KR101352452B1 - 라인 빔과 같이 성형된 레이저와 기판 상에 증착된 필름사이에 인터액션을 구현하기 위한 시스템 및 방법 - Google Patents

라인 빔과 같이 성형된 레이저와 기판 상에 증착된 필름사이에 인터액션을 구현하기 위한 시스템 및 방법 Download PDF

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Publication number
KR101352452B1
KR101352452B1 KR1020077029057A KR20077029057A KR101352452B1 KR 101352452 B1 KR101352452 B1 KR 101352452B1 KR 1020077029057 A KR1020077029057 A KR 1020077029057A KR 20077029057 A KR20077029057 A KR 20077029057A KR 101352452 B1 KR101352452 B1 KR 101352452B1
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KR
South Korea
Prior art keywords
film
laser
delete delete
pulse
axis
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Expired - Fee Related
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KR1020077029057A
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English (en)
Korean (ko)
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KR20080022102A (ko
Inventor
팔라시 피. 다스
토마스 호프만
제시 디. 데이비스
스캇 티. 스미스
윌리엄 엔. 파슬로
Original Assignee
사이머 엘엘씨
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Publication date
Priority claimed from US11/138,001 external-priority patent/US20050259709A1/en
Application filed by 사이머 엘엘씨 filed Critical 사이머 엘엘씨
Priority claimed from PCT/US2006/020223 external-priority patent/WO2006127891A2/en
Publication of KR20080022102A publication Critical patent/KR20080022102A/ko
Application granted granted Critical
Publication of KR101352452B1 publication Critical patent/KR101352452B1/ko
Expired - Fee Related legal-status Critical Current
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Thin Film Transistor (AREA)
  • Laser Beam Processing (AREA)
KR1020077029057A 2005-05-26 2006-05-25 라인 빔과 같이 성형된 레이저와 기판 상에 증착된 필름사이에 인터액션을 구현하기 위한 시스템 및 방법 Expired - Fee Related KR101352452B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/138,001 2005-05-26
US11/138,001 US20050259709A1 (en) 2002-05-07 2005-05-26 Systems and methods for implementing an interaction between a laser shaped as a line beam and a film deposited on a substrate
PCT/US2006/020223 WO2006127891A2 (en) 2005-05-26 2006-05-25 Systems and methods interacting between a laser and film deposited

Publications (2)

Publication Number Publication Date
KR20080022102A KR20080022102A (ko) 2008-03-10
KR101352452B1 true KR101352452B1 (ko) 2014-01-17

Family

ID=39396193

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077029057A Expired - Fee Related KR101352452B1 (ko) 2005-05-26 2006-05-25 라인 빔과 같이 성형된 레이저와 기판 상에 증착된 필름사이에 인터액션을 구현하기 위한 시스템 및 방법

Country Status (3)

Country Link
JP (3) JP5179353B2 (enExample)
KR (1) KR101352452B1 (enExample)
TW (1) TWI295380B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101894785B1 (ko) * 2011-02-11 2018-09-05 삼성디스플레이 주식회사 유기 발광 표시 장치
CN109564857B (zh) * 2016-09-06 2023-05-16 极光先进雷射株式会社 激光装置和激光退火装置
US10012544B2 (en) * 2016-11-29 2018-07-03 Cymer, Llc Homogenization of light beam for spectral feature metrology
US11189982B2 (en) * 2018-08-13 2021-11-30 The Boeing Company Pulse stretching technique for laser bond inspection, laser ultrasonic inspection, and laser peening
WO2020179056A1 (ja) * 2019-03-07 2020-09-10 ギガフォトン株式会社 半導体結晶薄膜の製造方法、及びレーザアニールシステム
WO2022046402A1 (en) * 2020-08-31 2022-03-03 Cymer, Llc Apparatus for and method of optical component alignment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010090718A (ko) * 1998-08-21 2001-10-19 써로메드, 인크. 마이크로볼륨 레이저-스캐닝 사이토미터용 신규한 광학구조물
US6400445B2 (en) 1994-02-22 2002-06-04 Nikon Corporation Method and apparatus for positioning substrate
US20020104231A1 (en) 2001-02-05 2002-08-08 Tamotsu Tominaga Position measuring apparatus
US20030142313A1 (en) 1998-07-03 2003-07-31 Shoshi Katayama Position detection apparatus and exposure apparatus

