JP5153813B2 - Alignment equipment for vacuum deposition - Google Patents

Description

  The present invention relates to an alignment apparatus for vacuum deposition.

Conventionally, when a semiconductor substrate or the like is manufactured, a semiconductor material is evaporated in a vacuum vessel and is deposited on the surface of the substrate to form a predetermined conductor pattern.
When forming this conductor pattern, usually, a mask having a conductor pattern formed thereon is placed on the surface of the substrate, and a photoresist applied on the surface is exposed (for example, see Patent Document 1). ).

JP2003-157773

By the way, in the vacuum container, it is necessary to arrange the substrate at a predetermined position with respect to the mask, and an alignment device for this alignment is provided.
This alignment device will be placed in a vacuum vessel, but when an alignment device with high positioning accuracy is placed in the vacuum vessel, it requires special material parts, lubricants, heat dissipation measures, etc. that emit less gas. Therefore, the device itself becomes very expensive.

On the other hand, in order to avoid such a situation, it is conceivable to arrange the alignment device outside the vacuum vessel.
As described above, when the alignment device is arranged outside the vacuum vessel, a vacuum maintaining mechanism is required at the portion where the mask holding member of the alignment device is inserted into the vacuum vessel, and therefore a special sealing mechanism or processing is required. After all, the device becomes expensive.

Furthermore, the portion where the mask holding member is inserted into the vacuum container is subjected to a large external force due to the vacuum force, in other words, atmospheric pressure, which may cause distortion and lower the alignment accuracy.
Therefore, in order to solve the above-described problems, an object of the present invention is to provide an alignment apparatus for vacuum vapor deposition that can maintain positioning with high accuracy at a low manufacturing cost of the apparatus itself.

In order to solve the above problems, an alignment apparatus for vacuum vapor deposition according to claim 1 of the present invention provides a mask used when vapor deposition material is vapor-deposited in a predetermined pattern on the surface of a substrate held in a vacuum vessel. An alignment apparatus for positioning the substrate,
Above the mask held in the vacuum vessel, a substrate holding body held via a suspension member inserted through a through hole formed in the wall of the vacuum vessel,
A connecting plate provided outside the vacuum vessel and connected to the suspension member;
Position adjusting means capable of adjusting the position of the substrate in the vapor deposition chamber held by the holding body relative to the mask by moving the connecting plate;
A telescopic cylindrical blocking member that is fitted around the suspension member and is provided between the outer periphery of the through hole of the wall portion and the connecting plate, and blocks the vacuum side and the atmosphere side;
A side view standing on the wall body so as to straddle the connecting plate and the connecting plate is provided between the gate-shaped mounting frame and the inner side of the telescopic cylindrical blocking member. A pneumatic cylinder that generates an urging force equivalent to the pressing force to the connecting plate generated by the vacuum state in a direction opposite to the pressing force,
The position adjusting means can move the connecting plate in a plane parallel to the surface of the mask and can move and move the connecting plate in an axial direction perpendicular to the mask. Consisting of a vertical movement device,
Further, the in-plane moving device includes a driving support mechanism and a guide support mechanism provided on the wall body side of the vacuum vessel, and a moving plate supported by these support mechanisms and capable of moving in parallel with the mask surface. In addition, the moving plate and the connecting plate body can be allowed to move in the vertical direction via the lifting guide mechanism,
The elevating guide mechanism includes: a guide shaft standing on the movable plate; and a guide cylinder provided on the connecting plate body side and movably guiding the guide shaft in an axial direction perpendicular to the mask. It is composed.

