JP5179353B2 - ラインビームとして成形されたレーザと基板上に堆積された膜との間の相互作用を実現するためのシステム - Google Patents

ラインビームとして成形されたレーザと基板上に堆積された膜との間の相互作用を実現するためのシステム Download PDF

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Publication number
JP5179353B2
JP5179353B2 JP2008513702A JP2008513702A JP5179353B2 JP 5179353 B2 JP5179353 B2 JP 5179353B2 JP 2008513702 A JP2008513702 A JP 2008513702A JP 2008513702 A JP2008513702 A JP 2008513702A JP 5179353 B2 JP5179353 B2 JP 5179353B2
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Japan
Prior art keywords
axis
film
laser
pulse
membrane
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Expired - Fee Related
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JP2008513702A
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English (en)
Japanese (ja)
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JP2008546188A (ja
JP2008546188A5 (enExample
Inventor
パラッシュ ピー ダス
トーマス ホフマン
ジョセ ディー デイヴィス
スコット ティー スミス
ウィリアム エヌ パートロ
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サイマー インコーポレイテッド
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Priority claimed from US11/138,001 external-priority patent/US20050259709A1/en
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Priority claimed from PCT/US2006/020223 external-priority patent/WO2006127891A2/en
Publication of JP2008546188A publication Critical patent/JP2008546188A/ja
Publication of JP2008546188A5 publication Critical patent/JP2008546188A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Thin Film Transistor (AREA)
  • Laser Beam Processing (AREA)
JP2008513702A 2005-05-26 2006-05-25 ラインビームとして成形されたレーザと基板上に堆積された膜との間の相互作用を実現するためのシステム Expired - Fee Related JP5179353B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/138,001 2005-05-26
US11/138,001 US20050259709A1 (en) 2002-05-07 2005-05-26 Systems and methods for implementing an interaction between a laser shaped as a line beam and a film deposited on a substrate
PCT/US2006/020223 WO2006127891A2 (en) 2005-05-26 2006-05-25 Systems and methods interacting between a laser and film deposited

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2012209642A Division JP5613211B2 (ja) 2005-05-26 2012-09-24 ラインビームとして成形されたレーザと基板上に堆積された膜との間の相互作用を実現するためのシステム及び方法
JP2012209641A Division JP5590086B2 (ja) 2005-05-26 2012-09-24 ラインビームとして成形されたレーザと基板上に堆積された膜との間の相互作用を実現するためのシステム及び方法

Publications (3)

Publication Number Publication Date
JP2008546188A JP2008546188A (ja) 2008-12-18
JP2008546188A5 JP2008546188A5 (enExample) 2009-07-16
JP5179353B2 true JP5179353B2 (ja) 2013-04-10

Family

ID=39396193

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2008513702A Expired - Fee Related JP5179353B2 (ja) 2005-05-26 2006-05-25 ラインビームとして成形されたレーザと基板上に堆積された膜との間の相互作用を実現するためのシステム
JP2012209642A Expired - Fee Related JP5613211B2 (ja) 2005-05-26 2012-09-24 ラインビームとして成形されたレーザと基板上に堆積された膜との間の相互作用を実現するためのシステム及び方法
JP2012209641A Expired - Fee Related JP5590086B2 (ja) 2005-05-26 2012-09-24 ラインビームとして成形されたレーザと基板上に堆積された膜との間の相互作用を実現するためのシステム及び方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2012209642A Expired - Fee Related JP5613211B2 (ja) 2005-05-26 2012-09-24 ラインビームとして成形されたレーザと基板上に堆積された膜との間の相互作用を実現するためのシステム及び方法
JP2012209641A Expired - Fee Related JP5590086B2 (ja) 2005-05-26 2012-09-24 ラインビームとして成形されたレーザと基板上に堆積された膜との間の相互作用を実現するためのシステム及び方法

Country Status (3)