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JPS6487093A (en) * 1987-09-30 1989-03-31 Komatsu Mfg Co Ltd Automatic focal distance adjusting device in laser beam machine
JPH01205891A (ja) * 1988-02-12 1989-08-18 Toshiba Corp レーザ加工装置の制御方法
JPH04237587A (ja) * 1991-01-18 1992-08-26 Hitachi Constr Mach Co Ltd レーザ加工装置
DE4200632C2 (de) * 1992-01-13 1995-09-21 Maho Ag Verfahren und Vorrichtung zum Bearbeiten von Werkstücken mittels der von einem Laser emittierten Laserstrahlung
JPH1012549A (ja) * 1996-06-25 1998-01-16 Toshiba Corp パルスガスレーザ発振装置、レーザアニール装置、半導体装置の製造方法、及び半導体装置
JP4659930B2 (ja) * 1998-01-27 2011-03-30 株式会社東芝 多結晶半導体膜の製造方法及びレーザアニール装置
JPH11283933A (ja) * 1998-01-29 1999-10-15 Toshiba Corp レ―ザ照射装置，非単結晶半導体膜の製造方法及び液晶表示装置の製造方法
JP2926581B1 (ja) * 1998-07-01 1999-07-28 山口日本電気株式会社 縮小投影露光装置
US6573531B1 (en) * 1999-09-03 2003-06-03 The Trustees Of Columbia University In The City Of New York Systems and methods using sequential lateral solidification for producing single or polycrystalline silicon thin films at low temperatures
JP2002158186A (ja) * 2000-11-21 2002-05-31 Toshiba Corp レーザアニール方法およびその装置
US6673531B2 (en) * 2001-03-01 2004-01-06 Fuji Photo Film Co., Ltd. Silver halide photographic light-sensitive material
JP4408011B2 (ja) * 2001-06-15 2010-02-03 株式会社半導体エネルギー研究所 レーザ照射装置およびレーザ照射方法、並びに半導体装置の作製方法
JP2003053578A (ja) * 2001-08-15 2003-02-26 Sumitomo Heavy Ind Ltd レーザビームのプロファイル調整方法及び装置
JP2003203874A (ja) * 2002-01-10 2003-07-18 Sharp Corp レーザ照射装置
JP2004103628A (ja) * 2002-09-05 2004-04-02 Hitachi Ltd レーザアニール装置及びｔｆｔ基板のレーザアニール方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6400445B2 (en) 1994-02-22 2002-06-04 Nikon Corporation Method and apparatus for positioning substrate
US20030142313A1 (en) 1998-07-03 2003-07-31 Shoshi Katayama Position detection apparatus and exposure apparatus
KR20010090718A (ko) * 1998-08-21 2001-10-19 써로메드, 인크. 마이크로볼륨 레이저-스캐닝 사이토미터용 신규한 광학구조물
US20020104231A1 (en) 2001-02-05 2002-08-08 Tamotsu Tominaga Position measuring apparatus

Also Published As

Publication number Publication date
JP2013021354A (ja) 2013-01-31
JP5590086B2 (ja) 2014-09-17
JP2008546188A (ja) 2008-12-18
TWI295380B (en) 2008-04-01
JP5179353B2 (ja) 2013-04-10
TW200702720A (en) 2007-01-16
JP2013021353A (ja) 2013-01-31
JP5613211B2 (ja) 2014-10-22
KR20080022102A (ko) 2008-03-10

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