The alignment apparatus for vacuum vapor deposition according to claim 2 is an alignment for positioning the substrate 5 with respect to a mask used when vapor deposition material is vapor deposited in a predetermined pattern on the surface of the substrate held in the vacuum vessel. A device,
Above the mask held in the vacuum vessel, a substrate holding body held via a suspension member inserted through a through hole formed in the wall of the vacuum vessel,
A connecting plate provided outside the vacuum vessel and connected to the suspension member;
Position adjusting means capable of adjusting the position of the substrate in the vapor deposition chamber held by the holding body relative to the mask by moving the connecting plate;
A telescopic cylindrical blocking member that is fitted around the suspension member and is provided between the outer periphery of the through hole of the wall portion and the connecting plate, and blocks the vacuum side and the atmosphere side;
An urging force equivalent to the pressing force applied to the connecting plate body, which is provided between the connecting plate body and the wall body portion and is generated when the inside of the telescopic cylindrical blocking member is in a vacuum state. A pneumatic cylinder that is generated in a direction opposite to the pressing force,
The position adjusting means can move the connecting plate in a plane parallel to the surface of the mask and can move and move the connecting plate in an axial direction perpendicular to the mask. Consisting of a vertical movement device,
Further, the in-plane moving device includes a driving support mechanism and a guide support mechanism provided on the wall body side of the vacuum vessel, and a moving plate supported by these support mechanisms and capable of moving in parallel with the mask surface. In addition, the moving plate and the connecting plate body can be allowed to move in the vertical direction via the lifting guide mechanism,
The elevating guide mechanism includes: a guide shaft standing on the movable plate; and a guide cylinder provided on the connecting plate body side and movably guiding the guide shaft in an axial direction perpendicular to the mask. It is composed.

  Furthermore, the vacuum deposition alignment apparatus according to claim 3 is configured to be capable of adjusting the biasing force by the pneumatic cylinder in the alignment apparatus according to claim 1 or 2.

  According to the configuration of each alignment apparatus for vacuum deposition, when aligning the substrate with respect to the mask under a predetermined vacuum, since the substrate alignment device is arranged outside the vacuum vessel, the material that takes vacuum into consideration It is not necessary to use a special sealing mechanism or the like, so that the manufacturing cost of the device itself can be reduced.

  In addition, since a pneumatic cylinder capable of applying an urging force that can be opposed to the pressing force caused by atmospheric pressure under vacuum is provided, it is possible to prevent an extra external force from acting on the alignment apparatus, and thus the position of the substrate relative to the mask. The alignment can be maintained with high accuracy.

It is sectional drawing which shows schematic structure of the vacuum evaporation system provided with the alignment apparatus which concerns on Embodiment 1 of this invention. It is a schematic perspective view of the substrate holder and mask in the alignment apparatus. It is a schematic perspective view of the alignment apparatus. It is sectional drawing of the alignment apparatus. It is a top view of the in-plane movement apparatus in the alignment apparatus, (a) shows the structure of an in-plane movement apparatus, (b)-(f) demonstrates the operation | movement. It is a top view explaining the alignment operation | movement of the board | substrate and mask in the alignment apparatus. It is sectional drawing of the alignment apparatus which concerns on Embodiment 2 of this invention.

An alignment apparatus for vacuum deposition according to an embodiment of the present invention will be described.
This vacuum deposition alignment apparatus is provided in a vacuum deposition apparatus. For example, when a display unit of an organic EL display is manufactured, an organic material is deposited on the surface of a glass substrate with a predetermined pattern using a mask to form a conductor pattern. In obtaining, the glass substrate is held and the position of the glass substrate relative to the mask is adjusted (alignment).
[Embodiment 1]
Hereinafter, the alignment apparatus for vacuum evaporation which concerns on Embodiment 1 is demonstrated based on FIGS.

  As shown in FIG. 1, this alignment apparatus 1 includes a mounting flange (a wall portion of a wall portion) on an upper wall portion 3a of a vacuum vessel 3 having a vapor deposition chamber 2 for depositing an organic material on the surface of a glass substrate under vacuum. 1a), which is an example. In addition, you may make it attach directly to the upper wall part provided over the whole upper surface of a vacuum vessel, without passing through a flange for attachment.

