JP5176290B2 - ペースト組成物、誘電体組成物、誘電体シート、およびこれらを用いたキャパシタ内蔵回路基板 - Google Patents
ペースト組成物、誘電体組成物、誘電体シート、およびこれらを用いたキャパシタ内蔵回路基板 Download PDFInfo
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- JP5176290B2 JP5176290B2 JP2006163116A JP2006163116A JP5176290B2 JP 5176290 B2 JP5176290 B2 JP 5176290B2 JP 2006163116 A JP2006163116 A JP 2006163116A JP 2006163116 A JP2006163116 A JP 2006163116A JP 5176290 B2 JP5176290 B2 JP 5176290B2
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- paste composition
- epoxy resin
- dielectric constant
- dielectric
- composition
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
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- CJXLIMFTIKVMQN-UHFFFAOYSA-N dimagnesium;oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[Mg+2].[Mg+2].[Ta+5].[Ta+5] CJXLIMFTIKVMQN-UHFFFAOYSA-N 0.000 description 1
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- DJZHPOJZOWHJPP-UHFFFAOYSA-N magnesium;dioxido(dioxo)tungsten Chemical compound [Mg+2].[O-][W]([O-])(=O)=O DJZHPOJZOWHJPP-UHFFFAOYSA-N 0.000 description 1
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- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
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- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- PBYZMCDFOULPGH-UHFFFAOYSA-N tungstate Chemical compound [O-][W]([O-])(=O)=O PBYZMCDFOULPGH-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- CMPGARWFYBADJI-UHFFFAOYSA-L tungstic acid Chemical compound O[W](O)(=O)=O CMPGARWFYBADJI-UHFFFAOYSA-L 0.000 description 1
- 238000001132 ultrasonic dispersion Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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| JP2006163116A JP5176290B2 (ja) | 2005-06-15 | 2006-06-13 | ペースト組成物、誘電体組成物、誘電体シート、およびこれらを用いたキャパシタ内蔵回路基板 |
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| JP5076696B2 (ja) * | 2006-10-03 | 2012-11-21 | 日立化成工業株式会社 | 液状組成物、抵抗体、抵抗体素子及び配線板 |
| JP4398500B2 (ja) * | 2007-04-06 | 2010-01-13 | 株式会社日本触媒 | 樹脂組成物及び光学部材 |
| JP2009029904A (ja) * | 2007-07-26 | 2009-02-12 | Kyocera Chemical Corp | 半導体封止用樹脂組成物及び樹脂封止型半導体装置 |
| US8247338B2 (en) * | 2008-01-18 | 2012-08-21 | Toray Industries, Inc | High dielectric constant paste composition and dielectric composition using the same |
| JP5500095B2 (ja) * | 2011-01-31 | 2014-05-21 | Ｔｄｋ株式会社 | 電子回路モジュール部品及び電子回路モジュール部品の製造方法 |
| DE102012205650A1 (de) | 2012-04-05 | 2013-10-10 | Siemens Aktiengesellschaft | Isolierstoff für rotierende Maschinen |
| JP5941958B2 (ja) | 2014-09-30 | 2016-06-29 | 住友理工株式会社 | トランスデューサ用誘電材料、およびその製造方法、並びにそれを用いたトランスデューサ |
| WO2017154167A1 (ja) * | 2016-03-10 | 2017-09-14 | 三井金属鉱業株式会社 | 多層積層板及びこれを用いた多層プリント配線板の製造方法 |
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