Country Link
JP (3) JP5179353B2 (enExample)
KR (1) KR101352452B1 (enExample)
TW (1) TWI295380B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101894785B1 (ko) * 2011-02-11 2018-09-05 삼성디스플레이 주식회사 유기 발광 표시 장치
CN109564857B (zh) * 2016-09-06 2023-05-16 极光先进雷射株式会社 激光装置和激光退火装置
US10012544B2 (en) * 2016-11-29 2018-07-03 Cymer, Llc Homogenization of light beam for spectral feature metrology
US11189982B2 (en) * 2018-08-13 2021-11-30 The Boeing Company Pulse stretching technique for laser bond inspection, laser ultrasonic inspection, and laser peening
WO2020179056A1 (ja) * 2019-03-07 2020-09-10 ギガフォトン株式会社 半導体結晶薄膜の製造方法、及びレーザアニールシステム
WO2022046402A1 (en) * 2020-08-31 2022-03-03 Cymer, Llc Apparatus for and method of optical component alignment

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JPS6487093A (en) * 1987-09-30 1989-03-31 Komatsu Mfg Co Ltd Automatic focal distance adjusting device in laser beam machine
JPH01205891A (ja) * 1988-02-12 1989-08-18 Toshiba Corp レーザ加工装置の制御方法
JPH04237587A (ja) * 1991-01-18 1992-08-26 Hitachi Constr Mach Co Ltd レーザ加工装置
DE4200632C2 (de) * 1992-01-13 1995-09-21 Maho Ag Verfahren und Vorrichtung zum Bearbeiten von Werkstücken mittels der von einem Laser emittierten Laserstrahlung
US6225012B1 (en) 1994-02-22 2001-05-01 Nikon Corporation Method for positioning substrate
JPH1012549A (ja) * 1996-06-25 1998-01-16 Toshiba Corp パルスガスレーザ発振装置、レーザアニール装置、半導体装置の製造方法、及び半導体装置
JP4659930B2 (ja) * 1998-01-27 2011-03-30 株式会社東芝 多結晶半導体膜の製造方法及びレーザアニール装置
JPH11283933A (ja) * 1998-01-29 1999-10-15 Toshiba Corp レ―ザ照射装置，非単結晶半導体膜の製造方法及び液晶表示装置の製造方法
JP2926581B1 (ja) * 1998-07-01 1999-07-28 山口日本電気株式会社 縮小投影露光装置
JP3548428B2 (ja) 1998-07-03 2004-07-28 キヤノン株式会社 位置計測装置及びそれを用いたデバイスの製造方法
AU749690B2 (en) * 1998-08-21 2002-07-04 Surromed, Inc. Novel optical architectures for microvolume laser-scanning cytometers
US6573531B1 (en) * 1999-09-03 2003-06-03 The Trustees Of Columbia University In The City Of New York Systems and methods using sequential lateral solidification for producing single or polycrystalline silicon thin films at low temperatures
JP2002158186A (ja) * 2000-11-21 2002-05-31 Toshiba Corp レーザアニール方法およびその装置
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JP4408011B2 (ja) * 2001-06-15 2010-02-03 株式会社半導体エネルギー研究所 レーザ照射装置およびレーザ照射方法、並びに半導体装置の作製方法
JP2003053578A (ja) * 2001-08-15 2003-02-26 Sumitomo Heavy Ind Ltd レーザビームのプロファイル調整方法及び装置
JP2003203874A (ja) * 2002-01-10 2003-07-18 Sharp Corp レーザ照射装置
JP2004103628A (ja) * 2002-09-05 2004-04-02 Hitachi Ltd レーザアニール装置及びｔｆｔ基板のレーザアニール方法

Also Published As

Publication number Publication date
JP2013021354A (ja) 2013-01-31
JP5590086B2 (ja) 2014-09-17
JP2008546188A (ja) 2008-12-18
TWI295380B (en) 2008-04-01
TW200702720A (en) 2007-01-16
JP2013021353A (ja) 2013-01-31
KR101352452B1 (ko) 2014-01-17
JP5613211B2 (ja) 2014-10-22
KR20080022102A (ko) 2008-03-10

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