  An evaporation source 4 is disposed below the vapor deposition chamber 2 of the vacuum vessel 3, and a glass substrate (hereinafter referred to as a substrate) 5 is placed above the vapor deposition chamber 2 of the vacuum vessel 3 through the alignment device 1. A mask 6 for forming a predetermined conductor pattern is held by a mask holder 8 via an attachment frame 7 below the substrate 5. The side wall 3b of the vacuum vessel 3 is provided with a loading / unloading opening 9 for the substrate 5 and the mask 6. A robot hand (not shown) is used for loading and unloading the substrate 5 and the mask 6. Used.

  As shown in FIGS. 2 to 4, the alignment apparatus 1 is provided with a sheet-like electrostatic chuck portion 11 b capable of attracting the substrate 5 to a plate-like holder main body portion 11 a. The substrate holder (substrate holder) 11 is connected to the left and right two portions of the substrate holder 11 and the upper end is inserted through a through hole 1b formed in the mounting flange 1a. Two cylindrical suspension members 12 projecting to the outside, and provided on the outside of the vacuum vessel 3 so that the upper end portions of the two suspension members 12 and the upper end openings thereof open to the upper surface. For example, the connecting plate 13 having a rectangular shape in plan view, which is connected through, and the inside of the vapor deposition chamber 2 which is disposed on the upper surface of the mounting flange 1 a and is held by the substrate holder 11 by moving the connecting plate 13. The position of the substrate 5 relative to the mask 6 in FIG. Position adjusting means 14 that can be adjusted, and is provided between the outer periphery of the through hole 1b of the mounting flange 1a and the connecting plate body 13 and is fitted on each of the suspension members 12 to the vacuum side and the atmosphere. A telescopic cylindrical blocking member (for example, a vacuum bellows is used) 15 that cuts off the side, and a pressing force to the connecting plate 13 that is generated when the inside of the cylindrical blocking member 15 is in a vacuum state ( There is provided urging means 16 for generating (applying) urging force in the opposite direction to the urging force). The cylindrical blocking member 15 is connected to the mounting flange 1a side and the connecting plate body 13 side via a lower annular mounting seat 17 and an upper annular mounting seat 18 each having a predetermined inner diameter. A force (pressing force due to atmospheric pressure) due to vacuum acts on an opening area (contact area) of the attachment portion of the cylindrical blocking member 15 to the upper annular attachment seat 18 provided on the 1a side.

  The position adjusting means 14 translates, rotates (rotates about the center of the plate body) and turns (rotates about the center of the plate body) in a plane parallel to the surface of the mask 6. The in-plane moving device 21 that can be rotated around the position) and the vertical moving device 22 that can be moved in the vertical direction (axial direction) perpendicular to the mask 6 (also the surface of the connecting plate). ing.

  As shown in FIGS. 4 and 5, the in-plane moving device 21 includes a support plate 31 having a rectangular shape in plan view, and driving support mechanisms arranged at three positions among four corners on the support plate 31. 32 and a guide support mechanism 33 arranged at the remaining one place, and a moving plate 35 supported via a connecting tool 34 provided in each of the support mechanisms 32 and 33. The plate 35 and the connecting plate 13 are configured to allow movement in the vertical direction via the lifting guide mechanism 36 and to move (follow) movement in the horizontal plane.

  The drive support mechanism 32 is a well-known technique, and as shown in FIG. 5, the drive support mechanism 32 can move through a linear guide mechanism 37 in a horizontal plane, that is, in the XY axis direction. It can be forcibly moved along the axial direction (X-axis or Y-axis direction), and the guide support mechanism 33 can freely move in the XY-axis direction via a linear guide mechanism 39 similar to the above. It has been made to get.

  Of the three drive support mechanisms 32, two are arranged so that they can be forcibly moved in the same direction, and the remaining one is in a direction perpendicular to the two forcible movement directions. By moving the servo motor 38 in a predetermined (one, two, or three) driving support mechanisms 32 among these three, the moving plate 35 is moved to the X position. Axial direction (see FIG. 5B), Y-axis direction (see FIG. 5C), diagonal direction with respect to the X-axis and Y-axis (see FIG. 5D), and the center of the moving plate 35 are rotated. With the rotation direction as an axis (see FIG. 5 (e)) and with the turning direction for turning around the arbitrary support mechanism 32 side (see FIG. 5 (f)), the movable plate 35 can be moved freely in the horizontal plane. Can be moved in any direction and with any rotation or turning angle A.

