B true CN101611659B (zh) 2012-05-23

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CN2008800049491A Active CN101611659B (zh) 2007-04-19 2008-04-17 电路连接用粘接薄膜、连接结构体以及其制造方法
CN201210096198.9A Active CN102638944B (zh) 2007-04-19 2008-04-17 电路连接用粘接薄膜、连接结构体以及其制造方法

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Country Status (4)

Country Link
JP (1) JP5181220B2 (enExample)
KR (1) KR101139073B1 (enExample)
CN (2) CN101611659B (enExample)
TW (1) TWI399420B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5521848B2 (ja) * 2010-07-21 2014-06-18 デクセリアルズ株式会社 異方性導電フィルム、接続構造体及びそれらの製造方法
JP5823117B2 (ja) * 2010-11-16 2015-11-25 デクセリアルズ株式会社 異方性導電フィルム、接合体、及び接合体の製造方法
JP5972009B2 (ja) * 2012-03-30 2016-08-17 デクセリアルズ株式会社 回路接続材料、及びこれを用いた実装体の製造方法
CN105225729B (zh) * 2015-08-26 2017-02-22 京东方科技集团股份有限公司 各向异性导电膜、及覆晶薄膜与柔性电路板的邦定方法
JP2017098077A (ja) * 2015-11-24 2017-06-01 デクセリアルズ株式会社 異方性導電フィルム、及び接続方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003049152A (ja) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた接続方法、接続構造体
JP2007027712A (ja) * 1997-02-27 2007-02-01 Seiko Epson Corp 接着方法及び液晶装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100643640B1 (ko) * 1997-02-27 2007-06-07 세이코 엡슨 가부시키가이샤 접속구조체,액정장치,전자기기와이방도전성접착제및그제조방법
JP4011157B2 (ja) * 1997-08-08 2007-11-21 日立化成フィルテック株式会社 包装用ラップフィルムの収納ケース
KR100463558B1 (ko) * 2000-04-25 2004-12-29 히다치 가세고교 가부시끼가이샤 회로접속용 접착제 및 그것을 사용한 회로접속방법 및 회로접속구조체
JP4747396B2 (ja) * 2000-05-17 2011-08-17 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP4325379B2 (ja) * 2003-12-02 2009-09-02 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007027712A (ja) * 1997-02-27 2007-02-01 Seiko Epson Corp 接着方法及び液晶装置の製造方法
JP2003049152A (ja) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた接続方法、接続構造体

Also Published As

Publication number Publication date
TWI399420B (zh) 2013-06-21
JP5181220B2 (ja) 2013-04-10
JP2008288551A (ja) 2008-11-27
CN102638944B (zh) 2014-12-10
CN101611659A (zh) 2009-12-23
CN102638944A (zh) 2012-08-15
TW200911950A (en) 2009-03-16
KR20100002284A (ko) 2010-01-06
KR101139073B1 (ko) 2012-04-30

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Address after: Tokyo, Japan

Patentee after: HITACHI CHEMICAL Co.,Ltd.

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Patentee after: Lishennoco Co.,Ltd.

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