JP5168074B2 - 半導体モジュール製造装置、製造装置システム、製造方向、および製造処理プログラム - Google Patents
半導体モジュール製造装置、製造装置システム、製造方向、および製造処理プログラム Download PDFInfo
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- JP5168074B2 JP5168074B2 JP2008263652A JP2008263652A JP5168074B2 JP 5168074 B2 JP5168074 B2 JP 5168074B2 JP 2008263652 A JP2008263652 A JP 2008263652A JP 2008263652 A JP2008263652 A JP 2008263652A JP 5168074 B2 JP5168074 B2 JP 5168074B2
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008263652A JP5168074B2 (ja) | 2008-10-10 | 2008-10-10 | 半導体モジュール製造装置、製造装置システム、製造方向、および製造処理プログラム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| JP2008263652A JP5168074B2 (ja) | 2008-10-10 | 2008-10-10 | 半導体モジュール製造装置、製造装置システム、製造方向、および製造処理プログラム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010093168A JP2010093168A (ja) | 2010-04-22 |
| JP2010093168A5 JP2010093168A5 (enExample) | 2011-07-07 |
| JP5168074B2 true JP5168074B2 (ja) | 2013-03-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| JP2008263652A Expired - Fee Related JP5168074B2 (ja) | 2008-10-10 | 2008-10-10 | 半導体モジュール製造装置、製造装置システム、製造方向、および製造処理プログラム |
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| JP (1) | JP5168074B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6348145B2 (ja) | 2016-06-24 | 2018-06-27 | ファナック株式会社 | 半導体レーザ素子のハンダ付けシステム |
| JPWO2020226065A1 (ja) * | 2019-05-07 | 2021-10-14 | 三菱電機株式会社 | 光学モジュール製造装置及び光学モジュール製造方法 |
| JP7189385B2 (ja) * | 2019-12-25 | 2022-12-13 | 株式会社Fuji | 部品実装機の制御装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2853641B2 (ja) * | 1996-02-27 | 1999-02-03 | 日本電気株式会社 | 受光デバイス |
| JP3813701B2 (ja) * | 1997-06-30 | 2006-08-23 | ヤマハ発動機株式会社 | 電子部品装着装置およびその方法 |
| JPH11145487A (ja) * | 1997-11-12 | 1999-05-28 | Nippon Telegr & Teleph Corp <Ntt> | 光モジュールの製造方法及び製造装置 |
| JP2001196792A (ja) * | 2000-01-13 | 2001-07-19 | Denso Corp | フレキシブル基板への電子部品の実装方法 |
| JP3890306B2 (ja) * | 2003-02-13 | 2007-03-07 | 埼玉日本電気株式会社 | モジュール部品およびその実装方法 |
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- 2008-10-10 JP JP2008263652A patent/JP5168074B2/ja not_active Expired - Fee Related
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| Publication number | Publication date |
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| JP2010093168A (ja) | 2010-04-22 |
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