  As shown in FIGS. 3 and 4, the elevating guide mechanism 36 includes a mounting plate 41 that is integrally formed on the upper surface of the moving plate 35 and has a rectangular shape in plan view, and the front and rear of the mounting plate 41 and at the left and right positions. It is composed of four guide shafts 42 that are erected and four guide cylinders 43 that are provided on the connecting plate 13 side and are externally fitted to the guide shafts 42 and are guided to be movable in the vertical direction. Has been. In the drawing, only the left and right guide shafts 42 and the guide cylinder 43 relating to the front part or the rear part are shown.

  An electric cylinder (driven by a servo motor) is used as the vertical moving device 22, and a rod part 22 a for exiting and retracting the electric cylinder is connected to the mounting plate 41. The substrate holder 11 is moved up and down through the connection plate 13 by moving the substrate 22 a back and forth, and the distance between the substrate 5 and the mask 6 is adjusted.

  The urging means 16 communicates with the vapor deposition chamber 2 through the through-hole 1b to cancel (or reduce) the pressing force due to the atmospheric pressure acting on the end face side in the cylindrical blocking member 15 that is in a vacuum state. belongs to.

  That is, the urging means 16 is provided at the left and right positions of the gate-shaped mounting frame 51 and the connecting plate body 13 in a side view standing on the mounting flange 1 a so as to straddle the connecting plate body 13. The pedestal 52 is provided, and a pneumatic cylinder 61 disposed between the pedestal 52 and the horizontal portion 51a of the mounting frame 51. The pneumatic cylinder 61 is, for example, a single rod type. In addition, an air supply pump 66 is connected to the air supply port 63 of the rod side cylinder chamber 62 through an air pipe 65 having a pressure regulator 64 in the middle.

  As shown in FIG. 4, a cylindrical member is used as the suspension member 12, and a passage (hole portion) connected to the communication hole 12 a in the suspension members 12 is provided in the substrate holder 11. 11c) is provided so that the substrate 5 can be cooled by supplying a cooling fluid such as water from the upper end opening of the suspension member 12, and from the upper end of these communication holes 12a. Electrical wiring to the electric chuck portion 11b is performed.

  Further, as shown in FIGS. 1 and 3, in order to align the substrate 5 with respect to the mask 6 held by the mask holder 8, that is, as shown in FIG. The CCD camera device 57 for positioning so that the dot-like substrate side mark M2 provided on the substrate 5 side enters the circular mask side mark M1 provided on the substrate is provided on the connecting plate 13 side. Of course, a viewing window 58 is provided on the mounting flange 1a side.

An operation of aligning the substrate 5 with respect to the mask 6 in the vacuum container 3 in the above configuration will be described.
First, as shown in FIG. 1, the substrate 5 is placed above the mask 6 held by the mask holder 8 from the loading / unloading opening 9 formed in the side wall 3 b of the vacuum vessel 3 using a robot hand. While inserting and holding the board | substrate 5 in the electrostatic chuck | zipper part 11b, a robot hand is taken out from the vacuum vessel 3, and the opening part 9 for carrying in / out is closed. When a mask or the like is carried into or out of the vacuum vessel 3, at least the carry-in / out opening (to be precise, the space connected to the carry-in / out opening 9) 9 is used. It is kept in the same vacuum level as the inside.

  When the inside of the vacuum container 3, that is, the inside of the vapor deposition chamber 2 is evacuated, the air supply pump 66 is operated to cause the pneumatic cylinder 61 to have a tensile force as an urging force that can be opposed to the pressing force by the vacuum. Generated. Therefore, no extra external force due to vacuum is applied to the connecting plate 13.

Next, the substrate 5 held by the substrate holder 11 is aligned with the mask 6 held in the vapor deposition chamber 2 by the mask holder 8.
For alignment of the substrate 5 with respect to the mask 6, two CCD camera devices 57 arranged on a diagonal line are used.

