JP5154285B2 - 弾性境界波機能素子 - Google Patents
弾性境界波機能素子 Download PDFInfo
- Publication number
- JP5154285B2 JP5154285B2 JP2008098723A JP2008098723A JP5154285B2 JP 5154285 B2 JP5154285 B2 JP 5154285B2 JP 2008098723 A JP2008098723 A JP 2008098723A JP 2008098723 A JP2008098723 A JP 2008098723A JP 5154285 B2 JP5154285 B2 JP 5154285B2
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- JP
- Japan
- Prior art keywords
- film
- thin film
- substrate
- aln
- sio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/0222—Details of interface-acoustic, boundary, pseudo-acoustic or Stonely wave devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008098723A JP5154285B2 (ja) | 2007-05-28 | 2008-03-09 | 弾性境界波機能素子 |
| US12/601,687 US8508101B2 (en) | 2007-05-28 | 2008-05-28 | Elastic boundary wave substrate and elastic boundary wave functional element using the substrate |
| PCT/JP2008/001329 WO2008146489A1 (ja) | 2007-05-28 | 2008-05-28 | 弾性境界波基板とその基板を用いた弾性境界波機能素子 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007166939 | 2007-05-28 | ||
| JP2007166939 | 2007-05-28 | ||
| JP2008098723A JP5154285B2 (ja) | 2007-05-28 | 2008-03-09 | 弾性境界波機能素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009010927A JP2009010927A (ja) | 2009-01-15 |
| JP2009010927A5 JP2009010927A5 (https=) | 2011-04-21 |
| JP5154285B2 true JP5154285B2 (ja) | 2013-02-27 |
Family
ID=40325493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008098723A Active JP5154285B2 (ja) | 2007-05-28 | 2008-03-09 | 弾性境界波機能素子 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8508101B2 (https=) |
| JP (1) | JP5154285B2 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009088730A (ja) * | 2007-09-28 | 2009-04-23 | Samsung Electronics Co Ltd | 弾性境界波装置 |
| CN102017407B (zh) | 2008-04-30 | 2014-03-19 | 株式会社村田制作所 | 弹性边界波装置 |
| JPWO2010116783A1 (ja) * | 2009-03-30 | 2012-10-18 | 株式会社村田製作所 | 弾性波装置 |
| JPWO2010122993A1 (ja) * | 2009-04-22 | 2012-10-25 | 株式会社村田製作所 | 弾性境界波装置及びその製造方法 |
| JP2011041127A (ja) * | 2009-08-17 | 2011-02-24 | Hitachi Media Electoronics Co Ltd | 弾性波装置 |
| DE102011119660B4 (de) * | 2011-11-29 | 2014-12-11 | Epcos Ag | Mikroakustisches Bauelement mit Wellenleiterschicht |
| US11673352B2 (en) * | 2016-09-20 | 2023-06-13 | United States Of America As Represented By The Administrator Of Nasa | Automated wave guide system for in-process monitoring of carbon fiber reinforced polymer (CFRP) composite laminates with hanning window tone-bursts of center frequencies from 100-225 kHz and 100-350 kHz |
| CN109891612A (zh) * | 2016-10-20 | 2019-06-14 | 天工方案公司 | 具有亚波长厚度的压电层的弹性波器件 |
| US12494766B2 (en) | 2022-03-02 | 2025-12-09 | Skyworks Solutions, Inc. | Acoustic wave device with interdigital transducer electrode having buffer layer |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5111100A (en) * | 1990-01-12 | 1992-05-05 | Clarion Co., Ltd. | Surface acoustic wave device and method for fabricating same |
| CN1143431C (zh) * | 1996-06-05 | 2004-03-24 | 三洋电机株式会社 | 弹性表面波元件 |
| WO1998052279A1 (fr) * | 1997-05-12 | 1998-11-19 | Hitachi, Ltd. | Dispositif a onde elastique |
| US7105980B2 (en) * | 2002-07-03 | 2006-09-12 | Sawtek, Inc. | Saw filter device and method employing normal temperature bonding for producing desirable filter production and performance characteristics |
| JP3815424B2 (ja) * | 2002-11-08 | 2006-08-30 | 株式会社村田製作所 | 弾性境界波装置 |
| KR100850861B1 (ko) * | 2004-01-19 | 2008-08-06 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성 경계파 장치 |
| KR100804407B1 (ko) * | 2004-03-29 | 2008-02-15 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성 경계파 장치의 제조방법 |
| CN1829082B (zh) * | 2005-03-04 | 2010-05-26 | 鸿富锦精密工业(深圳)有限公司 | 声表面波器件及多频移动电话 |
| JP2006279609A (ja) * | 2005-03-29 | 2006-10-12 | Fujitsu Media Device Kk | 弾性境界波素子、共振子およびラダー型フィルタ |
| WO2006114930A1 (ja) | 2005-04-25 | 2006-11-02 | Murata Manufacturing Co., Ltd. | 弾性境界波装置 |
| US7446453B1 (en) * | 2006-07-05 | 2008-11-04 | Triquint, Inc. | Surface acoustic wave devices using surface acoustic waves with strong piezoelectric coupling |
-
2008
- 2008-03-09 JP JP2008098723A patent/JP5154285B2/ja active Active
- 2008-05-28 US US12/601,687 patent/US8508101B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20100171389A1 (en) | 2010-07-08 |
| US8508101B2 (en) | 2013-08-13 |
| JP2009010927A (ja) | 2009-01-15 |
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