JP5159259B2 - 圧着装置及びフラットパネルディスプレイの製造装置 - Google Patents

圧着装置及びフラットパネルディスプレイの製造装置 Download PDF

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Publication number
JP5159259B2
JP5159259B2 JP2007290853A JP2007290853A JP5159259B2 JP 5159259 B2 JP5159259 B2 JP 5159259B2 JP 2007290853 A JP2007290853 A JP 2007290853A JP 2007290853 A JP2007290853 A JP 2007290853A JP 5159259 B2 JP5159259 B2 JP 5159259B2
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Japan
Prior art keywords
crimping
substrate
electronic circuit
long
panel substrate
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Expired - Fee Related
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JP2007290853A
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Japanese (ja)
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JP2009117704A (ja
JP2009117704A5 (enExample
Inventor
淳 斧城
国夫 油田
秀明 片保
正太郎 樋渡
泰明 石澤
真二 杉崎
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Hitachi High-Tech Corp
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Hitachi High Technologies Corp
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Priority to JP2007290853A priority Critical patent/JP5159259B2/ja
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Publication of JP2009117704A5 publication Critical patent/JP2009117704A5/ja
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Publication of JP5159259B2 publication Critical patent/JP5159259B2/ja
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JP2007290853A 2007-11-08 2007-11-08 圧着装置及びフラットパネルディスプレイの製造装置 Expired - Fee Related JP5159259B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007290853A JP5159259B2 (ja) 2007-11-08 2007-11-08 圧着装置及びフラットパネルディスプレイの製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007290853A JP5159259B2 (ja) 2007-11-08 2007-11-08 圧着装置及びフラットパネルディスプレイの製造装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011007482A Division JP2011097095A (ja) 2011-01-18 2011-01-18 圧着装置及びフラットパネルディスプレイの製造装置

Publications (3)

Publication Number Publication Date
JP2009117704A JP2009117704A (ja) 2009-05-28
JP2009117704A5 JP2009117704A5 (enExample) 2010-12-24
JP5159259B2 true JP5159259B2 (ja) 2013-03-06

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007290853A Expired - Fee Related JP5159259B2 (ja) 2007-11-08 2007-11-08 圧着装置及びフラットパネルディスプレイの製造装置

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JP (1) JP5159259B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101257570B1 (ko) 2010-04-26 2013-04-23 가부시키가이샤 히다치 하이테크놀로지즈 표시 패널 모듈 조립 장치
JP2011232696A (ja) * 2010-04-30 2011-11-17 Hitachi High-Technologies Corp Ｆｐｄの実装組立装置および実装組立方法
JP2012078955A (ja) * 2010-09-30 2012-04-19 Canon Inc 情報処理装置、その電源制御方法、及び電源制御プログラム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2827650B2 (ja) * 1992-01-14 1998-11-25 松下電器産業株式会社 熱圧着方法および圧着用部材
JPH0621152A (ja) * 1992-07-01 1994-01-28 Matsushita Electric Ind Co Ltd 狭ピッチリードデバイスのボンディング装置
JPH06120303A (ja) * 1992-09-30 1994-04-28 Nec Kansai Ltd インナリードボンダ
JP2982610B2 (ja) * 1994-04-26 1999-11-29 日立電子エンジニアリング株式会社 液晶セルのｔａｂ圧着装置
JP2000250063A (ja) * 1999-02-26 2000-09-14 Shibaura Mechatronics Corp 電子部品圧着装置
JP2007086655A (ja) * 2005-09-26 2007-04-05 Takatori Corp 液晶パネルへのｔａｂ部品の圧着方法及び装置
JP4664235B2 (ja) * 2006-03-30 2011-04-06 芝浦メカトロニクス株式会社 部品の熱圧着装置及び熱圧着方法

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Publication number Publication date
JP2009117704A (ja) 2009-05-28

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