  That is, as shown in FIG. 6, the plane of the position adjusting means 14 is arranged so that the dot-like substrate side mark M2 provided on the substrate 5 side enters the circular mask side mark M1 provided on the mask 6 side. After the inner moving device 21 is driven, the substrate 5 is moved by the vertical moving device 22 so as to be almost in contact with the surface of the mask 6.

  When the alignment of the substrate 5 with respect to the mask 6 is completed, the evaporation source 4 is heated to adhere the vapor deposition material to the surface of the substrate 5 according to the pattern of the mask 6 to form a predetermined conductor pattern.

  When the predetermined conductor pattern is formed, after the substrate 5 is taken out from the loading / unloading opening 9 by the robot arm, the new substrate 5 is inserted into the vacuum vessel 3 and held on the substrate holder 11 and as described above. In addition, alignment may be performed to form a conductor pattern.

  As described above, when aligning the substrate 5 with respect to the mask 6 under a predetermined vacuum, the alignment device 1 for the substrate 5 is disposed outside the vacuum vessel 3, so that the configuration of the device itself is made inexpensive. be able to.

  Further, when the through hole 1b for guiding the suspension member 12 of the substrate 5 in the alignment apparatus 1 to the outside of the vacuum vessel 3 is formed, the cylindrical blocking member 15 for blocking the through hole 1b from the atmosphere side. Since the urging means 16 that can be opposed to the pressing force due to the atmospheric pressure under vacuum is provided on the opposite side of the attachment portion to the connecting plate 13, it is possible to prevent excessive external force from acting on the alignment device 1. Therefore, since no distortion occurs in the apparatus, the alignment of the substrate with respect to the mask can be performed with high accuracy.

More specifically, the following effects can be obtained.
1. Since the in-plane moving device 21 for moving the substrate 5 in the horizontal plane and the vertical moving device 22 for moving in the vertical direction are arranged outside the vacuum vessel 3 (under atmospheric pressure), special vacuum mechanical elements and motor cooling are provided. Since no apparatus is required, an inexpensive and highly accurate alignment apparatus can be provided.
2. Since each of the moving devices 21 and 22 is disposed outside the vacuum vessel 3 (under atmospheric pressure) and includes a biasing means 16 that can apply a biasing force that can be opposed to the pressing force acting under vacuum, Since the force which acts on each moving apparatus 21 and 22 which arises can be reduced, and what has small capacity | capacitance can be used as drive apparatuses, such as a motor in a moving apparatus, it can be set as a cheaper structure.
3. In addition, since each moving device 21, 22 is arranged outside the vacuum vessel 3 (under atmospheric pressure), and provided with a biasing means 16 that can apply a biasing force that can be opposed to the pressing force acting under vacuum, The distortion of the apparatus itself can be suppressed, and the visual field shift in the camera apparatus 57 for alignment of the substrate 5 can be prevented, so that highly accurate alignment can be performed.
4). Since the substrate 5 is held by the electrostatic chuck portion 11b, the flatness of the substrate 5 can be maintained, and therefore the distance from the mask 6 can be made very small. Alignment can be performed.
5. Further, since the substrate 5 is held by the electrostatic chuck portion 11b, the flatness of the substrate 5 can be maintained and the substrate 5 can be brought into contact with the mask 6 with a uniform surface pressure, and therefore, higher accuracy can be achieved. Alignment can be performed.
6). The communication holes 12a and the passages 11c are formed in the suspension member 12 and the holder main body 11a for supporting the substrate holder 11, and the communication holes 12a and the passages 11c are under atmospheric pressure. Cooling can be easily performed, and electrical wiring to the electrostatic chuck portion 11b can be easily performed.
[Embodiment 2]
Next, an alignment apparatus for vacuum vapor deposition according to Embodiment 2 will be described with reference to FIG.

  In the first embodiment, the pneumatic cylinder 61 as the urging means 16 is arranged between the connecting plate 13 and the mounting frame 51 having a gate shape in side view. Is arranged between the connecting plate 13 and the wall 1a.

  That is, as shown in FIG. 7, a pneumatic cylinder 61 is disposed between the connecting plate 13 and the mounting flange 1a so as to urge the connecting plate 13 upward from below. is there.

  Therefore, when the inside of the vapor deposition chamber 2 is evacuated, the air supply pump 66 is operated so that the pneumatic cylinder 61 generates a tensile force as an urging force that can oppose the pressing force by the vacuum. .

  In this case as well, the same effect as in the first embodiment can be obtained, and the magnitude of the tensile force that can be opposed to the pressing force can be adjusted by adjusting the air pressure supplied to the pneumatic cylinder 61.

According to this configuration, as shown in FIG. 7, the mounting frame and the pedestal portion are not required, and the apparatus can be made compact, lightweight, and the manufacturing cost can be reduced.
Here, the schematic configuration of the alignment apparatus according to the second embodiment is as follows.

That is, this vacuum deposition alignment apparatus is an alignment apparatus that positions the substrate with respect to a mask used when vapor deposition material is deposited in a predetermined pattern on the surface of the substrate held in the vacuum vessel,
Above the mask held in the vacuum vessel, a substrate holding body held via a suspension member inserted through a through hole formed in the wall of the vacuum vessel,
A connecting plate provided outside the vacuum vessel and connected to the suspension member;
Position adjusting means capable of adjusting the position of the substrate in the vapor deposition chamber held by the holding body relative to the mask by moving the connecting plate;
A telescopic cylindrical blocking member that is fitted around the suspension member and is provided between the outer periphery of the through hole of the wall portion and the connecting plate, and blocks the vacuum side and the atmosphere side;
An urging force equivalent to the pressing force applied to the connecting plate body, which is provided between the connecting plate body and the wall body portion and is generated when the inside of the telescopic cylindrical blocking member is in a vacuum state. A pneumatic cylinder that is generated in a direction opposite to the pressing force,
The position adjusting means can move the connecting plate in a plane parallel to the surface of the mask and can move and move the connecting plate in an axial direction perpendicular to the mask. Consisting of a vertical movement device,
Further, the in-plane moving device includes a driving support mechanism and a guide support mechanism provided on the wall body side of the vacuum vessel, and a moving plate supported by these support mechanisms and capable of moving in parallel with the mask surface. In addition, the moving plate and the connecting plate body can be allowed to move in the vertical direction via the lifting guide mechanism,
The elevating guide mechanism includes: a guide shaft standing on the movable plate; and a guide cylinder provided on the connecting plate body side and movably guiding the guide shaft in an axial direction perpendicular to the mask. It is composed.

  In addition, according to each embodiment mentioned above, about the pneumatic cylinder 61, it is between the base part 52 and the attachment frame 51 of the connection board 13, or between the connection board 13 and the attachment flange 1a. Although arranged, since the connecting plate 13 side can move at least in the horizontal direction, universal joints are interposed at both ends of the pneumatic cylinder 61. In FIG. 7, the cylinder body, which is the lower side of the pneumatic cylinder 61, is fixed to the mounting flange 1 a side, and a rolling ball (ball bearing) 67 is disposed at the tip of the rod portion, which is the upper side. You may make it the structure which only supports the board 13 for a connection from the lower side.

  By the way, in each embodiment mentioned above, although demonstrated as an alignment apparatus in the vacuum evaporation system which vapor-deposits organic EL material on a glass substrate, as a thing of course, it is limited to this organic EL material as an object of vacuum evaporation For example, when manufacturing a semiconductor device, any device for forming a conductor pattern on a substrate using a mask in a vacuum vessel can be applied to any vacuum deposition apparatus.

DESCRIPTION OF SYMBOLS 1 Alignment apparatus 1a Mounting flange 1b Through-hole 2 Deposition chamber 3 Vacuum container 5 Glass substrate 6 Mask 11 Substrate holder 12 Suspension member 12a Communication hole 13 Connecting plate 14 Position adjusting means 15 Cylindrical blocking member 16 Energizing means 18 Upper annular mounting seat 21 In-plane moving device 22 Vertical moving device 32 Driving support mechanism 33 Guide supporting mechanism 35 Moving plate 36 Lifting guide mechanism 42 Guide shaft 43 Guide cylinder 51 Mounting frame 61 Pneumatic cylinder

Claims (3)

An alignment apparatus for positioning the substrate with respect to a mask used when vapor deposition material is deposited in a predetermined pattern on the surface of the substrate held in a vacuum vessel,
Above the mask held in the vacuum vessel, a substrate holding body held via a suspension member inserted through a through hole formed in the wall of the vacuum vessel,
A connecting plate provided outside the vacuum vessel and connected to the suspension member;
Position adjusting means capable of adjusting the position of the substrate in the vapor deposition chamber held by the holding body relative to the mask by moving the connecting plate;
A telescopic cylindrical blocking member that is fitted around the suspension member and is provided between the outer periphery of the through hole of the wall portion and the connecting plate, and blocks the vacuum side and the atmosphere side;
A side view standing on the wall body so as to straddle the connecting plate and the connecting plate is provided between the gate-shaped mounting frame and the inner side of the telescopic cylindrical blocking member. A pneumatic cylinder that generates an urging force equivalent to the pressing force to the connecting plate generated by the vacuum state in a direction opposite to the pressing force,
The position adjusting means can move the connecting plate in a plane parallel to the surface of the mask and can move and move the connecting plate in an axial direction perpendicular to the mask. Consisting of a vertical movement device,
Further, the in-plane moving device includes a driving support mechanism and a guide support mechanism provided on the wall body side of the vacuum vessel, and a moving plate supported by these support mechanisms and capable of moving in parallel with the mask surface. In addition, the moving plate and the connecting plate body can be allowed to move in the vertical direction via the lifting guide mechanism,
The elevating guide mechanism includes: a guide shaft standing on the movable plate; and a guide cylinder provided on the connecting plate body side and movably guiding the guide shaft in an axial direction perpendicular to the mask. An alignment apparatus for vacuum deposition characterized by comprising. An alignment apparatus for positioning the substrate with respect to a mask used when vapor deposition material is deposited in a predetermined pattern on the surface of the substrate held in a vacuum vessel,
Above the mask held in the vacuum vessel, a substrate holding body held via a suspension member inserted through a through hole formed in the wall of the vacuum vessel,
A connecting plate provided outside the vacuum vessel and connected to the suspension member;
Position adjusting means capable of adjusting the position of the substrate in the vapor deposition chamber held by the holding body relative to the mask by moving the connecting plate;
A telescopic cylindrical blocking member that is fitted around the suspension member and is provided between the outer periphery of the through hole of the wall portion and the connecting plate, and blocks the vacuum side and the atmosphere side;
An urging force equivalent to the pressing force applied to the connecting plate body, which is provided between the connecting plate body and the wall body portion and is generated when the inside of the telescopic cylindrical blocking member is in a vacuum state. A pneumatic cylinder that is generated in a direction opposite to the pressing force,
The position adjusting means can move the connecting plate in a plane parallel to the surface of the mask and can move and move the connecting plate in an axial direction perpendicular to the mask. Consisting of a vertical movement device,
Further, the in-plane moving device includes a driving support mechanism and a guide support mechanism provided on the wall body side of the vacuum vessel, and a moving plate supported by these support mechanisms and capable of moving in parallel with the mask surface. In addition, the moving plate and the connecting plate body can be allowed to move in the vertical direction via the lifting guide mechanism,
The elevating guide mechanism includes: a guide shaft standing on the movable plate; and a guide cylinder provided on the connecting plate body side and movably guiding the guide shaft in an axial direction perpendicular to the mask. An alignment apparatus for vacuum deposition characterized by comprising. 3. The alignment apparatus for vacuum deposition according to claim 1, wherein the biasing force by the pneumatic cylinder is adjustable.

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